DFX基础知识丨PCBA面向产品生命周期各环节的设计 DFX：DFA/DFM/DFR/DFQ/DFT...

H/W/C

Comment

1.1

SMT

1.2

PTH

1.3

Assemble

1.4

Testing

1.5

Packing

1.6

Cost

2.0 DFM (Design for Manufacture) - SMT

H/W/C

Comment

2.1

Manufacture DCC

2.2

PCBA Process

2.3

PCBA Layout

2.4

Component Review

3.0 DFM (Design for Manufacture) -DIP

H/W/C

Comment

3.1

Cable

3.2

Connector

3.3

Incoming Material

3.4

Glue

3.5

Manual Soldering

3.6

LCM

3.7

PCBA Hieght

3.8

PCBA Layout

3.9

Housing

3.10

Housing and component assembling

3.11

Screw

3.12

Connector

3.12

Shield review

4.0 DFR (Design for Repair) 

H/W/C

Comment

4.1

Flash IC

4.2

Shielding Cover

4.3

Power

4.4

Tool

4.5

FW

4.6

Circuit Design Control Pin

4.7

Coverage

4.8

Circuit Design - Crystal

4.9

Circuit Design - Power Circuit

4.10

ESD

4.11

I^2C

4.12

FPY

4.13

LCM

5.0 DFQ (Design for Quality)

H/W/C

Comment

5.1

RoHS

5.2

OBA/CQA

5.3

Safty

5.4

Reliability

5.5

Cosmetic

5.6

Component

5.7

Process

5.8

FPY

6.0 DFT (Design for Testing)

H/W/C

Comment

6.1

Battery

6.2

Test Fixture

6.3

Layout of the testing point

6.4

Testing point placemenet

6.5

Testing point's diameter

6.6

Testing point sharp

6.7

The distance between testing points

6.8

Double Side requirement

6.9

PCB locoation fixed point

6.10

Testing equipment

6.11

Testing program

6.12

Document

6.13

FPY

Item

Desing for Assemble Requirements

1

PIE-SMT

双面制程的PCBA一面零件过少时,须要求改为单面板
When few components are used on one side of double-sided PCBA, the design must change to single-sided board

2

Panel置件C.T.应为40s左右
Panel component mounting cycle time should be approximately 40 seconds

3

炉后AOI是否与炉后目检合并
Are post-reflow AOI and visual inspection combined?

4

双面板的排板为阴阳板
Are "top" and "bottom" sides printed on both sides of double-sided PCBA?

5

PIE-PTH

 Shielding Cover设计为单件式
Shielding cover designed as one-piece component ?

6

产品要求裂片﹐而非铣刀锣孔
Depanel by V-cut/Pizza cut, instead of Router

7

要求固定Logo需要印刷在PCB上
Require to print specific logo (same spec.) on PCB

8

要求用其它Label取消HH Label
Require to use labels other than HH Label

9

取消ICT测试
Without ICT Test ?

10

没有GO/Nogo测试
Without go/nogo additional test station ?

11

产品不需要额外的点胶
Require additional glue process ?

12

没有SMT_TU站扫描
Without SMT_TU (touch up) checking station

13

shielding cover 材质优先使用洋白铜
Cu-Ni-Zn Alloy is the preferred shielding cover material

14

零件不允许有手工弯脚
Hand bending of component pins not allowed

15

散热片是否使用定位柱
Does heat sink have guide pin ?

16

PIE-ASSY

容易组装,不需要过多治具辅助﹐便于作业及cost down 成本
Easy assembling, Fixtures are not many.  

17

容易拆卸,不需要过多治具辅助﹐便于作业及cost down 成本
Easy dis-assembling, Fixtures are not many. 

18

螺丝孔的位置不要被阻碍
Headroom of screw hole should not be blocked

19

PCB不需要用螺丝单独将其上下盖固定,而是采用定于柱固定
PCB is fixed by housing's tabs/columns instead of screw(s).

20

螺丝尽量使用相近的转矩
Try to use similar torque for all screws if possible.

21

是否使用模块化生产,方便作业﹑cost down工时﹑节约人力
Modular process to save cycle time, man power ?

22

不需要手焊跳线﹐如有﹐需要求从设计上更改PCB线路
Does not require hand soldering of jump wire.  Require design change of PCB circuit if so.

23

PIE-Test

测试项目须最经济,工时最简化
Test items are minimized, Cycle time/Man power is also minimized.

24

所有Function Test完成后才进行组装,以免不良品回流时不易拆卸housing﹐造成物料报废
Assembly takes place after completion of all function tests to avoid complex dis-assembly of housing/chassis when reworking defects

25

T 阶没有测试,测试站全部在一阶,便于产品重工回流测试
No functional testing during PCBA Assenbly.  All tests are done at after PCBA assembly, so that rework unit can go through the test flow easily.

26

测试计算机/显示器是否一对多利用,可以节约机台
Use one test PC/Monitor instead many PC/Monitor to conserve resources

27

测试治具设计便于作业,是否导入自动测试治具,因手动治具测试浪费时间﹑人力
Test fixture is easy to use.  Use automated test fixture instead of manual one to save cycle time and man-power?

28

测试是否自动上抛SFIS,以防止漏测或刷错产品﹐及追溯测试记录
Information on test line is uploaded to SFIS automatically to avoid missing test items, incorrect product scanning, and to log test result.

29

PIE-Pack

Label没有贴在产品两面,以免不方便人员粘贴及检查
Labels do not exist on both sides of product, because it create complexity  on placing and inspection of labels.

30

Label粘贴位置与尺寸大小的匹配是否合理
Label location and size is appropriate.

31

Label的粘贴位置没有过于严苛的要求,避免不必要的对齐动作
Label location is appropriate where excessive label alignment is not required

32

同一面Label的字体方向要求粘贴一致
Direction of characters on labels should be consistent on same side of product

33

label没有盖住螺丝,以免拆卸时报废label
Label should not cover screw(s) to avoid damaging label when removing screws

34

附件为附件包形式
Accessories are packed in accessories bag

35

附件是否全部都有barcode可供扫描﹐避免附件有多放﹑漏放现象
All accessories have bar code for scanning to avoid extra or missing accessories

36

PE袋的尺寸是否与产品匹配,(以免尺寸过小装不进或过大浪费材料费用)
Size of PE bag is appropriate for product (not too small where it does not fit or too large and wasteful)

37

PE袋是否选用cost最低的材料(除客户特殊要求),材料cost降次顺序(静电袋/气泡袋/塑料薄膜袋),
Lowest cost material is used for PE bag (except when required by customer). Ranking of cost from highest to lowest is anti-static bag, bubble bag, plastic film bag)

38

商业包装﹐设计方式最优﹐(从优到劣顺序﹕1.为蛋壳设计﹐2.隔板要求与BOX连体﹐3.不需要多次折叠隔板)
Bulk packing is used ? (Ranking from best to worst: 1 egg shell design, 2. Partition board joins outer box, 3.Partitioning boards without multiple folding)

39

工业包装﹐是否为tray包装
Bulk packing is done by tray packing?

40

外盒/外箱的设计与产品的尺寸大小需匹配
 Size of outer box/carton matches product size 

41

缓冲包材设计是否选用cost最低的材料﹐材料cost从高到低顺序(防静电泡棉/纤维泡棉 /气泡垫)
Lowest cost material is used for design of cushion material, Material cost ranking of  from high to low: anti-static bubble, fiber bubble, air bubble. 

42

BOX 是否选用cost最低的材料﹐材料cost从高到低顺序( 彩色纸盒/ 白色纸盒/瓦楞纸盒)
Lowest cost material is selected for box.  Material cost ranking of  from high to low: color paper, white paper, corrugated paper.

43

BOX固定logo是否印刷在Box上,
Specific (same spec.) logo is printed on the box

44

装Carton时Box label均朝上方,减少check动作﹐节省工时
Box label(s) is upward, when placed into carton, for ease of checking and minimized labor hour

45

Carton 设计是否为最优化﹐利用空间,以降低包装及运输成本
Is design of carton optimized ?  Space utilization is efficient to minimize packing and shipping cost

46

Carton是否选用cost最低的材料,材料cost从高到低顺序(塑料箱/木箱/纸板/ 硬纸板箱/瓦楞纸箱),
Is carton material lowest cost? Material cost ranking of  from high to low: plastic, wood, paper, card board, and corrugated paper.

47

栈板尺寸要求最优化﹐能最大利用集装箱空间,以降低包装及运输成本
Pallet size is optimized for container space to maximize the pallet count and minimize packing and shipping cost.

48

栈板面积利用率达到标准(95%以上)﹐以降低包装及运输成本
Pallet surface utilization is larger than >95% to minimize packing and shipping cost

49

栈板要求是否选用cost最低的材料,材料cost从高到低顺序(塑胶栈板/胶合板/木栈板)
Pallet requirement suggested lowest cost material.  Material cost ranking of  from high to low: plastic, plywood, wood.

50

装栈板时所有carton label均朝外,便于扫描作业
Carton labels should face outward when filling up a pallet for ease of label scanning

51

栈板在集装箱内的摆放为达到空间最大利用率﹐降低包装及运输成本
Placement of pallets in container should be optimized for space utilization, minimize packing and shipping cost.

52

栈板在集装箱内的摆放方式方便叉车作业﹐减少动作浪费
Placement of pallets in container should be optimized for forklift operation, minimizing movement waste.

53

PIE-cost

SI线平衡超过90%
Balance of SI line exceeds 90%

54

线体布局合理,不需要专门的转板人力
Line layout is optimized ? no need for transfers of units.

55

MOH 合理(<3.5%)
MOH is less than <3.5%

Item

Desing for Assemble Requirements

1

制造文件

产品版本履历表正确
Product's version information is correct

2

BOM内有建PCB料号
BOM is with correct PCB P/N

3

SOP内有指定锡膏, 与用量
 SOP specifies Solder paste and usage  amount

4

BOM及零件置放位置图包含所有元件(含手摆)
All components (including hand-load parts) are included in BOM and component placement map

5

排板图及流板方向完整正确
Panelize map and flow direction are correct

6

PCB 公差定义正确.(捞孔:+/-0.25mm. V-Cut:+/-0.25mm)
PCB tolerance is correct. (Router:+/-0.25mm.V-Cut:+/-0.25mm)

7

PCBA Process

零件选用必须可100%过reflow,可机器贴装, 不可有手焊/手摆零件
SMT Component should meet requirement of reflow process;  No  Hand solder or hand load components.

8

零件Profile是否满足制程Profile要求(至少要审核peak温度﹐Reflow 温度及 Preheat温度三个参数)
Does Component spec meet process profile requirement.(At least check 3 parameters: peak temperature, reflow temperature and preheat temperature )

9

共享PAD设计不影响銲锡性
No solderability Impacts on Co-terminal pad

10

PCB上NP固定孔无绿漆油墨堵塞而影响上件
No solderability Impacts for solder mask on PCB NP fixed hole.

11

PCBA Layout

PCB 版本正确
PCB Version is correct

12

PCB mark点设计合理
Fiducial mark correctly placed. 

13

PCB 丝印清晰﹐大小合适
Silk screen is clear and with adequate font size

14

PCB有连板号﹐且未被遮挡
Panelize number is not  covered.

15

PCB 在轨道上搬送顺畅
PCB runs on conveyors smoothly

16

PCB Routing的位置和长度合理
The routing position and length of PCB are adequate.

17

PCB V-cut深度合理(PCB厚度>=1.2mm,中间V-cut t= 1/3 PCB厚度)
PCB V-Cut residue thickness is reasonable(PCB Thickness >= 1.2mm, The  residue thickness should be 1/3 of PCB thickness) 

18

零件距轨道传送边间距(Bottom>5mm,Top>4mm)
Component should be placed with distance( Bottom > 5mm, Top > 4mm) from PCB edge

19

铜箔距板边间距>0.5mm
Copper pad or circuit should be at least 0.5mm from PCB edge.

20

零件之间间距合理(参考零件间距表)
Space between components is OK.

21

PCB对应层残铜率差异<15%
Amount of Isolated area should less than 15%

22

PCB过炉后无板弯
No  post-reflow warpage

23

V-cut/ routing 应力小于 500ustrain
V-Cut/ Routing strain stress<500ustrain

24

PCB板上PAD旁via holes无因露铜或沾锡导致抢锡
Via holes beside the PAD will not snatch solder from pad during soldering because no solder mask.

25

化银板PCBA空PAD 需盖绿漆(除测试PAD)
All PADs should be covered with solder mask except those PADs for components and test purpose.

26

Via Hole塞孔盖绿漆(除测试点)
Blocked Via holes need to be covered with solder mask except for test points

27

BGA上的via hole 被塞孔时，不会导致抢锡、空焊
Blocked Via holes of BGA should not cause to snatch solder or open solder while soldering 

28

Via Hole未设计于裸铜与非裸铜区中间
Via holes should not appear in the middle of bare Cu and covered Cu

29

Via Hole塞孔设计时，孔径不大于16mil
The Diameter of blocked Via holes is less than 16mil

30

Via Hole边缘离PAD边缘至少8mil，且中间以绿漆隔开
Via hole should be at least 8mil far from PAD, and there should be solder mask between them.

31

Micro via成品孔径小于5mil
The diameter of Micro via is less than 5mil

32

ICT测试点与DIP/SMT零件Pad之距离至少保持1.0mm
The distance between DIP/SMT component pad and ICT TP is more than 1.0mm

33

高频测试点信号PAD之间距离大于0.7mm
RF TPs pads are distanced far than 0.7mm 

34

零件距金手指间距边缘大于4mm
Component pad should be 4mm far from gold finger border.

35

PCB金手指有导角设计
Fillet design is adopted on PCB gold finger

36

PCB金手指无防銲绿漆存在
No solder mask on gold finger.

37

Component review

无极性零件未被设计成有极性(如shielding cover的pin脚设计成非对称性)
Should not design with polarity for non-directional component( eg. The pins are designed with asymmetry on shielding can)

38

接触性零件有防flux /防爬锡设计
Touching components is with design to prevent Flux and extending solder

39

零件pin脚无因选材不当导致pin脚氧化,抗焊之现象
No components leads is dewetting or oxide due to improper material 

40

PCB定位孔比零件定位pin大0.3mm.
The diameter of PCB guide hole is 0.3mm bigger than component guide pin's

41

Connector pin与footprint搭配合理
The connector pin matches footprint.

42

Connector 有防爬锡设计
Design prevents extending solder to connector

43

Connector 过炉后无爬锡(过2次炉)
For Connector,  no extending solder at post reflow( the second reflow oven)

44

connector 接触区无爬锡现象
No extending solder on the plugging-in area of connector

45

Connector 距捞孔处有2mm间距以防粉尘
Connector should be  2mm from slot to prevent dust

46

pin in paste Connector孔的设计(孔比pin大0.3mm,伸出PCB0.5-0.8mm)
The width for hole in paste connector should be 0.3mm larger than that of pin.

47

pin in paste Connector ring的宽度8-12mil
The width for pin in paste connector ring is 8---12mil

48

shield frame&一件式shield 材质建议用洋白铜
Using copper-nickel as material of shield frame& one-piece shielding  is recommend.

49

shield frame&一件式shield 厚度≧0.2mm
The thickness of shield frame& single shielding should be no less than 0.2mm

50

shield frame 需最少有6*6mm吸着面积
The pick up area should be larger than 6*6mm for shield frame

51

定位孔边缘距外部pad至少保持0.65 mm
The edge of guide hole is  0.65mm far from nearest pad

52

Tooling pin采用2根非对称且导圆角设计﹐上端尺寸设计为0.7mm(或0.5mm),下端为0.3mm(导圆角R=0.25mm)
Tooling pin adopt 2 asymmetric and fillet design, upper dimension 0.7mm( or 0.5mm), Lower 0.3mm(fillet R=0.25MM)

53

四方形一件式shield可取消定位pin设计,但shield pad特殊设计且ME确认
Rectangle one-piece shielding can may be without guide pin, but shield pad need special design and need approval from ME.

54

一件式shield 需最少有4个直径为1mm的分布规则的孔
For one-piece shielding design, there should be at least 4 1mm diameter holes on top of shielding.

55

非Module设计时shield frame/cover外侧与零件pad≧0.5mm
Outside component pad should have a distance of o.5 mm at least from the outline of modular shield frame/cover.

56

Module设计时, shield frame/cover外部pad与板边至少1.0 mm
Outside component pad should have a distance of 1.0 mm at least from the outline of modular shield frame/cover.

57

shield frame/cover内部SMD零件与空PAD至少保持0.5 mm防止短路.
Inside of shielding can, SMD component should be placed at least 0.5 mm from bare pad to prevent solder bridge & short

58

零件pad距shield pad内侧间距最少16mil,且需考量二者的实际间距
The distance between component pad and inside edge of shielding pad should be at least 16 mil, and need consider the actual distance between them.

59

shield frame/cover pad 采用分段式设计,每4mm 长度以0.5mm 绿漆隔开
PAD of shield frame/cover should be a discontinuous design with  4mm PAD separated with 0.5mm solder mask.

60

shield frame/cover pad宽度最少为0.6mm
Pad width of shield frame/cover is no less than 0.6mm

61

shielding frame/cover 有明显方向标识(SMT或组装时不容易反向)﹐且有防呆设计(若方向不对则无法生产或很容易检出)。
There is directional mark for for shielding frame/cover to prevent mis-mount during SMT or assembly ), and is with error proof design

62

shield与其内零件无干涉﹐间距应≥0.4mm(中心值), 且理论最小间距应 ≥0.2mm(同一料号所有供应商均需Review)
Shield should not interfere with inside components, the distance between them should be larger than >= 0.4mm (mean value), and the minimum distance should be larger than >=0.2mm( All parts with the same P/N should be checked.)

63

transformer需有定位pin,且孔的直径比pin直径大0.3mm
Need guide pin for transformer, and the diameter of hole should be 0.3mm larger than that of guide pin.

64

transformer footprint 与 lead 匹配
Transformer's footprint should match with PADs on PCB.

Item

Desing for Assemble Requirements

1

Cable

确保cable 线的长度在组装时不会干涉其它零件
Ensure cable will not interfere with other components during assembly

2

 cable线需要有走向引导机制
Cable routing should have guidance mechanism

3

Connector

 Connector 必须要有shroud以防止pin脚偏移
Connector need have shroud to prevent pin bent

4

接口处有无防呆机制无法插反
Connector is fool-proof to prevent plug in  upside down.

5

Incoming

Housing 来料包装方式是否使用防刮伤措施(1.使用Tray包装. 2. Housing 外观采用保护薄膜)
Housing packaging is scratch-proof (1. tray is used,  2. protective film covering outside)

6

胶 (Glue)

胶的用量是否正确.(胶的用量称30pcs,取平均值,加上损耗5%)
Amount of glue used is appropriate (take the usage average for 30 pcs, plus 5% excess "wear and tear")

7

点胶高度不可与组装产生干涉
Glue applied should not  interfere with components

8

胶体是否符合制程要求并得到客户认可
Glue used should meet process requirement and get customer's authorization

9

点胶零件必须离金手指8mm, 离PCB板边3mm
Components requiring paste glue should be 8mm from golden finger and 3mm from PCB edge.

10

胶的特性是否符合环保要求
Glue  meets environmental requirements.

11

手焊制程 (manual soldering

是否没有手焊零件
No components needs hand soldering 

12

零件耐温规格是否符合手焊制程要求。
Component meets temperature requirement of hand soldering process.

13

零件脚pitch与PCB孔pitch是否匹配。
Component pin pitch matches PCB hole pitch

14

零件脚长度规格是否符合零件限高要求。
Length of component pins meets requirement of height limit 

15

手焊零件距离与其它零件距离是否大于1mm。
Distance between hand soldering component and other components must be not less than 1mm 

16

LCM

PCB的焊接点要有定位功能
Soldering points of PCB need to have the location or direction guidance

17

PCBA
 高度

TOP面最高零件高度是否符合限高要求。
Tallest component meet height limitation on the top side.

18

BOT面最高零件或零件脚是否符合限高要求。
Tallest component or component pins meet height limitation on the bottom side.

19

PCBA Layout

无极性零件未被设计成有极性(如shielding cover的pin脚设计成非对称性)
Non-polarity component should not be marked as a polarity component (such as shielding cover pins are asymmetric).

20

接触性零件是否有防flux /防爬锡设计
Contacting component prevents flux and excess soldering.

21

零件pin脚无因选材不当导致pin脚氧化,抗焊之现象
Component's pin should not be with oxidization, dewetting easily.

22

成型零件电阻/电容/LED是否使用Reel 包装
Components, resistance/inductance/LED, are packaged in reel .

23

零件成型后,是否有防倾斜功能
Component are built to avoid leaning

24

PCB螺丝孔大于4个时,螺丝孔仅留一孔为圆形孔定位, 其余为椭圆形, 椭圆形长经为圆孔加1mm
When there are more than 4 screw holes on a PCB,  only one hole can be round and act as guidance hole, others holes will be oval.  Longer diameter of the oval holes should be 1mm longer than diameter of round hole.

25

DIP 2pitch 电解电容ring 之间距离不可大于0.88mm
Distance between DIP 2pitch electrolytic capacitor ring cannot be > 0.88mm

26

ICT测试点与DIP/SMT零件Pad之距离至少保持1.0mm
Distance between ICT test point and SMT/DIP component pad is 1.0mm at least.

27

零件与螺丝孔之间间距是否大于2mm.
Distance between component and screw hole is larger than 2mm.

28

两PAD 间距小于0.7mm Connector 与功率晶体是否有加盗锡PAD.
Thieving PAD is added when the distance between two nearest PADs of connector or triode is < 0.7mm

29

大铜面零件, 每一层铜箔层Ring pad 是否为十字型设计. 或C型设计.
Ring pad for each layer is designed into X-shape or C-shape for components with large copper surface

30

轨道边的DIP零件距离与PCB板边不可小于3mm, 其它边的DIP零件PAD距离与PCB板边保持1mm.
Distance between DIP component near the conveyor and PCB edge must be larger than 3mm, distance between DIP component PAD near other PCB edges and PCB edges can maintain at 1mm.

31

板边零件与板边距离是否大于3mm
Component should keep 3mm far from PCB edge at least.

32

Label 是否黏贴在pcb TOP 面
Labels are placed on top side of PCB.

33

零件pin脚直径是否与pcb 孔相符合.
Diameter of DIP component pins matches PCB's hole size.

34

散热PAD离DIP零件距离是否大于5mm.
Distance between heatsink pad and DIP component is > 5mm.

35

手焊零件距离与label 距离是否大于10mm.
Distance between touch up location and label location is > 10mm.

36

排插零件PAD为though hole 是否使用椭圆孔
Oval hole design is used for range component of DIP.

37

高频测试点信号PAD之间距离是否大于0.7mm
Distance between high frequency PAD test points is > 0.7mm.

38

PTH Ring 小于0.8mm, PAD是否增加盗锡PAD
PAD has thieving PAD design when PTH ring is < 0.8mm

39

DIP件三面以上存在SMT零件距离必须大于5mm
If a DIP component is with SMT components mounted on 3 or more sides, the distance has to be > 5mm.

40

Pitch公差大于0.4mm之DIP件是否开设椭圆孔
Oval holes should be used for DIP components with tolerance > 0.4mm

41

DIP件Pitch﹑排距与PCB孔间距﹑排距是否匹配
PCB's pad and hole location for DIP matches DIP component. 

42

PCB 公差定义是否正确.(捞孔:+/-0.15mm. V-Cut:+/-0.25mm)
PCB tolerance is correct (hole:+/-0.15mm. V-Cut:+/-0.25mm)

43

Housing

PCBA组于Housing上是否有导向柱。
Guidepost is used for mounting PCBA  onto housing

44

建议机壳与面板背板选择不易刮伤的材质或使用保护膜局部保护
Suggest Housing/Panel should not use material and ink not easily scrapped or use protective film to protect the weaker areas.

45

Housing组装须考虑到是否可用卡勾是否利于减少组装动作。
Use of clips on housing assemblies to minimize assembly activities if possible.

46

尽量减少Housing锁螺丝的个数。
Minimun the total number of screws. 

47

Housing拆卸不会造成零﹑组件的报废。
Disassembly of housing will not cause component defects 

48

HOUSING 与各零部件组装

PCBA板的支撑点是否在同一平面上。
PCBA support points are at the same level . 

49

建议Housing的Boss与PCBA的零件在Boss径向距离不可大于2mm。
Sugggest the distance between housing's boss and PCBA components cannot be farther than 2mm from housing boss' radial distance.

50

建议Housing的Rib与PCBA上的零件距离是否大于2mm。
Sugget the distance between housing's rib and PCBA components is > 2mm.

51

建议Housing的导光柱与LED的距离大于1mm。
Sugget the distance between housing's lighting pipe and LED is > 1mm.

52

Housing的导光柱对正LED，无偏出LED本体的1/4。
Housing's lighting pipe is properly aligned with LED, with offset of less  than 1/4 the size of LED.

53

Housing的功能按钮机构与PCBA零件无干涉。
Function buttons do not interfere with PCBA components.

54

PE袋是否刮伤Housing
PE bag will cause scratch on housing?

55

天线不可贴在Housing 上
Better not to attach antenna on housing

56

Housing的卡勾与PCBA零件无干涉。
Housing clips do not interfere with PCBA components

57

Housing 组装后,上盖boss与下盖boss之间gap是否保持pcb板的厚度(中心值).
Gap between top cover boss and bottom cover boss is same as thickness of PCB (average value)

58

Housing 定位孔=定位柱+0.2mm.定位柱高度=PCB厚度-0.2mm for plastic cover.
Housing position locking hole = positioning column + 0.2mm.  Positioning column height = PCB thickness - 0.2mm for plastic cover.

59

Housing上BOSS之外径是否为螺丝直径的2~2.5倍。
External diameter of housing boss is 2 ~ 2.5 times the diameter of the screw.

60

机械螺丝与自攻螺丝锁入Boss 有效长度是否小至3牙。
Effective locking length of mechanical screw and self-tapping screw is more than 3 turns.. 

61

Housing 所有机构设计与SMT零件PAD距离是否保持1mm。
Gap between SMT component PAD and housing is maintained at 1mm.

62

SMT零件顶部距离与Housing Gap 距离至少保持1mm。
Gaps between the top of SMT components and housing is at least 1mm.

63

DIP零件顶部与侧面距离Housing Gap 至少保持1mm。
DIP components should keep at least 1mm from the top or side interior of Housing ( ≥1mm)。

64

Connector(DC Jack ,RJ45, RJ11, USB接口) 外凸不可超出Housing外缘 1mm。
Connector(DC Jack ,RJ45, RJ11, USB): protruding part can't go beyond Housing outer fringe  1mm 。

65

建议Housing与 Tact Switch距离为0.3~0.5 mm. 若按键与表面同面时采用0.3mm,若按键高于表面2mm时可采用0.5mm。
Suggest the space between Housing and Tact Switch should range  0.3~0.5 mm. If button and surface are on the same plane, then use 0.3mm or bulging button higher than  2mm should  use 5mm distance.

66

组装过程中上﹑下盖相对运动不会造成Housing上的Rib/BOSS/导光柱与PCBA上零件干涉。
During assembly process, moving the top and bottom cover of the shielding will not cause interference between the Rib/BOSS/lighting pip of the housing and the components on the PCBA.

67

Housing锁附后，产品无异响﹑PCBA板无晃动
After housing assembled, the product should not have unusual noise and the PCBA is not fixed.

68

Screws

建议螺丝种类不超过3种但客户指定如security screw不再此限
Suggest the kind of the screw do not exceed 3 kinds; Briefly , minimun the screw kinds but customer specified one is not in limit.

69

所有螺丝旋转方向须一致
All the screws must be design to have the same whirling direction.

70

螺丝公差配合合理(长度恰当﹐不可过长或过短.)
The screw must have appropriate fit tolerance(the length can't be too long or too short).

71

螺丝的硬度是否符合要求
Whether the hardness of the screw meets requirement.

72

螺丝孔3mm附近必须无零件以防止打螺丝时把零件损伤或撞损。
There must keep 3mm free space around the screw hole to prevent damaging components when assembling the screw. 

73

Connector

PCB 防焊无脱落或剥离问题，不会造成SMT锡垫锡量不足或短路现象
PCB solder mask does not brush off or peel off, and should not cause insufficient solder or solder bridge on PCB pad.

74

PCB上NP固定孔无绿漆油墨堵塞影响上件
No solderability Impacts for solder mask on PCB NP fixed hole.

75

PCB板PAD旁via holes无因露铜或沾锡导致抢锡
Via holes beside the PAD will not snatch solder from pad during soldering because no solder mask.

76

via hole 被塞孔时，不会导致抢锡、空焊
Blocked Via holes of BGA should not cause to snatch solder or open solder while soldering 

77

若为CM机种,review 所有DIP 零件耐温规格是否符合制程要求
All DIP material should meet process requirement.

78

Connector机构设计是否合理
Mechanical design of connector is checked.

79

Connector pin与footprint搭配是否合理
The connector pin matches footprint.

80

PCB金手指是否有导角设计
Fillet design is adopted on PCB gold finger

81

shield review

材质:Frame/cover皆使用洋白铜(不电镀)
Using copper-nickel as material of shield frame& one-piece shielding  is recommend.

82

Layout: frame/cover pad 长度:分段式设计,每4mm 长度以0.5mm 绿漆隔开
PAD of shield frame/cover should be a discontinuous design with  4mm PAD separated with 0.5mm solder mask.

83

Layout: 定位孔边缘外部至少保持0.65 mm的PAD.
The edge of guide hole is  0.65mm far from nearest pad

84

Layout: frame/cover内部至少保持0.3 mm的PAD.
Inside of shielding can, Component should be placed at least 0.3 mm from bare pad to prevent solder bridge & short

85

Layout: frame/cover内部SMD零件与空PAD至少保持0.5 mm防止短路.
Inside of shielding can, SMD component should be placed at least 0.5 mm from bare pad to prevent solder bridge & short

86

Shielding cover 内部零件不可与Shielding 产生干涉
Components in the shielding cover should not interfere with shielding 

87

Cover: 是否开散热孔
Venting holes on cover ?

88

Tooling pin是否采用2根非对称导圆角设计﹐上端尺寸设计为0.7mm,下端为0.5mm(导圆角R=0.25mm)
Tooling pin adopt 2 asymmetric and fillet design, upper dimension 0.7mm( or 0.5mm), Lower 0.3mm(fillet R=0.25MM)

89

Shielding Frame 或者 shielding cover 是否有明显方向标识(SMT或组装不容易反向)。  是否有防呆设计(即使方向不对无法生产或者很容易检出)。
There is directional mark for  shielding frame/cover to prevent mis-mount during SMT or assembly ), and is with error proof design

90

重点Review铁盖内零件与铁盖是否发生干涉﹐且铁盖内零件距铁盖间距应≥0.5mm(中心值), 并且理论最小间距应≥0.2mm(同一料号所有供应商均需Review)
Shield should not interfere with inside components, the distance between them should be larger than >= 0.4mm (mean value), and the minimum distance should be larger than >=0.2mm( All parts with the same P/N should be checked.)

Item

Desing for Assemble Requirements

1

Flash IC

IC可直接在板子上重烧
Can be reprogrammed on PWA directly

2

未集成在BGA中(并非为OTP=one-time programmable)
Not integrated in BGA 

3

Shielding Cover

Shielding Cover可打开上盖,便于维修
Shielding cover can be easily opened for repair

4

屏蔽盖下面的零件位置设计便于维修作业
Location of component(s) under shielding cover are easily accessible for repair

5

Power

输出电压必须要有明确标示
Output voltage is clearly marked

6

震动时adaptor与产品接触处不易断电
Connection/Contact between  adaptor and product is well and will not easily broken by vibration.

7

Fuse设计是否合理(用两种方法计算)
Fuse design is reasonable (calculated in two ways)

8

TOOL

维修时不需要特殊的工具
No special tools required for repair

9

FW

不同版本的FW是否有不同checksum值
Different checksum for different version firmware

10

烧码时间应该小于5分钟
Programming time should be less than 5 minutes

11

Circuit Design-Control pin

所有IC输出控制pin是否能被设定成高或低以允许测试时可以把产品关闭
IC output control pin is configurable so that one can shut down  product during testing.

12

如需要时是否可通过电阻调节电压高低来控制数位IC的输出信号
When in need, voltage can be controlled by adjusting resistor value to control digital IC output.

13

产品无因设计问题导致不易维修的地方
No repairing difficulty due to product design.

14

拆卸点胶BGA时不易导致PCBA报废
Dis-mount of glued BGA  should not damage the PCBA

15

Test coverage是否够(Critical component coverage 是否大于 80%)
Test coverage rate is good enough (Critical component coverage > 80%)

16

Coverage

无多余的参数需测试?(以相同或者类似机种参考)
No extra parameter to test (compared to identical or similar SKU(s)

17

The crystal loop design: whether the ｜-R︱≧5 ESR (晶振设计是否满足晶振最佳起振条件﹕｜-R︱≧5 ESR )
Oscillator design allows best condition to start the oscillator:    | -R | >= 5 ESR.

18

Circuit Design-Crystal

产品频偏Cpk必须大于1.33
Frequency Cpk must be greater than 1.33

19

是否可抵抗测试环境噪音(如马达运转时对电源的噪音),如果不可,是否有给出解决方案
Not impacted by noise from test environment (i.e. electrical noise of running motor).  If not, is there a solution?

20

Circuit Design-电源电路

输出电压未接近输入零件的电压规格上限
Circuit output voltage is not close to upper limit of component input voltage 

21

Switching IC (PWM频率一般在300K Hz左右)﹐未直接连Tuner输入pin (会对Tuner的IF信号(36M Hz)造成干扰),
Switching IC, with PWM frequency at approximately 300KHz, is not directly connected to tuner input pin (will interfere to tuner's 36MHz IF signal)

22

Regulator 的 Vout- Vin不能太大,以减少能耗.
Voltage difference of Vout and Vin of regulator cannot be too large in order to minimize energy consumption

23

USB ESD保护IC外围电路设计是否与零件标准应用电路匹配
Outer ESD protective circuit for USB should matches component's standard circuit application .

24

ESD

是否未使用ESD HBM< 100 V 之零件
Does not use component with ESD HBM < 100V

25

ESD HBM<300 V 之零件在SMT生产中是否有做管控? (如: reel 包装ESD 敏感元件需要加离子风枪)
Component with ESD HBM < 300V are specially controlled/managed (example: ESD sensitive components in reel need to add ion air gun).

26

PA&T/R SW 等ESD敏感元件是否加有保护
Protective circuit is added for ESD sensitive parts like PA&T/R SW 

27

SDRAM 的速率需大于CPU的速率(否则轻微出现测试不顺畅﹐严重出现测试fail)
Clock speed of SDRAM must be greater than CPU clock speed (otherwise it may impact the test yield).

28

I^2C

I^2C电路的PU or PD 电路是否合理
PU or PD circuit of I2C circuit meets spec ?

29

FPY

无设计问题影响良率
No design related Yield rate issue.

30

ETE直通率是否达标(> 90%)
ETE yield rate design more than 90%

31

LCM

LCM组装, 拆卸不会造成LCM与主板的接触性不良
Dis-assembly of LCM will not cause contact issue with main board

32

Inverter必须集成在LCM panel里
Inverter must be integrated in LCM panel.

Item

Desing for Assemble Requirements

1

ROHS

BOM中所有零件符合ROHS要求;
All components in BOM meet ROHS requirements

2

未使用新的副资材管控(会增加新的认証成本)
No new alternative components used (will increase cost of re-certification).

3

没有比ROHS标准更严格的要求(会增加新的认証成本)
No stricker standards/requirements than ROHS need to comply (will increase cost of re-certification)

4

OBA

是否拿到客户PRD
Customer's PRD released.

5

OBA测试工时在合理的范围内
OBA test cycle time is  reasonable 

6

新产品特性是否提供OBA测试程序并由SFIS cover
OBA test code provided for validating characteristics of new product and covered by SFIS

7

OBA测试无需转换模式(出厂模式转为工厂模式)
No need to adjust DUT's test mode for OBA test (such as: production mode vs. manufacturer mode)

8

产品测试时不可影响其测试治具的使用寿命
Product tesingt does not impact lifespan of test fixture

9

所测试port是为防呆设计,避免人员插错插反
Connecting Test port should be fool-proof to prevent incorrect insertion.

10

测试项目以及涵盖率合理
Test items and coverage is reasonable

11

全新的测试治具(板)是否提供 Golden Sample
Golden sample is provided for brand new test fixture/board

12

OBA 测试是否与客户测试或者最终用户使用之测试相同
OBA test is same as customer test or end-user test

13

天线头公母座搭配是否良好 
Male and female connectors of antenna is well matched

14

wifi throughput是否有列入到OBA测试
WIFI throughput is included in OBA test

15

全新技朮机种是否提供test plan
Test plan is provided for new SKU and new products.

16

OBA test Driver是否及时提供
OBA test driver will be released in time.

17

提供read EPPROM命令可以读出MAC﹐ F/W, SSID等信息
MAC, F/W, SSID, etc. can be extractable from product via test command for verification.

18

Safety

是否通过所出货地的相关认証(A400-->A500时)
Product is certified by destination country (A400 to A500)

19

测试/组装过程中作业员有被电击风险
There's risk of electrical shock during assembly/test process 

20

保险丝不易造成烧机
Fuse does not break easily and cause units failed. 

21

Reliability

ORT test plan 是否经过客户approve
ORT test plan has been approved by customer

22

机构设计可靠性测试是否pass
Chassis design passed reliability test 

23

包材可靠度测试是否可Pass
Packing material passed reliability test

24

Function(功能)可靠度测试是否可Pass
Product functions passed reliability test

25

Cosmetic

客户特殊要求是否可以做到
Meet customer's special requirement

26

客户特殊要求是否已导入到生产
Customer's special requirements is implemented.

27

IPC-A-610检验项目是否可执行
Inspection item IPC-A-610 is executable.

28

量产前完成Key parts IQC检验标准及SIP的制定。
IQC inspection criteria and SIP standards for key parts completed before mass production.

29

外观检验项目Cover是否全面﹐SOP是否定义清楚
Cosmetic inspection items coverage is comprehensive and  SOP is clearly defined.

30

Component

是否新机种key parts list定义
key parts list of new SKU is defined

31

完成新机种供应商制程确认
Completed new parts/vendor's process certification ?

32

量产前完成确认新机种key parts PPAP资料
Completed key parts' PPAP data for new SKU before mass production.

33

NPI阶段限量版的样品或限度样品确认
During NPI phase, limited component samples verified by IQC.

34

NPI阶段key parts进料是否经过IQC/SQE确认。
During NPI phase,  incoming key parts checked by IQC/SQE?

35

量产前完成Key parts IQC检验标准及SIP的制定。
IQC inspection criteria and SIP standards for key parts completed before mass production.

36

Cosmetic requirements are comfirmed (gap, surfaces, colors, paint, surfaces, etc.)外观检验标准的制定(间隙,表面处理,颜色,印刷等)
Cosmetic inspection criteria is defined and confirmed (gap, surface finish, color, print, etc.)

37

Process

Label的材质与碳带搭配是否合理
Label material works well with printer's ink. Not easy to scrap.

38

无因Label材质问题导致不良率超标
Label material quality should not cause yield rate unacceptable

39

FPY

Test Coverage Report 是否合理
Test coverage report is reasonable

40

良率是否可达到目标
Yield rate is achievable

Item

Desing for Assemble Requirements

1

 Battery

震动时不容易断电
Product does not easily suffer from power failure during vibration

2

使用Battery之产品 或者出货至客户端电源为 Battery之产品是否有明确定义,是否需要测试消耗电流 (standby电流, working电流)
If Battery is used for the product, Does it require to measure power consumption (measure DC current during standby and on mode)

3

Test fixture

Test fixture 应力 是否小于±400με(有特殊客户小于±225με)
Test fixture stress < ±400με (some customers' requirement is < ±225με)

4

测试点布局

原则上,每一个NET至少须留一个测试点,未布放ICT点之零件,须标明于制造文件中
Basically, One test point is for one NET at least.  Manufacturing document should indicate where which net is without TP.

5

如无法百分之百布放ICT测试点,则在功能测试未涵盖零件区优先布放测试点
If ICT does not have 100% coverage, then those nets are not under function test coverage should have higher priority for test point placement

6

功能测试之保护线路须优先布放测试点
Protective circuit for function test should have priority in test point placement.

7

测试点位置

铜箔露铜部份﹐测试点需喷锡
Test point on copper PAD should be sprayed with solder.

8

Through hole 若当测试点﹐不可盖绿漆
Through hole, if also used as a test point, shall not be covered by solder mask

9

测试点直径

测试点直径标准为30 mils,  最小直径为24 mils,
Standard diameter of test point shall be 30 mils, no smaller than 24 mils.

10

PAD接触性是否良好
PAD contact is good

11

测试点形状

测试点形状是否为圆形﹑正方形或菱形
Test point's PAD is either round, square, or diamond shaped. 

12

 测试点距离

测试点与点的间距最少为50mils
Test points are separated by minimum of 50 mils.

13

测试点边与零件的距离最少距离是1mm
Test point should keep away from nearest component for 1 mm at lease.

14

测试点应离板边或折边至少105mils
Test point shall be away from PCB edge for 105 mils at least.

15

DIP零件的空脚是否有可测试性(例如﹕孔径太大﹐PAD太小均不适合)否则须另拉测试点
Lead of DIP component can be used as a Test  Point ? (No, if hole diameter too large, PAD too small.)

16

 双面PCB需求

测试点尽量布局在同一面(因为双面治具成本加倍)
All test points shall be placed on same side of board (or test fixture cost will double if double sided)

17

若Through hole有盖油漆,须在Through hole旁加测试点
If Through hole is covered with solder mask, then test point shall be added next to the through hole.

18

PCB定位孔要求

定位孔直径最好为 3.175mm,其公差在+.002”/-.001”,其位置应在PCB之对角
Guide hole is better with diameter of 3.175mm with tolerance +.002”/-.001” and positioned diagonally across PCB.

19

每一大片PCB须有2个以上定位孔,且孔内不可沾锡
Each large PCB shall have minimum of 2 guide hole, and the holes shall not be stuffed with solder inside.

20

治具或设备

全新的测试治具(板)是否提供: Sample ﹑BOM﹑CAD file ﹑Gerber file﹑Schematics
New test fixtures/boards shall come with sample, BOM, CAD file, Gerber file, and schematics.

21

全新测试治具是否在系统中建立foxconn 料号
New test fixture has Foxconn part number in system

22

是否提供新产品的Golden Sample
Is Golden Sample released

23

是否提供主要测试设备List
Is test equipment list released

24

测试golden是否选用常用的产品
Is Golden Sample tested with common/frequently used products?

25

产品测试时无指定特别的测试PC(客户特别要求除外)
There's no special requirements for test PC (except for customer specified).

26

Connector 是否在PCB上预留测试点(至少预留烧码所需PIN点)
Are connectors reserved with test point on PCB? (at least, pins reserved for programming).

28

Coupling antenna 测试是否提供特别耦合的antenna并提供相关测试验証报告文件
Is special antenna provided for coupling antenna test? Are related  certification reports/documentation available?

29

测试软件

是否提供test tool﹑test program ﹑ SourceCode﹑test driver ﹑test item&spec 以及其它测试时需要的附加文件(f/w, Vxworks/sys file etc )(test program/SourceCode主要是原chip厂release的)
Are test tool, test program, source code, test driver, test item and spec, and other test documentations provided? (f/w, Vxworks/sys file, etc.) ( test program/source code released by original chip vendor).

30

自动test program 是否能够cover 每个test item&spec(原chip厂release 程序)
Can automatic test program cover every test item and spec (code released by original chip vendor)

31

测试程序是否能在自动和手动模式下操作(原chip厂release 程序)
Test code can be executed automatically and manually (code released by original chip vendor)

32

所有写的内容是否都有对应的command能够读出来double check
Programmed data can be read out for verification ?

33

所有测试command都需有返回值(字符串)
All test commands have return value (string of characters)

34

能否实现产品在线烧码
Support Programming inline ?

35

是否能通过指令来断开产品和计算机仪器的连接﹐减少产品突然断电导致自身变异
Test station can disconnect link between DUT and test Equipment by software command to minimize potential damages or failure caused by power unplug of DUT.

36

具有WI-FI功能产品测试时,default 状态下RF function 是否为关闭的
Default value of RF function is off for WI-FI product in function test.

37

测试程序是否可以cover 不同版本之F/W
Test code covers various firmware versions ?

38

产品开机启动时间是否做到最短
Product boot-up time is optimized

39

各测试站测试程序是否能自动上抛SFIS过站
Test station can communicate with SFIS for DUT's status check, update.

40

测试Fail产品程序能否发送SFIS系统自动打Fail
Failure status is updated to SFIS system automatically ? 

41

是否提供测试所需要的所有指令(参考附件SW command check list)
F/W supports all test commands needed by Test station(reference s/w command checklist)

42

文件 

提供产品的BOM﹑ Schematics (有ICT则需Gerber file ﹑CAD file)
Product BOM, schematics are provided (Gerber file and CAD file required if ICT is planned)

43

全新技朮机种是否提供test plan (包括test flow /test item&spec/calibrate方法 etc)
Test plan is provided for new SKU deployed with new technology (include test flow, test item and spec, calibration method, etc.)

44

是否提供 test coverage report
Test coverage report is provided

45

特殊产品测试是否提供测试环境校验方法
Test environment criteria is provided for test of special product 

46

产品实际test spec是否与制造文件定义相符
Test spec is in consistent with manufacturing document.

47

特殊golden是否提供校验方法
Special calibration/test procedure is documented for special golden sample ?

48

只有一阶的产品在测试站是否只SCAN一个label
Only one label will be scanned for one PCBA

49

FPY

重测率是否达标
Re-test rate meets target