SMT关键工艺丨PCBA制程能力评估和QPA审核-上篇

1

IQC及库房管理 

IQC and Warehouse

IQC/仓库

2

预加工工艺管控 

Pre-processing 

成型/烧录房

3

SMT工艺 

SMT Procedure

SMT

4

焊接工艺 

Welding Procedure

DIP插件波烽焊/补焊/压件

5

单板装配 

PCBA Assembly

组装

6

测试工艺

Testing Procedure

测试

7

维修工艺

Repair Procedure

维修

8

模块、整机装配 

Module/FAT Assembly

整机

9

包装

Packing Procedure

包装

10

过程质量管控 

Process Quality Control

NPI/不合格品管控

11

质量数据管控  

Quality Data Control

质量数据管控/条码追溯

12

IT

IT系统

13

ESD管理

ESD管理

得分说明
Score Explain

制程/系统不涉及。

The process/system is inapplicability 

0

未标准化：没有相关文件指导作业。

Non-standardization

1

标准化：现场作业有文件指导。

Standardization there is SOP to guide the operation

3

可视化：现场作业可视化改进； 

Visibility there is visibility tool to guide the operation improvement.
防错化：通过工具、方法优化实现效率提升/防呆。 

Foolproof there is foolproof tool to guide the efficiency improvement.

5

自动化：设备、信息自动执行。

Automation: The operation is done automatically.
数字化：工艺解决方案数字化或虚拟仿真。

Digital:Process solution is digital and virtul verification.
趋零化：通过业务/技术优化实现取消作业。

Elimination: The operation is canceled according to technology improvement.

Application Scenario

Class level

 Maximum
Score

Grade Criterion

Self Score
(NA-0-1-3-5)
自我评份

Customer Score
(NA-0-1-3-5)
客户评分

Comments / References
评论/引用

责任人

1.1

是否有流程文件对检验人员资质进行要求,明确规定培训科目、培训周期、实操并且严格按照培训文件要求进行？检验人员全部通过上岗考核,并有相关考核记录和培训记录？

Is there any qualification requirements for inspection person? Training lessons,training time,operation should be required and all the related reord should be remained？

General

Mandatory

3

1：检验人员的培训有流程要求、有培训计划、有定期执行等。Inspector training process requirements, training plan, a periodic execution, etc.
3：培训教材有定期刷新，对检验人员的资质有再次鉴定的机制。Training materials have refreshed periodically, qualification of inspection personnel again appraisal mechanism.

1.2

现场抽查检验人员对检验要求（抽样方案，检验标准及判定规则，特别是外观标准）是否熟悉？
Whether the inspector is familiar with inspect requirement(such as :sampling plan 、inspection standards、decision rule,especial Visual inspection )?

General

Mandatory

3

1：现场有作业指导书供员工查阅，或者员工知道在哪里获得指导书。The scene have work instructions for employees access to, or employees know where to get instruction.
3：检验人员对指导书要求熟悉，经抽查后与作业指导书一致无误。

Inspector familiar with instruction, after sampling the consistent with the work instruction and correct.

1.3

是否有QC检验设备（测量、试验等）、治工具（烙铁，电批，螺丝机辅助治具等）的定期检验校验规范，所有设备和治工具的校准状态都作了标识。现场QC检验设备、治工具都在有效期内？设备有点检、维护、保养记录？
All the QC instrument should be calibrated with cycle timie, all the tools and instrument should be marked. All the QC tools and instrument should be in effective date.

General

common

5

1：有相关文件中明确了检验设备的管理要求，并能够提供现场的点检、维护、保养记录。The relevant file has been clear about the management requirements of test equipment, and can provide on-site check, maintenance, maintenance record.
3：专人负责管理检验设备的点检、维护、保养。The specialist is responsible for managing the tally, maintenance, maintenance of test equipment.
5：IT系统自动触发检验设备的点检、维护、保养要求。IT automatically triggers responsible for counting, maintenance, maintenance of test equipment requirements.

1.4

检验与测试指导文件明确描述了检验的参数和可接受的公差，对抽样的频率、样本大小、验收准则作出明确的规定，对检验的缺陷分类方式方法进行了说明，并明确对不合格品如何处理。对电性能、功能及特性试验项目作出明确要求，包括：镜头、红外灯、电机、导电滑环、同步带等特殊检验设备（测量、试验等）。
The inspection and test sop have clear define inspection parameter 、tolerance、sampling frequency、sample size、acceptance criterion 、electrical property 、function and characteristic experiment item etc. Define the defective type and defecte handle process.

General

common

3

1：相关文件中明确检验相关要求。The specific inspection requirements in related files.
3：检验人员对指导书要求熟悉，经抽查后与作业指导书一致无误。Inspector familiar with instruction, after sampling the consistent with the work instruction and correct.

1.5

检验指导书详细定义了检验与测试的内容（如检验规范，资质，设备，方法，样品，限度样，治具）；根据流程文件及作业指导对来料进行检验，检验员手接触特殊物料时有使用手套；检验记录完备（品名、编码、批次、描述、数据、处理意见、检验日期、检验人员等）并规定合理保存时间。
WI should detaled include content of inspection and test. The operator wear gloves when handle the product, the inspection record should be kept.

General

common

3

1：相关文件中明确检验相关要求。The specific inspection requirements in related files.
3：检验人员熟悉检验要求并执行到位。Inspector familiar with the inspection requirements and implement in place.

1.6

IQC检验是否遵循抽样方案，抽样方案是否依据后工序（生产现场物料批量问题、客户投诉物料问题）状况进行抽样方案的动态调整？Whether the sampling plan have using to IQC? And the sampling plan  have adjusted dynamically by next procedure's quality performance.

General

Mandatory

3

1：相关文件中明确检验相关要求。The specific inspection requirements in related files.
3：检验人员熟悉检验要求并执行到位。Inspector familiar with the inspection requirements and implement in place.

1.7

对于来料检验不良品的处理是否有MRB流程支撑并遵守？
MRB procedure should be created for inspection incoming material.

General

Mandatory

3

1：有MRB或相关流程。Is there a MRB or related processes.
3：MRB的评审和执行依据流程进行。MRB review and execution according to the process.

1.8

IQC检验发现的物料问题是否按文件要求进行分层分级处理，是否反馈供应商进行改善并闭环管理？
Incoming material case should be handled grade-by-grade, it should feedback to supplier for improvement?

General

common

3

1：有质量问题分层分级处理流程或相关流程，按照流程执行。Is there a quality problem or hierarchical classification processing related processes, according to the process execution.
3：物料质量问题有渠道反馈给供应商，并且有相关的改善证据。Material quality problems have feedback to suppliers, and the improvement of the relevant evidence.

1.9

IQC对签样样品的管理是否规范，进料检验时是否与样品进行比对？针对外观标准定义"参照限度样品"是否有确认机制？
Is there any procedure for manage sample and be used correctly？Is there a confirmation mechanism for the definition of appearance standards "refer to the limit sample"?

General

common

3

1：有样品管理相关流程。Is there a sample management related processes.
3：样品管理相关流程的执行到位。sample execution of management process in place.

1.10

进货检验、过程检验及出厂检验等相关的数据记录均完整保存，文件经过整理归档，便于查询，清晰可用。
The record of IQC、IPQC、OQC should be remianed and easy for sorting and use.

General

common

3

1：有进货检验、过程检验等数据，记录以纸档的形式存在。Have incoming inspection, process inspection data, record exists in the form of paper files.
3：通过IT系统进行管理。IT system management.

1.11

各阶段检验发现的质量问题是否进行原因分析并制定改善措施，进行闭环管理，过程是否有IT系统支撑。
All the quality issue in IQC,IPQC,and FQC should be analyzed. The CAPA should closed with IT support.

General

Mandatory

3

1：检验过程中发现的质量问题有改善措施及闭环。Inspection found that quality problems in the process of improved measures and the closed loop.
3：有IT系统支撑。Have IT system to support.

1.12

对检验结果采用了统计技术，使用了多项统计分析工具进行分析，针对分析结果采取了改进措施。并有效跟踪改进措施的完成。
SPC method should be used in inspection method, improvement method should be used in analization.

General

Mandatory

3

1：检验结果有使用统计工具进行分析。Test results with the use of statistical tools for analysis.
3：统计工具使用无误，有效跟踪改善措施的完成。Statistical tools use correct, the completion of effective tracking improvement measures.

库房管理 Warehouse Management

2.1

如何确保仓库的温湿度管控符合要求？How to ensure the temperature and humidity of the storage area is fulfil the IPC requirements？
温湿度异常时有哪些有效处理措施（自动/人工）？What are the effective measures to deal with the abnormal temperature and humidity (automatic / manual)  ？

General

Mandatory

5

1：有温湿度管控要求，温湿度有表格记录且完整，异常有处理记录。Temperature and humidity control requirement, temperature and humidity had record form and complete, exception handling records
3：有温湿度监控系统且自动报警。Temperature and humidity monitoring system and automatic alarm.
5：温湿度监控系统能自动触发、调节仓库的温湿度在要求范围内。Temperature and humidity monitoring system can trigger automatically, adjust the temperature and humidity within the scope of the requirements of the warehouse.

2.2

如何保证存储设施满足物料的储存需求？How to ensure storage facilities fulfill the material storage demand？
存储设施如何管理，比如使用、维护等方面？How to manage storage facilities, such as 5S, use, maintenance, etc.?

General

common

1

1：物料存储设备、存储位置记录与实物一致，设施（货架、干燥箱、烘烤箱、冰箱等）保养维护记录完整。Material storage equipment, storage location, record is consistent with the physical, facilities complete the maintenance records.

2.3

如何保证辅料的储存条件是满足物料规格要求的？比如辅料存储条件说明（UV固化胶水要避光保存）、冰箱温湿度监控措施及记录、异常报警处理措施及记录等。315胶是否按照要求进行回温？  How to ensure the storage conditions fulfill the assistant materia's SPEC? such as accessories storage conditions, refrigerator temperature and humidity monitoring measures and records, abnormal alarm processing measures and records, etc..  

General

Mandatory

3

1：有相应管理文件。Have corresponding file management
3：温湿度例行巡检监控且有记录，存储容器粘贴适合存储的辅料清单或标识。Routine inspection to monitor and record.

2.4

如何确保物料的先进先出？How to ensure all the materials according to FIFO?

common

3

1：有先进先出管理要求及实施办法。物料包装上有明显入库时间标识，物料按入库时间顺序摆放等。Fifo management requirements and measures for its implementation
3：入库时间进行系统管控，按时间先后顺序设置系统防呆。Storage time for system control, according to set up the system of time sequence of the stay

2.5

如何保证超过有效期限的物料和产品被有效识别并不被再次使用？如何防止来料假货？Are methods for disposition of materials defined when out of shelf life found? how to control it reuse?

General

common

3

1：有物料有效期管理要求及实施办法。每盘/批次物料有明确的存储期限日期。检查有无超期物料被使用。The validity of the material management requirements and measures for its implementation
3：物料超期自动报警并锁定，禁止发放使用。Materials are automatic alarm and lock when  over due, prevent them to use.

2.6

如何确保分料过程使用的装载材料匹配物料的规格? 比如分料区域、包装方式（卷带式、tray盘式、杆式）、关键物料（有引脚IC物料、压接物料）等有效管理。What are methods for tape and tray to match materials SPEC when distribution? such as effective management of distribution zone, packaging mode (tape type, tray disc type, rod type), key materials (pin IC materials, press-fit materials).

General

common

3

1:现场检查没有用错TRAY盘、料盘规格。员工熟练掌握装载材料选用要求。Employees familiar with loading material selection requirements
3：装载材料上有编码标示。Loading materials has coding .

2.7

如何保证卷装物料等在分料、盘点、放置及包装的过程中防止物料引脚变形，不受污染？比如转盘时有没有交叉放置或堆叠，尾端卷曲有无固定、防变形措施等。How to control the pin distortion and pollution when distribution, take stock, placement and packaging for tape material?  For example, there is no cross placement and stack when placing the material disc, and the tail end of the coil is fixed and there is anti deformation measures.

General

common

1

1:有卷装等物料放置、分料、盘点操作管理要求，现场有可视化图片。Has a visual image in scene.

2.8

如何确认回收物料使用了正确的包装方式和包装要求？What are correct repacking for withdraw material？
如何确保退回仓库的物料与标签一致、满足ESD及潮敏要求、防止错料？How to ensure the return material in accord with the label fulfill ESD and humidity demands, prevent wrong material？

General

common

1

1：有退回仓库物料管理要求。Has reture material management requirement.

2.9

是否有针对再次包装的潮敏器件放置潮敏指示卡、干燥剂的要求？Are there some demands for Humidity Indicator Card (HIC) and desiccant when repack？

General

Mandatory

1

1：有相应要求且现场抽检符合要求。Has mangement requirement and Field sampling meets the requirements.

2.10

有无对真空包装机进行定期的点检,保养？如何确保密封性满足要求Are there some rules of inspect and maintain for Hermetic machine,how to ensure the sealed spec？

General

common

1

1：设备点检与保养记录完整，现场真空包装测试符合要求。Has Completely equipment check and maintenance records.

2.11

是否有相关镀银件的包装、贮存规范？是否镀银基板执行了真空包装？Is there the package&storage standard of the silvered part? Is the silvered base board  packed with the vacuum way?

General

common

1

1：有文件规范。Has document  rules.

2.12

需有华为专用整机仓库区域、并按照编码区域划分？Huawei dedicated FAT warehouse area must be provided and classified according to the code area?

Not applicable to new suppliers

Mandatory

1

2.13

如何保证操作人员满足要求上岗要求？how to ensure the operator fufill the post requirements？
（现场询问了解 Spot inquiry）

General

common

3

1：上岗证。Working certificate
3：扫描上岗。Scaning ID for system check.

Maximum Score

Actual Score

0

0

Score %

0.00%

0.00%

Application Scenario

Class level

 Maximum
Score

Grade Criterion

Self Score
(NA-0-1-3-5)

Customer  Score
(NA-0-1-3-5)

Comments / References

责任人

1.1

如何保证成型时不用错工装?
How to ensure the used mold tooling is correct?

General

Common

3

1.2

是否有成型应力风险评估机制？
Is there the risk evaluating mechanism to strain in the mold process?

General

Mandatory

1

1.3

成型工装验证项目是否包含物料成型后的引脚长度和可能产生的损伤符合规范要求?
In the verify item of the mold tooling,include the pins length and  possible damnification to components accord with the criterion?

General

Common

1

1.4

如何保证成型设备在使用时处于正常状态?
How to ensure the used mold machine is in good condition? 

General

Common

1

1.5

如何避免成型物料错混料？
How to ensure the molded components are not being confused?

General

Mandatory

3

1.6

如何保证物料成型过程中引脚不受污染?
How to ensure the components pins are not been polluted in the mold process?

General

Common

1

1.7

如何保证物料成型后在包装及周转过程中不受损伤?
How to ensure the molded components are not been damaged in the packing and turnover process?

General

Common

1

1.8

导热垫拆封后如何管控不错料？是否有文件规定各类导热垫的堆压极限层数、裁切及撕贴方法？
How to control good material after thermal pad opened?Whether there is a file regulation of various kinds of thermal conductive pad heap pressure limit layer, tile cutting and tearing method?

General

Common

N/A

1.9

如何保证超软导热垫使用要求（绝缘膜不能撕）？
How to ensure the ultra soft cushion use requirement of thermal conductivity (insulation membrane can't tear)?

General

Common

N/A

1.10

（能源产品）如何保证成物料的成型效果达到规格要求？有特殊成型要求的其工序安排是否合理？
How to ensure that the molding effect of materials meets the specification requirements? Is the process arrangement reasonable for special molding requirements?

General(Energy)

Common

N/A

1.11

（能源产品）如何保证散热器组件装配（散热器、导热介质、绝缘介质、MOS）满足要求？相似物料如何防止混料、错料？陶瓷片是否有开裂现象？
How to ensure that the heat sink assembly (heat sink, heat conducting medium, insulation medium, and MOS) meets the requirements? How to prevent mixed materials and wrong materials from similar materials? Is the ceramic piece cracked?

General(Energy)

Common

N/A

1.12

（能源产品）如何保证散热器组件装配工序中使用到的设备（电批）参数正确无误？
How to ensure that the parameters of the equipment (electric screwdriver) used in the assembly process of the heat sink assembly are correct?

General(Energy)

Common

N/A

1.13

（能源产品）如何保证功率管粘接工艺要求执行到位？（包括辅料、工装、设备、工艺等管控要求、粘接后检验要求）
How to ensure that the power pipe bonding process is in place? (Including control requirements for auxiliary materials, tooling, equipment, and process, and inspection requirements after adhesion)

General(Energy)

Common

N/A

1.14

（能源产品）如何保障器件套热缩套管满足要求？相似物料如何防止混料？器件超温。
How to ensure that the heat shrink tubing meets the requirements? How to prevent mixing of similar materials? The temperature of the component exceeds the upper threshold.

General(Energy)

Common

N/A

1.15

（能源产品）散热器组件如有元件或物料损坏，是否有明确的维修要求？
Are there any clear maintenance requirements for the components or materials of the heat sink components?

General(Energy)

Common

N/A

1.16

（能源产品）如何保证元件成型工序使用的工艺辅料正确使用？如导热垫、粘接膜、硅脂、陶瓷片、绝缘膜等。
How to ensure that the process auxiliary materials used in the component forming process are correctly used? Such as thermal pad, adhesive film, silicone, ceramic sheet, insulation film, etc.

General(Energy)

Common

N/A

软件烧录 Software Programming

2.1

是否有设备验收、操作、保养、日常点检、变更/升级指导书？是否具有相关的维护保养记录？
Are there equipment acceptance, operation, maintenance, daily spot-check, and change/upgrade guides? Is there any maintenance record?

General

common

3

2.2

操作员在现场是否能快捷且唯一的查询到相关指导书？
Whether the operators can find out WI as convenient as possible?

General

common

1

2.3

软件编码和版本是否有相应的操作管理规范（接收、使用、变更）?
Software coding and version if there is a corresponding operation management specification (receiving, use and change)?

General

Mandatory

3

2.4

如何检验烧录软件正确？
How to verify the software's validity?

General

Mandatory

3

2.5

操作员需经过培训且持证上岗？有专职工程师及技术人员处理现场异常？
Whether there are trainings for new operators？Does human arrangement of engineer and technician meet the requirement of testing abnormal treatment?

General

common

3

2.6

新芯片、新软件导入时是否有明确的烧录能力验证方法及检查标准？是否有相关保存记录？是否有ECA/ECO、临时技术更改等变更的执行流程？
Whterher have the clear verifying method or criterion for burning capacity according EMS burning device and component verify WI,and the operation record is save ok?

General

Mandatory

3

2.7

是否有措施保证每次生产使用的是正确的设备？是否可追溯到对应的烧录机台、烧录座？
Is there any measure to ensure that the correct equipment is used for each production? Can it be traced back to the corresponding burner or burner tools?

General

common

3

2.8

如何保证软件不漏烧？烧录现场的物料是否有相关的管控方法和措施？包括已加工和未加工物料标识、不良品和正常物料的隔离分类管控等。
How to ensure that the software does not leak to burn?The scene of the burning materials are related control methods and measures?Including identification has been processed and unprocessed materials, non-conforming material and normal isolation classification control, etc.

General

Mandatory

5

2.9

软件的存放是否是按服务器集中管理模式操作？是否每次加工之前都从服务器中获取测试需要的软件程序，并且加工完毕后在本地删除？软件放置服务器是否有权限管控？烧录程序设定是否有分层分级权限？
Software store is by server centralized management mode of operation?Whether every time before processing are retrieved from the server test need software program, and is processed locally after deleted?Software place servers have access controls?Burning program have a hierarchical classification authority? 

General

Mandatory

3

2.10

每次生产是否会确认加载软件的版本，是否有证据说明？
Does every WorkOrder check for software's the  version of each Program,is there any evidence to prove that?

General

common

1

2.11

在每批生产加工时, 有无针对是否有特殊要求检查确认?（比如EC/器件特殊设置位等）
Whether to make sure the special work instruction for every WorkOrder?

General

common

1

2.12

服务器中软件是否定期检查有无软件更改？
Whether the server  have process to check the software  modified or not regularly?

General

common

1

2.13

软件烧录区域是否隔离且有闭路电视监控？非工作人员进入烧录区域是否有登记？
Whether sofeware burning aera have separated and have CATV monitor?  Not worker cannot into inside only if have the register record.

General

common

3

2.14

烧录人员和检验人员是否分开？烧录文件和检验用的文件是否由不同人员制作管理并存放于不同的文件夹？Whether the operating responsibility have separate to the OP and insepector? Whether the operating SOP and inspecte SOP have separate to depoist , and write by different person?

General

common

1

2.15

烧录座等设备是否进行有效寿命管控？
Whether the burning base have the useful life control?

General

common

3

Maximum Score

Actual Score

0

0

Score %

0.00%

0.00%

Application Scenario

Class level

 Maximum
Score

Grade Criterion

Self Score
(NA-0-1-3-5)
自我评份

Customer Score
(NA-0-1-3-5)
客户评分

Comments / References
评论/引用

责任人

1.1

印刷程序编程是否有明确的输入来源（如单板长宽厚、MARK点坐标、进板角度）和命名规则（板名、板面）？
Is product information defined input sources（such as length、witdth、thickness、mark coordinates、transmission angle etc.)and naming rules(such as name, version & side)？

General

Common

3

1.2

是否有印刷参数（不同名牌和型号）设置规范（刮刀长度，刮刀压力，印刷速度，脱模速度，脱膜距离，印刷次数，印刷gap,擦拭方式，擦拭速度，擦拭频率等）？
Is there specification to set printing parameters （Including :pressure; printing speed; seperating speed;gaps;priting frequency ;cleaning mode ,cleaning speed ,cleaning frequency etc. ）？

General

Mandatory

1

1.3

如何保证不同复杂程度单板选择与之匹配的印刷参数？
How to ensure that the printing parameters meet to the technical specifications？

General

Common

3

1.4

印刷质量的检验标准（包括SPI或锡膏厚度测试仪或目检）是否对偏位、体积转移率、形状、检验频率和记录有要求，是否有SPC管控？离线锡膏送检测试频率是否有定义？
Printing quality inspection standards (including SPI or solder paste thickness tester or visual inspection) whether including shift、 volume transfer rate, shape, frequency and record of inspection; Is there a SPC control？

General

Mandatory

3

1.5

如何保证印刷机的设备能力满足不同产品工艺要求，如可加工PCB最小/最大尺寸，印刷精度，Cmk等？
是否有印刷设备稳定性Cmk定期分析和记录？
How to ensure the printing equipment capacity to meet the technological requirements of different products.Such as max or min PCB size, printing precision,Cmk etc.

General

Mandatory

1

1.6

是否有钢网设计规范和规则？是否有专门针对拼板或者大尺寸单板的钢网设计规则？
Is there the stencil design standard.
Is there a specific stencil design rules for large-size board or flatten board.

General

Common

1

1.7

如何保证钢网设计能满足宽厚比、面积比等工艺需求？
How to ensure the stencil design to meet the technology needs,such as the width to thickness ratio, area ratio？

General

Common

3

1.8

钢网生命周期（合格、报废、待验证、使用次数)如何被识别和记录？
How to identify and record the life cycle of the stencil (qualified, scrapped, to be verified, the use times) ？

General

Common

3

1.9

如何保证使用正确的钢网？新钢网如何进行验证管理，包括使用、替代、复制增加等？
Is there the fool proof for stencil use at stencil state and  the association of stencil to PCB？

General

Common

3

1.10

新钢网或旧钢网清洗后是否有开口精度、位置精度、毛刺、异物、少孔和张力检测等检验内容、方法和记录？如钢网AOI测试。
New stencil and post-clean stencil whether there is opening precision, position precision, burr, foreign bodies and tension testing etc inspection contents, methods and records. Such as stencil AOI aplication. 

General

Common

5

1.11

新钢网或旧钢网清洗后和上线前是否有钢网脱胶、开口变形、表面残留等外观不良检验内容、方法和记录？
New stencil and post-clean stencil if there is a stencil degumming, open area deformation, foreign bodies etc inspection contents, methods and records.

General

Common

1

1.12

设置支撑方式时是否有明确的规则和规范文件支持（是否有支撑工装设计规则，如顶针模板、一体化Block、Master等），如何保证每次加工的支撑的一致性，不干涉，顶针是完好、无脏污、不平等？
Is there clear rules for setting supporting way（such as support plate and support block）.
how to ensure the consistency of each processing support, non-interference, support tools are in good condition, no dirt and inequality.

General

Mandatory

3

1.13

清洗PCB是怎么操作（溶剂，次数，辅助工具，检查确认，清洗记录），如何保证ENIG、I-Ag、I-Sn、ENEPIG、HASL/LFHASL板在印刷过程中，锡膏重新印刷的次数不可超过2次。有无规定OSP单板误印时处理方法？
How to cleaning the PCB (solvent, times, auxiliary tools, check)
How to ensure that the print times of ENIG, I-Ag, I-Sn, ENEPIG, HASL / LFHASL PCB is not exceed 2  in the printing process, Is there the approach regulations when the OSP misprinted？ 

General

Common

1

1.14

如何确保印刷机环境温度和相对湿度符合锡膏规格？如印刷机自动调节温湿度。
How to ensure that the workshop temperature and relative humidity to meet the solder paste specifications？Such as  air conditioner in printer.

General

Common

5

1.15

如何确保锡膏型号使用正确（报废的/错误的/异常的锡膏不被生产使用），且回温后在有效时间内使用？
How to ensure to use the correct solder paste.
How to ensure that the solder paste is in the use time range？

General

Mandatory

3

1.16

如何保证锡膏的回温时间在4小时以上，室温条件下未开封锡膏回温次数不得超过两次？
How to ensure that the warming time of the solder paste  in more than four hours
How to ensure that the warming times of the unopened solder paste is no more than two.

General

Common

3

1.17

如何保证锡膏是搅拌充分的，如搅拌方式，时间、不刮瓶等要求?
How to ensure that the solder paste is stirred fully，such as stirring time amd method,don't scrape the bottle?  

General

Common

1

1.18

如何确保锡膏滚动直径在合理的范围内？如加锡记录或自动加锡。
How to ensure that the solder paste's roll height is in the reasonable range.

General

Common

5

1.19

印刷过程中超出刮刀印刷范围的锡膏是如何管控的
How to control the solder paste beyond the scope of the scraper during the printing process

General

Mandatory

3

1.20

如何保证锡膏的滚动时间没有超出8H？
How to ensure the solder paste's rolling time is not exceed 8H？

General

Common

1

1.21

如何保证实际刮刀压力与设置要求一致，是否有压力反馈系统、刮刀高度和刮刀压力校正？
How to ensure that the actual scraper pressure is agree to its set requirements.

General

Common

1

1.22

异常停机时如何管控印刷后的单板在2小时内完成回流？
How to ensure that printed boards to be completed reflow within 2 hours.

General

Common

1

1.23

如何保证PCB印刷前无异物影响印刷质量。是否有风刀、PCB清洁机等？
How to ensure that no foreign body before printing, Whether there is wind knife, PCB cleaning machine etc..  

General

Common

3

1.24

印刷机是否建立相关的保养维护机制？擦拭机构的有效（清洗剂喷涂，真空，胶条，顶起高度等）、夹片点检（变形、破损）、印刷高度、轨道平行度、Table平行度的校验（保证Gap为零）。
Is there printer maintenance rules? Such as cleaning effective(cleaner spray, vacuum, glue and lift up height etc.), clip inspection (deformation, breakage), printing height, rail parallelism, Table parallelism validation (ensure print Gap is zero).

General

Mandatory

1

1.25

印刷程序是如何分权限管理的，印刷程序变更是如何管理的？
how to management the printing program's permissions.
How to manage the printing process change.

General

Common

1

1.26

如何确保印刷程序调用正确？
 How to ensure to call the correct printing procedure 

General

Common

3

1.27

如何保证印刷前单板及工装温度不影响锡膏特性（BT面连续加工T面冷却充分，印刷回流一体化工装冷却充分）？
How to ensure that the board and tooling temperature before printing does not affect the solder paste feature? (The T surface of continuous processing on the BT surface is fully cooled, and the printing and reflow integrated tooling is fully cooled.)

General

Common

1

1.28

如何保证上岗人员满足岗位要求？
How to ensure the staff to meet the job requirements?  

General

Common

3

SPI

2.1

SPI 设备是否有定期GR&R 数据分析？
 Is GR&R analysis requirement for SPI machine?

General

Common

1

2.2

如何确保程序调用是正确的？
How to ensure that the program is correct? 

General

Common

3

2.3

是否有程序制作规范、调制指引和命名规则？
Is there guideline about program development？Is there guideline about program debugging？Is there program naming rule？

General

Common

1

2.4

如何保证误测率和检出率是否符合要求？
How to make sure false inspection and detection rate meet the requirement?

General

Mandatory

1

2.5

SPI 程序的使用、变更管控等是否有相关的规范？是否有正确钢网文件，钢网优化后SPI程序是否同步更新？
How to control the SPI program? Is there  correct and newest stencil file？

General

Common

1

2.6

SPI程序是如何分权限管理的？
How to management the SPI  program's permissions.

General

Common

1

2.7

SPI 程序测试LSL和USL 定义是否合理？有无数据支撑？
How to define the USL and LSL for SPI program? Any data support ?

General

Common

1

2.8

SPI测试异常时是否有处理流程或处理文件支撑？
 Is there any procedure when handling of exception for SPI machine.

General

Common

1

贴片 Component Placement

3.1

如何保证物料新厂家、供应商下发的变更、新编码等情况得到充分验证？
How to ensure validate the new supply、EC from supply、new part enough?

General

common

3

3.2

如何保证所有程序按照标准步骤编写？How to ensure all products programmed with standard process?
拼板的程序编制有无明确规则？Is there a process defined for matrix board programming?

General

common

3

3.3

对于配置有不同品牌贴片机的线体程序，如何保证按照规定的方式编写？
How to ensure programming to different placement machine manufacturer in same line?

General

common

1

3.4

如何保证器件模型尺寸的正确性？比如尺寸公差的正确性，同一编码的多个厂家器件尺寸存在差异时如何保证正常识别？How to ensure the parts size are correct? Such as the accuracy of dimensional tolerances and How to teach the vision to different supplyer parts with size difference?

General

common

3

3.5

如何保证器件角度定义的正确性？How to ensure the parts degree are defined correctly?
如何保证不同供应商器件角度被识别？How to ensure device angles be identified for different vendor ?  

General

common

3

3.6

如何保证器件库中贴片压力设置合理？贴片压力或行程如何控制以确保贴片时不会压碎器件？How to ensure the pressure of placement is appropriate?  How to control the pressure or travel of the patch to ensure that do not crush the component?

General

common

3

3.7

备料的操作步骤是否有明确定义？上料方向是否有明确规则？Is there a process define for component preparing?

General

common

1

3.8

如何保证Tray盘中物料摆放方向符合要求？How to ensure the components polarity are correct in tray?

General

common

3

3.9

如何保证Tray盘装进Tray盘架或设备的方向是正确的？How to ensure the tray loading correctly?
（现场询问，了解识别措施 Spot inquiry）

General

common

3

3.10

如何避免物料在穿料、摆放过程中不出现引脚变形？比如物料摆放位置是否正确，如何防止插错料？
How to avoid pin bend and warp in conponent preparing?  For example, the location of the material is correct？how to prevent inserting the wrong material?  

General

common

1

3.11

如何保证feeder的摆放顺序、型号、各站位物料编码与上料表一致？是否具有扫描防呆？How to ensure feeder lay out、feeder type、and part number is same as setup? Is there a scan to prevent errors?

General

Mandatory

5

3.12

如何保证调用的正确的程序？How to ensure program using correctly?

General

common

3

3.13

如何保证员工接料过程按照要求执行；How to ensure change reel flow according process?
（现场查看记录 check the records）

General

common

5

3.14

如何保证贴片设备的稳定性；How to ensure machine CMK?
（查看Cmk测试工具、方法及测试记录 Check the Cmk test tools, methods, and test records）

General

common

1

3.15

如何管控抛料率在管控要求之内；How to ensure component skip rate meet the specification?
如何管控单支feeder的抛料异常；How to control the individual feeder skip rate?

General

common

3

3.16

如何保证BGA缺球时被识别出来；
How to ensure ball recognition,to find ball missing?

General

common

1

3.17

如何保证零散物料使用按照要求操作，确保不发生混料、极性错误？如何保证被抛掉的物料被正确使用，包括物料编码、方向等管理？How to ensure scattered component are used flow the process, to avoid polarity wrong、component confusion?  Is there a label?

General

Mandatory

3

3.18

如何保证手加料按照对应的质量管控规则操作? 包括如何标记、检查、记录及控制等。How to ensure manual placing part execute recording to specification?  Including how to mark, check, record and control.  

General

common

3

3.19

如何保证剩余物料按照规定的要求处理；
How to ensure remaining component are managed as specification?

General

common

3

3.20

在线修改上料表如何保证料表、程序、物料的一致性；How to ensure setup、program、components are accordant when change setup online?

General

common

3

3.21

如何保证上下磁芯不贴反？
How to ensure that the upper and lower magnetic cores are not reversely connected?

General

common

NA

点胶 Dispensing

4.1

如何保证磁芯粘接胶水的使用要求正确，包括胶水型号选用、存储、使用要求。
How to ensure that the adhesive used on the magnetic core is correctly used, including the requirements for selecting, storing, and using glue models.

General(Energy)

common

NA

4.2

如何保证点胶种类与点胶机、点胶头正确匹配使用？
How to ensure that the dispensing type is matched with the dispenser and the dispensing head correctly?

General(Energy)

common

NA

4.3

如何保证落实抽测贴片后、回流前磁芯胶水面积铺展大于磁芯端面>80%的要求？
How to ensure that the glue area of the magnetic core before reflow is greater than the requirement of the end face >80% of the magnetic core?

General(Energy)

common

NA

磁芯研磨 Magnetic core grinding（能源产品）

5.1

如何保证自动研磨机的PCB支撑pin布置合理有效？
How to ensure that the PCB support pin layout of the automatic grinder is reasonable and effective?

General(Energy)

common

NA

5.2

如何保证落实磁芯研磨次数达到要求？
How to ensure that the number of grinding times of magnetic cores reaches the requirement?

General(Energy)

common

NA

感量测试 Sensing test（能源产品）

6.1

如何保证感量测试仪使用的规范性？
How to ensure the standardization of the use of the sensor tester?

General(Energy)

common

NA

6.2

如何保证感量测试操作满足要求？
How to ensure that the test operation meets the requirements?

General(Energy)

common

NA

回流 Reflow Soldering

7.1

回流参数制作，如何保证满足规范要求：包含预热区升温斜率、均温区时间、回流区温度及时间、冷却斜率是否满足规范要求？炉温曲线是否有测试记录？以上参数项炉温曲线中是否有定义？
Reflow parameters production, how to ensure that meet the requirements of the specification?
IT contains the preheating solpe, soke time, reflow temperatrue,reflow time,cooling slope,whether it meet the requirements specification? Is there a test record for the the temperature curve? Whether these parameters is included in the   temperature curve? 

General

Mandatory

1

7.2

回流参数制作，如何传递温敏器件信息？如何保证实测炉温要求执行到位？
Reflow parameters production, how to transfer the temperature sensing device information? 
How to ensure the temperature test requirement is performed?  

General

Mandatory

3

7.3

回流参数制作，如何传递氮气使用要求？如何保证执行到位？如何保证氮气残氧量满足要求，是否有监控方式（如闭环控制）？
Reflow parameters production, how to deliver nitrogen use requirements?  How to ensure the requirement is performed??  How to ensure the nitrogen residual oxygen content to meet the requirements, whether there are monitoring methods (such as closed loop control)?  

General

Common

NA

7.4

回流参数变更是否有记录？是否有定义什么情况下重测炉温？
Validation of the reflow parameters, whether there is validation process, whether there is a state division?  Is there a record of changes in the return parameters? What are the conditions defined by the test-retest temperature?  

General

Common

1

7.5

回流参数程序管理，是否有命名规则及保存管理规则？
Is there a naming rule and a storage management rule for the program management of reflow parameters?  Is there a version management?  

General

Common

1

7.6

回流参数是否有分层分级权限管理？回流参数新建修改是否可追溯?
Does the reflow parameter have hierarchical rights management?  If the change of the reflow parameters is traceability?

General

Common

3

7.7

如何保证调用正确的回流参数程序？
How to ensure that the correct reflow parameters are used?

General

Mandatory

3

7.8

如何保证轨道宽度满足要求，防止不掉板、不卡板？
How to ensure the track width meet the requirements, to prevent the board droped and jammed?  

General

Common

3

7.9

测温板制作,是否有测温点选点（最冷点最热点）规则？是否有定义热电偶固定方式，包含不同焊点及器件表面？
Temperature measurement board production, whether there is a rule of temperature measuring point selection(the coldest and hotest)?  Is there a way to define a thermocouple, which includes different solder joints and the surface of the device? 

General

Mandatory

1

7.10

测温热电偶是否有探头合格判断、阻值检测标准？
If there is a thermocouple probe, resistance detection qualified judgment standard?  

General

Common

1

7.11

测温板管理,是否有明确的管理规则，包含命名、入帐、存放、领用、归还？是否有测温板使用寿命管控及报废标准？
Temperature measurement board management, whether there is a clear management rules, including naming, recording, storage, use, return?  Is there a temperature measurement board service life control and scrap standards?  

General

Common

3

7.12

如何保证使用正确的回流工装，指导书是否有定义工装编号？如何保证上线使用的回流工装未变形，上线前是否有检查要求？
How to ensure the use of the correct reflow tooling, whether the guide book has a definition of tooling name and version?  How to ensure that the on-line use of the reflow tool is not deformed, on-line before the inspection requirements?  

General

Common

1

7.13

如何保证设备的加热稳定性？是否有定期监控和记录？
How to ensure the heating stability of equipment?  Is there a regular monitoring and recording?  

General

Mandatory

1

7.14

如何保证连续过板时的温度稳定性？是否有进板间隔定义，如何管控？
How to ensure the temperature stability of the continuous plate?  Is the definition of the interval between the board, how to control?  

General

Common

1

7.15

如何保证OSP板PCB开封到回流前时间管控符合要求？（12小时内，清洗板1小时内）
How to ensure that the time from open to reflow for the OSP board PCB is controled meet the requirements?   (within 12 hours, the washing board within 1 hours)  

General

Mandatory

3

AOI&AXI

8.1

是否有器件极性识别,立碑,缺件,连锡,开焊,少锡规则? 是否有AOI连续误报反馈确认机制?
Is there any component polarity identification, monument, missing parts, solder, open welding, less tin rules? Is there an AOI continuous false positive feedback confirmation mechanism?

General

Mandatory

3

8.2

是否有程序制作规范、调制指引和命名规则？
Is there guideline about program development？Is there guideline about program debugging？Is there program naming rule？

General

Common

3

8.3

测试策略是否包括了测试覆盖器件以及盲点器件？盲点如何管控？
Does the test strategy include test coverage and blind spot devices? Blind spot how to control?  

General

Common

1

8.4

X-RAY SMT检测内容、频率、检测记录及优化记录。
X-RAY inspect content,frequency,record and optimization record for SMT detection.

General

Mandatory

3

8.5

X-RAY 波峰检测内容、频率、检测记录及优化记录。
X-RAY inspect content,frequency,record and optimization record for Wave solder detection.

General

Mandatory

3

8.6

如何保证器件设定参数符合测试要求？
how to make sure a component setting parameter can meet inspection requirement?

General

Mandatory

1

8.7

如何保证测试设备稳定？
How to make sure the AOI is stable?

General

Common

1

8.8

如何保证调用正确测试程序？
How to make sure the program is applied accurately?

General

Common

3

8.9

如何管控漏测率？
How to make sure FPY and false inspection rate is optimal?

General

Mandatory

3

8.10

如何保证有效查询每块单板的测试结果？
how to make sure the inspection results are searched？

General

Common

1

8.11

（能源产品）如何保证落实炉后检验是否有磁芯胶溢出磁芯端面并进行清理的动作？
How to ensure that after the furnace check whether there is a magnetic core rubber overflow core end face and clean the action?

General(Energy)

Common

NA

Maximum Score

Actual Score

0

0

Score %

0.00%

0.00%

Application Scenario

Class level

 Maximum
Score

Grade Criterion

Self Score
(NA-0-1-3-5)
自我评份

Customer Score
(NA-0-1-3-5)
客户评分

Comments / References
评论/引用

责任人

1.1

是否有文件规定不同连接方式有对应的分板方式、有分板后外观质量要求（包括联接处凸起、粉尘等）、分板工装是否有防尘设计？
Is there a documented board-detached way? Is there a documented  the appearance quality requirements after board-deatched (including the connection at the bumps, dust, etc.)?

General

Common

1

1.2

如何保证分板过程中应力是符合要求的？有无刀具寿命管控？
How to ensure the strain meet the demand when rounter or V-cut? Is there tool life control?  

General

Common

3

1.3

如何保证分板时模块放置正确性？
How to ensure the correctness of module placement during board separation?

General

Common

1

1.4

(能源产品）对于多合一拼板加工的单板，如何规避分板后混料、错料现象？
How to avoid mixed materials and wrong materials after the board is split into multiple boards?

General(Energy)

Common

NA

插件 Manual

2.1

是否有插件应力风险评估机制？
Is there the risk evaluating mechanism to strain in the manual process?

General

Mandatory

1

2.2

如何保证插件过程中引脚不受污染?
How to ensure the components pins are not been polluted in the manual process?

General

Common

1

2.3

如何保证使用的单板及物料编码正确？
How to ensure the used PCBA and components code is correct?

General

Mandatory

3

2.4

如何保证插件不错件?How to ensure the used components is manualed in the correct position?

General

Mandatory

3

2.5

如何保证插件方向正确？如何保证内存条不跪脚？How to ensure the components are in the right direction?

General

Mandatory

5

2.6

如何保证散热器组件或需要工装扶正部件安装到位，焊接后不浮高？
How do ensure that the heat sink components are installed properly and the components are properly installed?

General

Mandatory

3

3.1

波峰参数制作，如何保证满足规范要求：助焊剂类型是否正确、助焊剂喷量如何标定、助焊剂参数如何设定？
指导书是否有明确定义？
Wave solder parameters production, how to ensure that meet the requirements of the specification:  If the flux type is correct?  How to calibrate the flux injection quantity? How to set the flux parameters?  Is there a clear definition on the guide book?  

General

Mandatory

3

3.2

波峰参数制作，如何保证满足规范要求：预热温度如何设置，如何满足规范对预热温度和时间的要求？
如何保证非焊接面峰值温度在规格内以避免SMT器件重熔？
Wave solder parameters production, how to ensure that meet the requirements of the specification:  How to set up the preheat temperature? How to meet the requirements of the specification for preheating temperature and time?  How to ensure that the peak temperature of the non welding surface is in the specification to avoid the SMT device remelting? 

General

Mandatory

3

3.3

波峰参数制作，如何保证满足规范要求：焊料类型是否正确、过锡时间如何设置、锡温如何设置？
指导书是否有明确定义？
Wave solder parameters production, how to ensure that meet the requirements of the specification:  If the solder bar is the correct type? How to set the solder time and temperature?  Is there a clear definition on the guide book?  

General

Mandatory

3

3.4

波峰参数制作，如何传递温敏器件信息？如何保证测温要求执行到位？炉温曲线是否有测试记录？
Wave solder parameters production,how to transfer temperature sensing device information? 
How to ensure the implementation of temperature measurement requirements in place? 
Does the temperature curve has a test record?  

General

Mandatory

3

3.5

波峰工装编码、过板方向是否有明确定义？
Wave solder parameter production, whether the wave tooling code version, the direction of the plate is clearly defined?  

General

Common

1

3.6

波峰参数验证，是否有验证流程？波峰参数变更是否有记录？
Wave solder parameter validation, whether there is validation process, whether there is a state to distinguish?  Is the wave solder parameter changed to be recorded?  

General

Common

3

3.7

波峰参数是否有分层分级权限管理？
Does the wave solder parameter have hierarchical rights management?

General

Common

1

3.8

如何保证调用正确的波峰参数程序？
How to ensure that the correct procedures for the wave solder parameters are called?

General

Mandatory

3

3.9

如何保证添加正确的助焊剂、锡条？
How to ensure the right flux and solder bar is used?

General

Common

3

3.10

如何避免设备上积累的助焊剂污染单板，抽风状态是否良好？
How to avoid pollution flux accumulated on board equipment, if the ventilation is in good condition?  

General

Common

3

3.11

如何保证波峰焊设备助焊剂喷量的稳定性和喷涂均匀性? 是否有定期监控？
How to ensure the stability of wave soldering equipment flux spray volume and spraying uniformity?  Is there a regular monitoring?

General

Mandatory

3

3.12

如何保证波峰焊设备的预热稳定性？是否有定期监控？
How to ensure the stability of wave soldering equipment? Is there a regular monitoring?  

General

Mandatory

3

3.13

如何保证参数设置锡波高度符合要求？锡波高度如何量测？锡槽液面高度如何管控？
How to ensure that the parameters are set to meet the requirements of the solder wave height? 
How to measure the height of the solder wave? How to control the solder tank level height?  

General

Mandatory

3

3.14

如何保证波峰焊设备的波峰平整度？如何保证波峰焊设备的锡温稳定性？
How to ensure the peak flatness of wave soldering equipment?  How to ensure the stability of solder temperature?

General

Common

1

3.15

如何保证焊锡成份在规定范围内？是否有送检报告及成份超标处理记录？
How to ensure that the solder composition in the specified range? 
Is there a process to record inspection report and exceed the standard ingredients?  

General

Mandatory

1

3.16

波峰夹具验证如何避免器件干涉？
How to avoid device interference when the wave tooling verification?  

General

Mandatory

3

3.17

如何避免工装变形导致助焊剂渗透腐蚀单板？How to avoid the tooling deformation in flux penetration corrosion veneer?

General

Common

1

3.18

如何保证波峰夹具清洗后溶剂不残留，及烘干效果？How to guarantee the wave jig no residues after cleaning solvent, and the drying effect?

General

Common

1

3.19

波峰焊接质量检测项目是否包含连锡/少锡/开焊/拉尖/包焊/锡珠锡渣/出脚长度/浮高等？
Whether the quality of wave soldering test project contains bridge、less solder、non-wetting、solder tip、package solder、solder ball、solder slag、foot length、float，etc...?

General

Common

1

3.20

如何保证波峰透锡高度质量？是否有明确的X-Ray测试机制？是否有测试记录？测试不良是否有优化记录？
How to ensure the solder quality in the through hole? 
Whether there is a clear mechanism for the X-Ray test? Is there a test record? Whether there is a record of optimization?  

General

Mandatory

3

3.21

如何保证OSP单板在规定时间内过完波峰? 要求SMT后24小时内过完波峰。
How to ensure that the OSP board is produced on the wave solder process in the specified time? 
Requires SMT within 24 hours after the end of the wave solder.  

General

Common

3

3.22

如何避免PCB污染？包含如何避免手指印、手套脏污管控、OSP铜绿变色？
How to avoid PCB pollution? Including how to avoid finger printing, dirty gloves control, OSP change color?  

General

Common

1

3.23

如何保证上岗人员（操作员、技术员）满足岗位要求？
How to ensure the staff (operators, technicians) to meet the job requirements?  

General

Common

3

3.24

(能源产品）如何保证大重单板不刮（锡）缸？
How to ensure that the heavy board is not scratched (tin)?

General(Energy)

Common

NA

3.25

(能源产品）如何防止大重单板在周转过程中变形导致应力损伤？
How to prevent stress damage caused by deformation of heavy boards during turnover?

General(Energy)

Common

NA

3.26

(能源产品）如何保证选波设备的喷嘴运行位置精度，防止撞件。
How to ensure the precision of the nozzle operation position of the wave selection device to prevent collision.

General(Energy)

Mandatory

NA

3.27

(能源产品）如何保证需特殊管控的焊接位置满足规格要求？如垂直度、高度、出脚长度等。
How to ensure that the soldering positions that require special control meet the specifications? Such as the vertical degree, height, and pin length.

General(Energy)

Common

NA

4.1

指导书是否有定义标准的焊接方法？是否有文件规定烙铁头选用标准？
Is there instruction defined standard welding methods? Is there a documented iron tip optional standards?

General

common

1

4.2

是否对上锡高度有检查要求？
Is there instructiong defined inspect standard solder vertical fill of hole?

General

Mandatory

3

4.3

焊接后器件外观是否符合要求？如何检验及识别虚焊风险？
Whether the componet appearance of compliance after manual soldering? How to check and identify cold solder risk?

General

common

1

4.4

如何保证烙铁头在正常状态下被使用？是否有烙铁放置架、除锡盒？海绵里是否有水？
How to ensure that the soldering tip is used in the normal state?  Whether there is iron rack and tin box for  waste tin? Is there water in the sponge?  

General

common

1

4.5

如何保证锡丝使用是正确的？
How to ensure that the tin wire used is correct? How to select the diameter of the solder wire, model and brand specifications?

General

Mandatory

5

4.6

如何保证烙铁温度设定是正确的？如何保证烙铁显示温度是准确的？有无定期校检？是否有文件规定有铅/无铅焊接烙铁设定温度？
How to ensure that the soldering iron temperature setting is correct? How to ensure the soldering temperature display is accurate? Is there regular school inspection? （现场查看记录 check the records）

General

common

3

4.7

如何保证锡珠能彻底清除而不发生二次污染？是否有毛刷更换标准、刷锡珠方法、清洁方法？如何保障刷锡珠结果满足外观检验标准？
 How to ensure the solder ball can be completely cleared and does not have  the second time pollution? Whether there is  the standard of brush replace, brushing method and cleaning method?  

General

common

3

4.8

刷锡珠过程中如何保证应力符合要求？
How to ensure the strain meet the demand when brush solder ball?

General

common

3

4.9

（能源产品）对于需要波峰焊后修剪出脚的情况，如何保证残屑不造成二次污染？具体管控措施。
How to ensure that the scraps do not cause secondary pollution when the pins need to be trimmed after wave soldering? Specific control measures.

General(Energy)

common

1

5.1

是否有规范定义压接件抬高,过压标准?如何保证压接件抬高,过压不超过标准?
Is there the criterion of press components raise and overpress?How to ensure the drive up or overpress is in the criterion?

General

Common

NA

5.2

如何保证高精密压接程序中上模、底模、PCB及连接器的关键尺寸的正确性？
How to ensure the key size is validity? such as :top module、bottom module 、PCB and connector.

General

Common

NA

5.3

高精密压接是否有压接曲线设置规则？是否有规范定义压接件对压接力,速度,行程的控制要求?如何保证压接件对压接力,速度,行程的控制满足规范要求?
Whether have the press profile setting rules?
Is there the criterion to define the control require for the pressure,speed and journey in the press process?Is there the mechanism to ensure the pressure,speed and journey in the press process meet the criterion?

General

Mandatory

NA

5.4

如何保证同品牌高精密压接机同一单板压接程序的一致性。
How to ensure press program consistence for different production line's same type press?

General

Common

NA

5.5

高精密压接机权限是否有分层分级管理?
Whether have management rule of equipment authority ?

General

Common

NA

5.6

如何保证压接件跪脚有效检出?
How to ensure the defect of genuflect  is been detected?

General

Common

NA

5.7

针对高精密压接机,如何保证转线时调用正确的程序?
How to ensure the pressure and journey setup is correct? To the high speed connection, how to ensure to choose the correct program when changing line?

General

Common

NA

5.8

针对非高精密压接机（TOX），如何保证转线时的压力行程设置正确？
How to ensure the pressure and journey setup is correct? 

General

Common

NA

5.9

压接过程中如何保证应力符合要求？底模支撑设计是否考虑单板所受应力？
How to ensure the strain meet the requirement of pressure?supporting design consider board's stress?

General

Mandatory

NA

5.10

是否有压接上模设计规则，是否上模压接高度归一、防止上模并排使用干涉、上模不同厂家兼容等设计要求？Whether have the  top module design standard? Top module pressure height unify,to avoid interfere when top module parallel press,and consider the compatible design for different vendor.

General

Common

NA

5.11

是否有压接上模与连接器件之间明确对应关系？高精密压接要有专用上模。Whether have the clear corresponding relationship between top module and connector?

General

Mandatory

NA

5.12

是否有底模、上模设计规范？
Whether have the  bottom module design standard？

General

Common

NA

5.13

压接工装是否有验收标准和验收流程？包括工装设计、变更、工装维修等业务。
Is there verify standard and to process to the mold tooling? Include mold tooling design ，changed or repaired.

General

Common

NA

5.14

压接工装验证项目是否包含关键尺寸的验收标准？
In the verify item of the press tooling,is there the acceptable standard to the critical dimension?

General

Common

NA

5.15

如何保证使用正确的压接工装？压接工装使用状态是否良好？
How to ensure the press tooling is correct and it's status is ok?

General

Common

NA

5.16

是否有高精密压接机压力和原点校正和记录，至少一年一次。
Whether have the   calibration mechanism of equipment's pressure and fiducial point? At least once a year.

General

Mandatory

NA

5.17

如何保证使用正确的压接物料、有明确物料标识、不混料、上料有扫描
How to ensure the press components code is correct?

General

Common

NA

5.18

压接位置不错件、压接方向正确？Pressure after location is good, take the right direction?

General

Common

NA

5.19

是否有明确的压接件维修方法、工具？压接孔维修次数不超过规范要求?
How to ensure the repair method to the press components is correct? Repair times of the press holes in the PCB meet the criterion

General

Common

NA

5.20

如何防护高精密物料引脚不变形？
How to protect the material's pin can't deformation?

General

Common

NA

工装管理 Tooling Management

6.1

新设计工装夹具，是否有明确的验证流程？是否有验证状态管理、验证记录？
The new design tooling fixture, whether there is a clear validation process?  Is there a validation status management, version management, and record?  

General

Mandatory

3

6.2

工装夹具变更或维修时，是否有流程规则？是否有验证状态管理、变更记录？
Is there a process rule for change or repair of tooling fixtures? Is there a validation status management, version management, and record?

General

Mandatory

3

6.3

不同类型工装夹具是否有定义不同的验证项目和标准？如何避免器件干涉(如工装Master工具等）？
Is there different validation projects and standards to the different type of tooling? 
How to avoid device interference?  How to ensure the implementation of the place?  

General

Common

3

6.4

不同类型工装夹具是否有定义不同的保养要求，包含保养周期、内容、工具、方法？是否有保养状态管理？
Is there different maintenance requirements to the different type of tooling, including maintenance cycle, content, tools, methods?  

General

Common

3

6.5

不同类型工装夹具是否有定义不同的报废标准？如何保证执行到位？
 Is there maintenance status management?  How to ensure the implementation of the place?  

General

Common

3

6.6

是否有明确的工装出入库管理规范？如何保证取用正确的工装？是否有工装状态检查？如何保证执行到位？
Is there a clear rule for the tooling storage management?How to ensure use the proper tooling? 
Is there a tooling status check?  How to ensure the implementation of the place?  

General

Common

3

6.7

如何保证镶嵌铝合金工装的周转、存储及管理满足要求？
How to ensure that the turnover, storage and management of inlaid aluminium alloy tooling meet the requirements?

General

Common

1

7.1

如何保证涂敷材料的使用、存储满足要求？包括新物料、在用物料、停机剩余物料等处理要求，最低加液量要求。
How to ensure that the use and storage of coated materials meet the requirements? Including the requirements for processing new materials, in-use materials, and remaining materials for suspension, and the minimum amount of liquid to be added.

General(Energy)

Common

NA

7.2

如何保证开始加工或恢复加工时喷嘴的喷涂流量满足要求？
How to ensure that the spray flow of the nozzle meets the requirement when the processing or recovery is started?

General(Energy)

Common

NA

7.3

如何保证需要涂敷的PCBA在有效的存储时间内？若超期如何保证经过烘烤处理？
How to ensure that the PCBA to be coated is within the valid storage period? How to ensure that the products have been baked when they expire?

General(Energy)

Common

NA

7.4

如何保证涂敷效果满足产品设计规格要求，包括材料使用、温度设置、涂敷区、禁涂区、保护区、外观检验标准等。How to ensure that the coating effect meets the product design specifications, including material usage, temperature setting, coating area, forbidden area, protection area, and cosmetic inspection standard?

General(Energy)

Common

NA

7.5

如何确保涂层厚度及一致性满足要求，是否有明确的涂敷厚度检验方法及间隔时间要求，是否记录在册？
How to ensure that the coating thickness and consistency meet the requirements, whether the coating thickness inspection method and interval are specified, and whether the coating is recorded in the volume?

General(Energy)

Common

NA

8.1

如何管控灌胶过程气泡引入风险？
How to control the risk of introducing bubbles in the filling process?

General(Energy)

Common

NA

8.2

胶水来料有进行哪些检验？检验参考的依据是什么？
What is the inspection of the adhesive materials? What is the basis of the inspection reference?

General(Energy)

Common

NA

8.3

胶水如何做到先进先出？
How to achieve the first in first out (FIFO)?

General(Energy)

Common

NA

8.4

胶水在加入设备前前是否有记录相关信息？如何防止过期胶水加入设备？
Does the glue record related information before it is added to the device? How to prevent expired glue from joining the device?

General(Energy)

Common

NA

8.5

胶水加入设备前是否有进行搅拌，是否有相关文件对搅拌过程进行要求，如何证明要求被执行？
Check whether the adhesive is stirred before the glue is added to the device, whether there are related documents for the stirring process, and how to prove that the requirement is executed？

General(Energy)

Common

NA

8.6

如何防止胶水中的大颗粒进入进入管道，造成管道堵塞？
How to prevent large particles in the glue from entering the pipe and causing the pipe to be blocked?

General(Energy)

Common

NA

8.7

管道出胶异常，是否有压力报警装置，装置是否防呆？
The pipe adhesive is abnormal. Is there a pressure alarm device? Is the device foolproof?

General(Energy)

Common

NA

8.8

每次加入设备的胶量是否有要求？生产中如何管控执行的？
Are there any requirements for the amount of glue that is added to the device? How to control and execute production?

General(Energy)

Common

NA

8.9

生产前、停机后需要对设备进行哪些处理才能开始灌胶，是否有文件进行要求？
Which of the following operations must be performed on the device before and after the production to start filling glue? Is there any file requirement?

General(Energy)

Common

NA

8.10

设备是否支持分级权限，防止人员误操作？
Does the device support hierarchical permissions to prevent misoperations?

General(Energy)

Common

NA

8.11

生产前是否有相关检测，确保AB 出胶量在范围内、出胶量、固化度符合要求？检验是否有文件支撑？如何证明要求有被执行？
Is there any related inspection before production to ensure that the adhesive volume of A and B is within the specified range, the adhesive volume, and the curing degree meet the requirements? Check whether there are documents for support. How to prove that the requirement is executed?

General(Energy)

Common

NA

8.12

生产过程是否有相关检测，确保AB 出胶量在范围内、出胶量、固化度符合要求？检验是否有文件支撑？如何证明要求有被执行？
Is the production process checked to ensure that the adhesive volume of A and B is within the specified range, the adhesive volume, and the curing degree meet the requirements? Check whether there are documents for support. How to prove that the requirement is executed?

General(Energy)

Common

NA

8.13

生产临停，是否有放置混胶口堵塞的措施，措施是否防呆？
Check whether there are measures for blocking the mixing mouth when the production is suspended and whether the measures are foolproof.

General(Energy)

Common

NA

8.14

如果出现灌胶不良，是否有措施可以进行范围精确追溯，进行风险段的产品隔离？
If the dispensing is poor, is there any measure to accurately trace the scope and isolate the products in the risk section?

General(Energy)

Common

NA

8.15

对于密封灌胶产品，是否有定期称重，确保模块内部胶量是足够的？
Check whether the sealant is regularly weighed to ensure that the internal glue of the module is sufficient？

General(Energy)

Common

NA