德邦科技(688035)在回复投资者提问时表示，华为公司是公司在集成电路封装领域和智能终端封装领域的重要合作伙伴之一。
撰文：李星
德邦科技(688035)在回复投资者提问时表示，华为公司是公司在集成电路封装领域和智能终端封装领域的重要合作伙伴之一，公司与客户签有保密协议，具体合作细节不便于公开披露。
德邦科技是行业电子级粘合剂和功能性薄膜材料的主要国产产业化供应商，主营高端电子封装材料研发及产业化，产品可实现结构粘接、导电、导热、绝缘、保护、电磁屏蔽等复合功能，其性能和质量直接决定了终端产品的性能表现和可靠性，并直接制约下游应用领域的发展，属于技术含量高、工艺难度大、知识密集型的产业环节，是晶圆加工、芯片级封装、功率器件封装、板级封装、模组及系统集成封装等不同应用领域不可或缺的关键材料。
目前已在半导体、智能终端、新能源等领域打破海外垄断，助力我国高端电子封装材料国产替代，具备参与国际产业分工、参与竞争的全面能力，是国内高端电子封装材料行业的先行者。
其中在集成电路封装材料领域，公司在晶圆UV膜材料、芯片固晶材料、导热界面材料等多领域持续批量出货。其中芯片固晶胶，可以适用于多种封装形式，覆盖MOS、QFN、QFP、BGA和存储器等，客户包括通富微电、华天科技、长电科技等国内集成电路封测企业。晶圆UV膜方面，目前在华天科技、长电科技、日月新等国内集成电路封测企业批量供货。
包括DAF膜已稳定批量出货、CDAF膜已通过国内部分客户验证、Lid框粘接材料已通过国内头部客户验证，获得小批量订单并实现出货；芯片级底部填充胶、芯片级导热界面材料部分型号获得关键客户验证通过，目前正在加快导入。
公司的智能终端封装材料已经被广泛运用在耳机、手机、Pad、笔记本电脑、智能手表、VR、AR、键盘、充电器等消费电子生态链产品，其中TWS耳机封装材料在国内外头部客户中取得较高的市场份额。
动力电池用双组分聚氨酯封装材料入选国家级制造业单项冠军，已经成为宁德时代、比亚迪、中创新航、国轩高科、蜂巢能源等众多动力电池头部企业的重要供应商，并持续保持稳定的、领先的市场份额。
光伏叠晶材料已经在通威股份、阿特斯、东方环晟等光伏组件领军企业中大规模应用并具备强大的竞争优势，市场份额位居前列。在HJT、TOPCon等新兴光伏电池技术领域，基于0BB技术公司研发的焊带固定材料已通过多个客户验证，实现稳定的批量供货，保持市场的领先地位。
而在高端装备行业及MRO领域，德邦科技有着20多年的经验和基础，积极拓展布局新能源汽车制造行业、轨道交通行业、工程机械行业、智慧家电行业、军工设备行业、电动工具行业以及冶金矿山行业等领域应用推广，产品类别涵盖聚氨酯、环氧、丙烯酸、硅胶以及多元杂化胶等所有化学体系产品。
高端电子封装材料不仅承担着粘合、密封、保护等传统角色，还需具备导电、导热、屏蔽、绝缘、防水和耐汗液等特殊功能。针对不同的应用领域：集成电路封装、智能终端封装、新能源动力电池封装、光伏电池封装等，产品需求各异，其核心技术主要集中于配方设计和复配，涉及基体树脂的选择与改性、填料的挑选与复配、表面处理以及助剂的选择与复配等方面。在这些元素间的精密配合技术及工艺混合技术是高端电子封装材料的核心竞争力所在。
华为目前正在通过Chiplet芯片堆叠+改进型7纳米芯片，再通过系统的设计和工程建设可以解决我们整体数字中心的能力、算力和分析能力问题，可以消除我们在芯片上的代差。
由于在芯片制程代差上的限制，所以Chiplet芯片堆叠和系统设计成为了华为目前主要的优化方向。Chiplet芯片堆叠需要大量的电子封装与电子散热材料，来实现芯片间的联结与散热，因此研发性能更优的电子封装材料也是华为与供应商间的主要议题。
旭日大数据助力全球半导体产业链布局越南
深圳旭日大数据长期服务全球的电子制造业企业，曾推动过中国电子制造业五次产业转移。包括前期从深、莞、惠转移到广东河源、清远腹地；从珠三角转移到江西、湖南、湖北中部地区；从珠三角、长三角转移到重庆、四川等西方地区；从中国大陆转移到印度等。
2018年以后中美贸易摩擦、中印商贸关掉以后，旭日大数据受国产品牌终端厂商的委托，开始调研东盟市场接受中国电子制造业转移的市场机会与风险，其中越南由于有三星、苹果供应链的成功在先，成为中国电子制造业优先考虑的目的地。
不过这第五次产业转移与前几次的产业转移有着巨大的不同，旭日大数据发现越南市场甚至整个东盟市场的独立性与特殊性，注定了投资越南和东盟制造业，机会更大、回报更高的同时，也要付出更多的资本与更大的努力。
近期越南政府总理范明政刚签发了关于颁布越南半导体产业发展战略（近期至2030年和远期展望至2050年）的第1018号决定（1018/QĐ-TTg）。
其中第一阶段（2024年-2030年）：利用地缘优势、半导体产业人力资源优势，有选择地吸引外商直接投资（FDI），发展成为全球半导体人力资源中心之一，形成半导体产业从研究、设计、生产、封装和测试等各阶段的基础能力。
目标为选择性吸引FDI投资，组建至少100家设计企业、1家小型半导体芯片制造工厂和10家半导体产品封装测试工厂；，开发多个行业的专用半导体产品；越南半导体产业年均收入达250亿美元以上，增加值达到10-15%，电子产业年均收入达2250亿美元以上，增加值达到10-15%；越南半导体产业人力资源规模达到5万名工程师和大学毕业生以上，结构和数量适当，满足发展需求。
为了推动越南半导体产业发展，同时为中资、台资企业进入越南市场提供舞台，旭日大数据、越南智造在众多半导体封测产业链厂商的建议下，与越南政商界一起，于2024年10月31日-11月02日，在越南胡志明SECC国际会展中心举办SEMICON VIETNAM 2024（2024越南国际集成电路及半导体产业展览会）Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor Industry。
这是全球半导体产业界首次在越南举办大型半导体专业展，以产业转移浪潮对标越南全球性供应链、越南半导体及电路板发展商机衔接展、半导体供应链出海推广营销展贸平台、中越两国半导体及电路板外贸撮合、后十年越南电子业国家重点贸促活动为目标，给全球半导体企业进入越南市场提供最新的投资越南资讯，打造的专业展会、商贸、论坛服务平台。
(一)预设规模
150+参展商、250+展位、10000+专业观众、6+国家参展、10+越南交易团；
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组织机构
支持指导：越南工贸部、越南科技部、越南胡志明市人民委员会
协办单位：越南科学院技术应用中心、越南百科大学、越南光中软件园、韩国光学工业发展协会、深圳市高科技企业协同创新促进会、旭日大数据
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◆ 参展报名截止：展前60天以上，展位先定先安排；
◆ 展务资料备索:《招展函》/《展位图》/《参展申请表》/《赞助方案》/《出展行程单》等。
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2024越南国际集成电路及半导体产业展览会
Deppon Technology Chip Packaging Materials cooperates with Huawei
Editor: Lucien
In response to investors' questions, Deppon Technology (688035) said that Huawei is one of the company's important partners in the field of integrated circuit packaging and intelligent terminal packaging, and the company has signed confidentiality agreements with customers, and the specific details of the cooperation are not convenient for public disclosure.
Debang Technology is the industry's electronic grade adhesive and functional film materials of the main domestic industrialization suppliers, mainly engaged in high-end electronic packaging materials research and development and industrialization, products can achieve structural bonding, electrical conductivity, thermal conductivity, insulation, protection, electromagnetic shielding and other composite functions, its performance and quality directly determine the performance and reliability of the end product, and directly restrict the development of downstream application fields, belongs to the high technical content, process difficulty, knowledge-intensive industrial links, is wafer processing, chip scale packaging, power device packaging, Indispensable key materials for different applications such as board level packaging, module and system integration packaging.
At present, it has broken the overseas monopoly in the fields of semiconductors, intelligent terminals, new energy, etc., helped China's high-end electronic packaging materials to be replaced by domestic production, and has the comprehensive ability to participate in the international industrial division of labor and competition, and is the pioneer of the domestic high-end electronic packaging materials industry.
Among them, in the field of integrated circuit packaging materials, the company continues to ship in batches in many fields such as wafer UV film materials, chip bonding materials, and thermal interface materials. Among them, chip bonding adhesive can be applied to a variety of packaging forms, covering MOS, QFN, QFP, BGA and memory, etc., and customers include Tongfu Microelectronics, Huatian Technology, Changdian Technology and other domestic integrated circuit packaging and testing enterprises. In terms of wafer UV film, it is currently supplied in batches to domestic integrated circuit packaging and testing companies such as Huatian Technology, Changdian Technology, and Riyuexin.
Including DAF film has been stably shipped in batches, CDAF film has been verified by some domestic customers, and Lid frame bonding materials have been verified by domestic head customers, and small batch orders have been obtained and shipments have been realized; Some models of chip-level underfill adhesive and chip-level thermal interface materials have been verified by key customers and are currently being introduced at an accelerated pace.
The company's smart terminal packaging materials have been widely used in consumer electronics ecological chain products such as earphones, mobile phones, pads, laptops, smart watches, VR, AR, keyboards, chargers, etc., among which TWS earphone packaging materials have achieved a high market share among domestic and foreign head customers.
The two-component polyurethane packaging material for power batteries has been selected as a single champion in the national manufacturing industry, and has become an important supplier of many leading power battery companies such as CATL, BYD, China Innovation Airlines, Guoxuan Hi-Tech, and Honeycomb Energy, and continues to maintain a stable and leading market share.
Photovoltaic laminated crystal materials have been applied on a large scale in leading photovoltaic module companies such as Tongwei Co., Ltd., Canadian Solar, and Dongfang Huansheng, and have strong competitive advantages, with a market share in the forefront. In the field of emerging photovoltaic cell technologies such as HJT and TOPCon, the welding strip fixing materials developed by 0BB Technology have been verified by multiple customers, achieving stable batch supply and maintaining a leading position in the market.
In the field of high-end equipment industry and MRO, Deppon Technology has more than 20 years of experience and foundation, and actively expands the application and promotion of new energy vehicle manufacturing industry, rail transit industry, construction machinery industry, smart home appliance industry, military equipment industry, power tool industry and metallurgical mining industry, etc., and the product category covers all chemical system products such as polyurethane, epoxy, acrylic, silica gel and multi-hybrid adhesive.
High-end electronic packaging materials not only assume traditional roles such as bonding, sealing, and protection, but also need to have special functions such as electrical conductivity, thermal conductivity, shielding, insulation, water resistance, and sweat resistance. For different application fields: integrated circuit packaging, intelligent terminal packaging, new energy power battery packaging, photovoltaic cell packaging, etc., the product requirements are different, and its core technology is mainly focused on formula design and compounding, involving the selection and modification of matrix resins, the selection and compounding of fillers, surface treatment, and the selection and compounding of additives. Precise matching technology and process mixing technology between these elements are the core competitiveness of high-end electronic packaging materials.
Huawei is currently stacking chiplets + improved 7nm chips, and then through system design and engineering construction, it can solve the problems of our overall digital center capability, computing power, and analysis capabilities, which can eliminate our generation gap in chips.
Due to the limitations of the chip manufacturing process, chiplet chip stacking and system design have become Huawei's main optimization directions. Chiplet stacking requires a large number of electronic packaging and electronic heat dissipation materials to achieve the connection and heat dissipation between chips, so the development of electronic packaging materials with better performance is also a major issue between Huawei and its suppliers.
