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——做专业的科技财经媒体！![]()
网传华为Mate70手机套，加了一个侧边孔位。
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在苹果今年新机只发布了一颗压力触控相机按键后，随着华为Mate70旗舰手机发布日期越来越近，泄漏出来的信息也显示，Mate70也会发布一颗侧边电容指纹按键，以取代原来的屏下指纹。消息称拿到机型图纸的华强北手机套供应商，已经开始打样给各大平台经销商，与上款Mate手机外形间的差异，除了摄像头模组开孔的形状不同外，还增加了一个侧边按键孔位置。自从全面屏手机流行起来后，如何把原来的生物识别功能，在不缩减屏幕显示面积的情况下保留下来，各大手机厂商都想尽了办法，最后分出来三大流派，以苹果为代表的FACE ID 3D人脸识别，以中兴手机为代表的侧边电容按键，以及小米、BBK、华为+荣耀为代表的屏下指纹。![]()
不过华为在苹果iPad也配置了全面屏+FACE
ID 3D人脸识别后，也推出的功能与外形接近的eBooK系列平板，采用了全面屏+侧边电容指纹按键模式。所以华为现在把这个技术挪用到手机上，其实在供应链上来说，并没有什么难度。
其中汇顶科技和欧菲光一直是华为的侧边指纹按键芯片和实体模组的供应商，同时两家分别也是华为屏下指纹芯片和模组供应商。但从市场传出的消息显示，由于侧边指纹模组与屏下指纹模组相比，不管是硬件成本，还是软件成本，都要更低，这也意味着如果华为在新机的备货量与未来的销量上，与上一款Mate手机相近的话，汇顶科技和欧菲光在新机上的订单单价与订单总金额，与上一款Mate手机相比，要打一些折扣。同时由于舍弃了屏下指纹后，显示屏在该区域的线路设计与驱动算法成本也将省去，同时屏下指纹模组的贴合工序也取消了，这也意味显示屏的成本更低，显示屏模组的加工单价也更低。从市场各方传出的消息看，Mate70的麒麟芯片备货量约为600万，整个生命周期总共规划了1000万台整机左右。此次麒麟芯片仍用中芯国际的部分工序，加上华为自己定制设备的“多重曝光工序和Chiplet先进封装工序，整体性能可以接近到7纳米规范定义的水平。在芯片的设计上，除了增强了AI性能外，据称还把部分应用于智能手表的协处理器部分，也移植到了这颗芯片上，用来感知用户的眼睛随动、手势识别、屏幕触摸意图等，优化手机在阅读与交互上的用户体验。由于芯片制程的复杂性增加以及良率的受限，有消息人士分析Mate70的实际物料成本和生产成本，要比苹果今年发布的iPhone同级别新机高出30%左右，但最终售价则会低于iPhone。目前整个供应链中，有增量的部分行业认为是钛合金中框领域，有传原来给小米手机供应钛合金中框材料银邦股份获得了400万套的首批订单，asp130元/台，毛利率50%-60%。而中框机加工则仍是长盈、东睦和精研来负责。与上一款Mate手机相比，新机的国产化率还会更高，主要是一些专用芯片领域，会让国内企业接手，如高精密的MLCC和射频与电源管理芯片等。而其它的供应商则基本上会保持不变。如光学部分还会是欧菲光、韦尔股份、思特威、东田微、水晶光电、联创电子这些企业，显示屏大概率也是京东方和TCL华星供货，散热模切件是中石材料和飞荣达等，电池还是欣旺达，主板、FPC则是兴森科技、深南电路等，MLCC为风华高科、顺络电子、三环集团，连接器是长盈与电连，结构件则是银邦、长盈、东睦股份、精研科技等，传感器和模组则是歌尔股份、隆扬电子、汇顶科技、福蓉科技等。整机代工还是光弘为主，不过今年有传长沙比亚迪也拿到了组装订单。![]()
在出货日期上，供应链传出的消息最早可能会在这个月底就上市销售。而一些华为的线下手机门店则已经给用户开启了“盲订”通道，虽然提供了四个颜色，但只能在不知道最终售价和到手机身颜色的情况下，可以获得优先发货机会。It is rumored that Huawei's Mate70
biometric technology changed the side buttons, and the fingerprint-related
suppliers under the screen were injuredAfter Apple only released a pressure touch
camera button for its new phone this year, as the release date of Huawei's
Mate70 flagship mobile phone is getting closer and closer, the leaked
information also shows that Mate70 will also release a side capacitive
fingerprint button to replace the original under-screen fingerprint.According to the news, the Huaqiangbei
mobile phone case supplier who got the model drawings has begun to proofing the
major platform dealers, and the difference between the shape of the previous
Mate mobile phone, in addition to the different shape of the camera module, has
also added a side button hole.Since the popularity of full-screen mobile
phones, how to retain the original biometric function without reducing the
display area of the screen, major mobile phone manufacturers have tried their
best, and finally divided into three major schools, FACE ID 3D face recognition
represented by Apple, side capacitive buttons represented by ZTE mobile phones,
and under-screen fingerprints represented by Xiaomi, BBK, Huawei + Honor.![]()
However, after Huawei is also equipped with
a full screen + FACE ID 3D face recognition on the Apple iPad, it has also
launched the eBooK series tablet with similar functions and appearance, using a
full screen + side capacitive fingerprint button mode. Therefore, Huawei is now
appropriating this technology to mobile phones, in fact, in terms of the supply
chain, there is no difficulty.Among them, Goodix Technology and OFILM
have always been the suppliers of Huawei's side fingerprint button chips and
physical modules, and they are also the suppliers of Huawei's under-display
fingerprint chips and modules.However, the news from the market shows
that compared with the fingerprint module under the screen, both the hardware
cost and the software cost are lower, which also means that if Huawei's stock
and future sales of the new machine are similar to the previous Mate mobile
phone, the unit price and total order amount of Goodix Technology and OFILM on
the new mobile phone will be discounted compared with the previous Mate mobile
phone.At the same time, due to the abandonment of
the under-screen fingerprint, the cost of circuit design and driving algorithm
of the display in the area will also be saved, and the lamination process of
the under-screen fingerprint module has also been canceled, which also means
that the cost of the display screen is lower, and the processing unit price of
the display module is also lower.Judging from the news from all parties in
the market, the stock of Kirin chips for Mate70 is about 6 million, and a total
of about 10 million complete machines are planned for the entire life cycle.This time, the Kirin chip still uses part
of SMIC's process, plus Huawei's own customized equipment's "multiple
exposure process and chiplet advanced packaging process", and the overall
performance can be close to the level defined by the 7nm specification.In terms of chip design, in addition to
enhancing AI performance, it is said that part of the coprocessor part of the
smart watch is also transplanted to this chip, which is used to perceive the
user's eye follow-up, gesture recognition, screen touch intent, etc., to
optimize the user experience of the mobile phone in reading and interaction.Due to the increasing complexity of the
chip manufacturing process and the limited yield, some sources analyzed that
the actual material cost and production cost of the Mate70 are about 30% higher
than the new iPhone of the same level released by Apple this year, but the
final price will be lower than that of the iPhone.At present, in the entire supply chain,
some industries believe that it is the field of titanium alloy frame, and it is
rumored that Yinbang Co., Ltd., which originally supplied titanium alloy frame
materials to Xiaomi mobile phones, obtained the first batch of orders of 4
million sets, ASP 130 yuan / unit, and a gross profit margin of 50%-60%. The
machining of the middle frame is still responsible for Changying, Dongmu and
Jingyan.Compared with the previous Mate mobile
phone, the localization rate of the new machine will be higher, mainly in the
field of some special chips, which will be taken over by domestic companies,
such as high-precision MLCCs and RF and power management chips.The rest of the suppliers will remain
largely the same. For example, the optical part will also be OFILM, Weir
shares, Smartway, Dongtian Micro, Crystal Optoelectronics, Lianchuang
Electronics, these companies, the display screen is likely to be supplied by
BOE and TCL Huaxing, heat dissipation die-cutting parts are Zhongshi Materials
and Feirongda, etc., the battery is still Xinwangda, the motherboard, FPC is
Xingsen Technology, Shennan Circuit, etc., MLCC is Fenghua Hi-Tech, Shunluo
Electronics, Sanhuan Group, the connector is Changying and Electric, the
structural parts are Yinbang, Changying, Dongmu Shares, Jingyan Technology,
etc., and the sensors and modules are Goertek shares, Longyang Electronics,
Goodix Technology, Furong Technology, etc.The OEM of the whole machine is still
mainly Guanghong, but this year it is rumored that Changsha BYD has also
received an assembly order.In terms of shipping dates, news from the
supply chain could be on sale as early as the end of this month. Some of
Huawei's offline mobile phone stores have opened a "blind booking"
channel for users, so that they can get priority delivery opportunities without
knowing the final price and the color of the mobile phone.![]()
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