日本财务省公布的数据显示，8月份日本对华半导体设备出口额同比激增61.6%，达到1799亿日元（约合人民币86亿），出口的设备总重量为6742吨，比上月增长了41%，另外机械设备占日本对华出口总额的24.8%，其中半导体制造设备占11.9%。
撰文：李星
半导体设备市场正式爆发
日本财务省公布的数据显示，8月份日本对华半导体设备出口额同比激增61.6%，达到1799亿日元（约合人民币86亿），出口的设备总重量为6742吨，比上月增长了41%，另外机械设备占日本对华出口总额的24.8%，其中半导体制造设备占11.9%。
在半年市场总结时，国际半导体设备与材料协会（SEMI）发布的数据也显示，中国是世界上最大的半导体设备市场，今年前6个月，中国在芯片制造工具上的支出达到创纪录的250亿美元（约合人民币1750亿）。
如果从另外一个晶圆厂建设进度的重要数据，光刻机的装机数量来看，中国的晶圆厂建设速度也处于高速增长中。荷兰光刻机供应商巨头阿斯麦（ASML）在今年第二季度，对华出口额环比增长21%，达到23亿欧元。
根据SEMI2024年1月的报告，2024年全球预计新增42座晶圆工厂/产线投产，预计全球晶圆月产能将突破3,000万片，相比2023年增长6.4%。至2024年底中国大陆有望新建立31座大型晶圆厂，扩建速度居全球第一。
EMI预计中国大陆芯片制造商将在2024年开始运营18个项目，产能将从2023年的每月760万片晶圆增加13%，达到每月860万片晶圆。
据行业预测，2024年中国内地的半导体投资规模达到了500亿美元（约合人民币3500亿）的顶峰，高过台湾和韩国。大量的晶圆厂建成进入到设备进场装机调试阶段，中国大陆的设备采购与装机数量，也迅速增长，这也是今年以来，中国大陆的半导体设备市场正式爆发的主要原因。
全球12吋晶圆厂建设达到高潮
行业数据显示，到2023年底，全球建成了约180座12吋的晶圆厂，2024年全球规划了约14到17座12吋建成投产。
未来几年，在全球半导体产业投资都转向本土制造与近岸和友岸外包的投资趁势下，中国内地、台湾、韩国、日本、欧盟、美洲、印度等，都将会把半导体产能作为投资重点。
据了解，目前海外在建的晶圆厂也是主要以12吋为主，包括台积电德国新厂ESMC，2027年底开始生产。该项目总投资额预估逾100亿欧元，预计每月产能为4万片12英寸晶圆；台积电位于日本熊本县菊阳町的工厂（熊本一厂）在今年10-12月开始量产，采用28/22纳米、16/12纳米制程技术，月产能为5.5万片，计划兴建的第二座工厂也落脚熊本县，预计今年底也开始兴建、目标2027年底开始营运，将切入6/7纳米。在日本兴建第3座工厂，预计将用来生产先进半导体，预估建设时间会在2030年以后；台积电在台湾新竹（Fab20）和高雄(Fab22）的2座2纳米工厂将在明年陆续量产；台积电在美国亚利桑那州也是规划了三个工厂，晶圆一厂有望于2025年上半年开始采用4nm技术生产，晶圆二厂除了之前宣布的3nm技术外，还将生产世界上最先进的2nm工艺技术，采用下一代纳米片晶体管并于2025年开始生产，第三座晶圆厂也已在规划中，计划使用2纳米或更先进的工艺生产芯片，预计2028年开始生产。
联电在新加坡Fab12i厂区扩建一座12英寸晶圆厂，总投资金额50亿美元，提供22/28nm制程，第一期月产能规划30,000片晶圆，最新量产时间目前为2026年初，目前正在安装机台试台。
东芝电子元件及存储装置株式会社新的300mm晶圆功率半导体制造工厂已经建成开始装机，工厂总投资1000亿日元，预计2025年3月投产，仅一期产能满载，旗下功率半导体产能将达到2021年度的2.5倍。
力积电则终止了在日本建厂的计划，三月份和印度塔塔集团合作兴建的12英寸晶圆厂开始动工，该晶圆厂位于印度古吉拉特邦的Dholera，总投资9100亿卢比（约110亿美元），预计月产能达5万片晶圆，涵盖28nm、40nm、55nm、90nm、110nm多种成熟节点，计划2026年开始投产。
德州仪器预计花费300亿美元投资建造四座相连的晶圆厂（SM1、SM2、SM3、SM4），2座工厂在2023年完成了建设；另外2座将于2026-2030年开始建设。
在上述规划之外，将在美国犹他州的莱希扩建第二座300mm晶圆制造厂，该厂已于2023年下半年开始建造，最早将于2026年投产，将主要生产模拟和嵌入式处理芯片，未来与紧邻其现有12英寸晶圆制造厂LFAB合并为一个晶圆制造厂进行运营。
英特尔很早就披露了芯片扩产计划，包括在亚利桑那州、新墨西哥州、俄亥俄州、俄勒冈州、爱尔兰、以色列、马格德堡、马来西亚槟城和居林、波兰等多地的先进制造和先进封装等厂房建设。不过英特尔目前的财务状况不佳多地的扩产计划已推迟。据英特尔官方的公告，目前英特尔正在推进美国亚利桑那州和俄亥俄州大型工厂生产尖端半导体建设，以及俄勒冈州和新墨西哥州小型工厂的设备研发和先进封装项目。
美国政府也宣布了向格芯（GlobalFoundries）提供15亿美元资金补贴，在美国纽约州马耳他建立一个新的半导体生产设施，并扩建其位于纽约州马耳他的Fab8工厂，利用其德国和新加坡工厂已使用的制造技术来制造汽车应用芯片，这实质上意味着将尾部节点引入Fab8。
上个月世界先进VIS和恩智浦联合宣布，位于新加坡的12英寸晶圆厂合资企业已获得中国台湾地区、新加坡以及其他地区监管机构的批准，也将择时开建，由台积电提供技术工艺包，2027年开始试生产，2029年有望实现盈利，并扩建第二个工厂。
9月26日，国际半导体产业协会（SEMI）发布的最新预测报告指出，2024年，全球300mm晶圆厂设备支出预计将增长4%，达到993亿美元，到2025年将进一步增长24%，首次突破1000亿美元，达到1232亿美元。预计2026年支出将增长11%，达到1362亿美元，2027年将增长3%，达到1408亿美元。
SEMI总裁兼首席执行官AjitManocha表示：“2025年全球300毫米晶圆厂设备支出预计将大幅增加，为半导体制造业投资创下三年纪录奠定了基础。全球对芯片的普遍需求正在推动设备支出，无论是针对人工智能应用的前沿技术，还是由汽车和物联网应用推动的成熟技术。”
由于中国的半导体投资是按整个供应链来配置，因此未来3年中国半导体厂商对于半导体设备的资本支出额超过1000亿美元，将持续成为全球最大的半导体设备市场。不过随着前期晶圆厂建厂高潮已过，中国半导体厂商的设备支出将从今年的创纪录的500亿美元下滑至2027年的300亿美元左右。
所以未来除了设备增购与更新的韩国外，台湾台积电和美国的晶圆厂建设会达到高峰期，成为接力中国半导体投资市场的主力。SEMI的数据也显示，2023至2026年间，包括台积电、联电、英特尔、中芯、格芯、三星、SK海力士、美光、铠侠、英飞凌、德州仪器等，将有82座新厂及产线陆续量产。
中国12吋晶圆厂进入设备装机关键期
根据华虹宏力的官网透露，华虹半导体无锡第二代IC设计及生产中心12吋制程的第一台光刻设备将于今年年底前完工通线。工厂重点发展汽车专用的12寸制程，每月生产能力为8.3万块。
华润微则表示位于重庆的12寸芯片生产线已经全部投产，产能已经达到了满负荷，有望在今年年底达到量产；深圳12吋专用IC线主要集中在40-90纳米、微控制器等领域，目前正在进行装置的安装与测试，正在进行中，今年将通线。
中芯国际则对原有工厂进行了扩建，近期表示预计今年末相较去年末12英寸的月产能将增加6万片左右。
另外广州增芯科技12英寸晶圆制造产线项目已经正式投产，后续设备正在紧张安装试车，争取尽快满产。
半导体后段封测投资赛道开启
各国政府愈发深刻认识到半导体的战略重要性，纷纷出台各类补贴政策，全力推动半导体供应链壮大。以美国、欧洲为代表的国家和地区出台了芯片法案，韩国和日本也提供巨额补贴资金支持半导体产业，国内同样有系列产业政策扶持半导体产业，各国已进入“激烈的产业竞争之中”。
半导体封测是芯片制造流程的“最后一公里”，在全球晶圆厂建厂大潮下，半导体封测产能投资也进入快速发展期。其中AI芯片、存储芯片等领域需求持续攀升，展现出强劲的发展势头，先进封装产能成为了AI芯片出货的瓶颈之一，台积电、日月光、安靠均表示先进封装产能紧张、相关订单需求旺盛。
另外台积电、英特尔、格芯等大厂纷纷加大对先进封装的投资力度，给半导体封装企业带来更多机遇和挑战。如今年2月，格芯宣布与安靠（AmkorTechnology）共建葡萄牙大型封装项目。根据公告，格芯计划将其德累斯顿工厂的12英寸晶圆级封装产线转移到安靠位于葡萄牙波尔图的工厂，以建立欧洲第一个大规模的后端设施。同时，格芯将保留其在波尔图转让的工具、流程和IP的所有权。
近年来美国政府推出了《芯片和科学法案》，美国商务部工业和安全局（BIS）并于2023年10月17日发布了针对芯片的出口管制新规，从芯片到生产芯片的设备，限制在友岸国家中发展，对于非友岸国家进行管制。
而最近的美国对从中国进口的半导体产品征收50%的关税，半导体是现代电子设备的核心组件，这一措施对半导体行业的影响尤为深远。
同时美国还通过美国国际技术安全与创新基金（ITSI基金），招募了8个成员国加入，包括印度、越南、印度尼西亚、肯尼亚、哥斯达黎加、墨西哥、巴拿马和菲律宾。根据协议，美方发起此类活动旨在建立微电路组装、测试和封装设施，即其生产的最后阶段。
旭日大数据助力全球半导体产业链布局越南
深圳旭日大数据长期服务全球的电子制造业企业，曾推动过中国电子制造业五次产业转移。包括前期从深、莞、惠转移到广东河源、清远腹地；从珠三角转移到江西、湖南、湖北中部地区；从珠三角、长三角转移到重庆、四川等西方地区；从中国大陆转移到印度等。
2018年以后中美贸易摩擦、中印商贸关掉以后，旭日大数据受国产品牌终端厂商的委托，开始调研东盟市场接受中国电子制造业转移的市场机会与风险，其中越南由于有三星、苹果供应链的成功在先，成为中国电子制造业优先考虑的目的地。
不过这第五次产业转移与前几次的产业转移有着巨大的不同，旭日大数据发现越南市场甚至整个东盟市场的独立性与特殊性，注定了投资越南和东盟制造业，机会更大、回报更高的同时，也要付出更多的资本与更大的努力。
近期越南政府总理范明政刚签发了关于颁布越南半导体产业发展战略（近期至2030年和远期展望至2050年）的第1018号决定（1018/QĐ-TTg）。
其中第一阶段（2024年-2030年）：利用地缘优势、半导体产业人力资源优势，有选择地吸引外商直接投资（FDI），发展成为全球半导体人力资源中心之一，形成半导体产业从研究、设计、生产、封装和测试等各阶段的基础能力。
目标为选择性吸引FDI投资，组建至少100家设计企业、1家小型半导体芯片制造工厂和10家半导体产品封装测试工厂；，开发多个行业的专用半导体产品；越南半导体产业年均收入达250亿美元以上，增加值达到10-15%，电子产业年均收入达2250亿美元以上，增加值达到10-15%；越南半导体产业人力资源规模达到5万名工程师和大学毕业生以上，结构和数量适当，满足发展需求。
为了推动越南半导体产业发展，同时为中资、台资企业进入越南市场提供舞台，旭日大数据、越南智造在众多半导体封测产业链厂商的建议下，与越南政商界一起，于2024年10月31日-11月02日，在越南胡志明SECC国际会展中心举办SEMICON VIETNAM 2024（2024越南国际集成电路及半导体产业展览会）Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor Industry。
这是全球半导体产业界首次在越南举办大型半导体专业展，以产业转移浪潮对标越南全球性供应链、越南半导体及电路板发展商机衔接展、半导体供应链出海推广营销展贸平台、中越两国半导体及电路板外贸撮合、后十年越南电子业国家重点贸促活动为目标，给全球半导体企业进入越南市场提供最新的投资越南资讯，打造的专业展会、商贸、论坛服务平台。
The semiconductor equipment market has
exploded, and many wafer factories in China have entered the installation and
commissioning period
Editor: Lucien
The semiconductor equipment market has officially exploded
According to data released by the Ministry of Finance of Japan, Japan's semiconductor equipment exports to China surged 61.6% year-on-year in August, reaching 179.9 billion yen (about 8.6 billion yuan), and the total weight of exported equipment was 6742 tons, an increase of 41% over the previous month, and machinery and equipment accounted for 24.8% of Japan's total exports to China, of which semiconductor manufacturing equipment accounted for 11.9%.
In the half-year market summary, the data released by the International Semiconductor Equipment and Materials Association (SEMI) also showed that China is the world's largest semiconductor equipment market, and in the first six months of this year, China's spending on chip manufacturing tools reached a record 25 billion US dollars (about 175 billion yuan).
If we look at the important data of the construction progress of another fab, the installed capacity of lithography machines, the construction speed of China's wafer fabs is also in rapid growth. Netherlands lithography machine supplier giant ASML increased its exports to China by 21% quarter-on-quarter to 2.3 billion euros in the second quarter of this year.
According to the January SEMI2024 report, 42 new wafer factories/production lines are expected to be put into operation worldwide in 2024, and the global monthly wafer production capacity is expected to exceed 30 million pieces, an increase of 6.4% compared with 2023. By the end of 2024, Chinese mainland is expected to build 31 new large-scale wafer fabs, ranking first in the world in terms of expansion speed.
EMI expects Chinese mainland chipmakers to start operating 18 projects in 2024, increasing capacity by 13% from 7.6 million wafers per month in 2023 to 8.6 million wafers per month.
According to industry forecasts, the scale of semiconductor investment in Chinese mainland will reach a peak of 50 billion US dollars (about 350 billion yuan) in 2024, higher than Taiwan and Korea. A large number of wafer fabs have been built into the stage of equipment installation and commissioning, and the number of equipment procurement and installation in Chinese mainland has also grown rapidly, which is also the main reason for the official outbreak of the semiconductor equipment market in Chinese mainland this year.
The construction of 12-inch wafer fabs around the world has reached a climax
Industry data shows that by the end of 2023, about 180 12-inch wafer fabs will be built around the world, and about 14 to 17 12-inch wafer fabs will be completed and put into operation globally in 2024.
In the next few years, as the global semiconductor industry investment shifts to local manufacturing and nearshoring and friendly shore outsourcing, Chinese mainland, Taiwan, Korea, Japan, the European Union, the Americas, India, etc., will focus on semiconductor production capacity.
It is understood that the wafer fabs currently under construction overseas are mainly 12-inch, including TSMC's new factory ESMC in Germany, which will start production at the end of 2027. The total investment of the project is estimated to exceed 10 billion euros, and the monthly production capacity is expected to be 40,000 12-inch wafers. TSMC's factory in Kikuyo Town, Kumamoto Prefecture, Japan (Kumamoto No. 1 Factory) began mass production from October to December this year, using 28/22nm, 16/12nm process technology, with a monthly production capacity of 55,000 pieces, and the planned second factory is also located in Kumamoto Prefecture, which is expected to start construction at the end of this year and target to start operation by the end of 2027, which will cut into 6/7nm. Construction of a third plant in Japan, which is expected to be used to produce advanced semiconductors, is expected to be built after 2030; TSMC's two 2nm factories in Hsinchu (Fab20) and Kaohsiung (Fab22), Taiwan, will be mass-produced next year; TSMC also plans three factories in Arizona, United States, wafer fab 1 is expected to start production with 4nm technology in the first half of 2025, wafer fab 2 will produce the world's most advanced 2nm process technology in addition to the previously announced 3nm technology, using the next generation of nanosheet transistors and start production in 2025, the third fab is also in the planning, planning to use 2nm or more advanced processes to produce chips, is expected to start production in 2028.
UMC has expanded a 12-inch wafer fab at Fab12i in Singapore, with a total investment of US$5 billion, providing 22/28nm processes, with a planned monthly production capacity of 30,000 wafers in the first phase, and the latest mass production time is currently in early 2026, and the machine test bench is currently being installed.
Toshiba Electronic Devices & Storage Co., Ltd.'s new 300mm wafer power semiconductor manufacturing plant has been completed and started installation, with a total investment of 100 billion yen, and is expected to start production in March 2025, with only the first phase of production capacity fully loaded, and its power semiconductor production capacity will reach 2.5 times that of FY2021.
PSMC terminated plans to build a factory in Japan, and in March began construction of a 12-inch wafer fab built in cooperation with India's Tata Group, which is located in Dholera, Gujarat, India, with a total investment of 910 billion rupees (about 11 billion US dollars), and is expected to have a monthly production capacity of 50,000 wafers, covering 28nm, 40nm, 55nm, 90nm, 110nm and multiple mature nodes, and plans to start production in 2026.
Texas Instruments expects to spend $30 billion to build four connected fabs (SM1, SM2, SM3, SM4), with two fabs completed in 2023; Construction of the other two will begin in 2026-2030.
In addition to the above plans, a second 300mm wafer fab will be expanded in Leahy, Utah, United States, which has begun construction in the second half of 2023 and will be operational as early as 2026, which will mainly produce analog and embedded processing chips, and will be merged into a single wafer fab in the future with its existing 12-inch wafer fab fab immediately adjacent to it.
Intel disclosed chip expansion plans early on, including the construction of advanced manufacturing and advanced packaging plants in Arizona, New Mexico, Ohio, Oregon, Ireland, Israel, Magdeburg, Penang and Kulim in Malaysia, Poland and other places. However, Intel's current financial situation is poor, and expansion plans in many places have been postponed. According to Intel's official announcement, Intel is currently promoting the construction of large-scale factories United States in Arizona and Ohio to produce cutting-edge semiconductors, as well as equipment research and development and advanced packaging projects in small factories in Oregon and New Mexico.
The United States government also announced a $1.5 billion grant to GlobalFoundries to build a new semiconductor manufacturing facility in Malta, New York, United States, and expand its Fab8 facility in Malta, New York, to leverage the manufacturing technology already used in its Germany and Singapore facilities to manufacture chips for automotive applications, essentially meaning bringing tail nodes to Fab8.
Last month, VIS and NXP jointly announced that the 12-inch wafer fab joint venture in Singapore has been approved by regulators in Taiwan, Singapore and other regions, and will also start construction at a later time, with TSMC providing the technology process package, starting trial production in 2027, and is expected to achieve profitability in 2029 and expand the second factory.
On September 26, the latest forecast report released by the International Semiconductor Industry Association (SEMI) pointed out that in 2024, global 300mm fab equipment spending is expected to increase by 4% to $99.3 billion, and will further increase by 24% by 2025, exceeding $100 billion for the first time to reach $123.2 billion. Spending is expected to grow 11% to $136.2 billion in 2026 and 3% to $140.8 billion in 2027.
"Global 300mm fab equipment spending is expected to increase significantly in 2025, setting the stage for a three-year record investment in semiconductor manufacturing," said Ajit Manocha, President and CEO of SEMI. The pervasive global demand for chips is driving spending on equipment, whether it's cutting-edge technologies for AI applications or mature technologies driven by automotive and IoT applications. ”
Since China's semiconductor investment is allocated according to the entire supply chain, the capital expenditure of Chinese semiconductor manufacturers on semiconductor equipment will exceed 100 billion US dollars in the next three years, and it will continue to become the world's largest semiconductor equipment market. However, as the climax of the early fab construction has passed, the equipment spending of Chinese semiconductor manufacturers will fall from a record $50 billion this year to about $30 billion in 2027.
Therefore, in the future, in addition to Korea, which has increased equipment purchase and renewal, the construction of wafer fabs in Taiwan's TSMC and United States will reach its peak and become the main force of China's semiconductor investment market. SEMI data also shows that from 2023 to 2026, 82 new factories and production lines will be mass-produced, including TSMC, UMC, Intel, SMIC, GF, Samsung, SK hynix, Micron, Kioxia, Infineon, Texas Instruments, etc.
China's 12-inch wafer fab has entered a critical period of equipment installation
According to Hua Hong Hongli's official website, the first 12-inch lithography equipment of Hua Hong Semiconductor's second-generation IC design and production center in Wuxi will be completed by the end of this year. The plant focuses on the development of a 12-inch process for automobiles, with a monthly production capacity of 83,000 pieces.
China Resources Micro said that the 12-inch chip production line in Chongqing has been fully put into operation, and the production capacity has reached full capacity, and it is expected to reach mass production by the end of this year; Shenzhen's 12-inch special IC line is mainly concentrated in the fields of 40-90 nanometers, microcontrollers, etc., and is currently being installed and tested by the device, which is in progress and will be put into operation this year.
SMIC has expanded its original factory and recently said that it expects to increase its 12-inch monthly production capacity by about 60,000 pieces by the end of this year compared with the end of last year.
In addition, the 12-inch wafer manufacturing production line project of Guangzhou Zengxin Technology has been officially put into operation, and the follow-up equipment is being installed and tested, striving for full production as soon as possible.
The investment track of semiconductor back-end packaging and testing was opened
Governments around the world are increasingly aware of the strategic importance of semiconductors, and have introduced various subsidy policies to promote the growth of the semiconductor supply chain. Countries and regions represented by United States and Europe have introduced chip bills, Korea and Japan have also provided huge subsidies to support the semiconductor industry, and there are also a series of domestic industrial policies to support the semiconductor industry, and countries have entered "fierce industrial competition".
Semiconductor packaging and testing is the "last mile" of the chip manufacturing process, and under the tide of global wafer factory construction, semiconductor packaging and testing capacity investment has also entered a period of rapid development. Among them, the demand for AI chips, memory chips and other fields continues to rise, showing a strong momentum of development, and advanced packaging production capacity has become one of the bottlenecks for AI chip shipments.
In addition, TSMC, Intel, GF and other large manufacturers have increased investment in advanced packaging, bringing more opportunities and challenges to semiconductor packaging companies. In February this year, GF announced a large-scale packaging project in Portugal with Amkor Technology. According to the announcement, GF plans to move its 12-inch wafer-level packaging production line from its Dresden facility to Ankor's facility in Porto, Portugal, to establish Europe's first large-scale back-end facility. At the same time, GF will retain ownership of the tools, processes and IP it transferred in Porto.
In recent years, the United States government has introduced the "CHIPS and Science Act", and the Bureau of Industry and Security (BIS) of the United States Department of Commerce issued new export control rules for chips on October 17, 2023, from chips to equipment for producing chips, restricting the development of friendly countries and controlling non-friendly countries.
The recent United States imposed a 50% tariff on semiconductor imports from China, which are the core components of modern electronic equipment, and this measure has a particularly far-reaching impact on the semiconductor industry.
The United States has also recruited eight member countries through the United States International Technology Security and Innovation Fund (ITSI Fund), including India, Viet Nam, Indonesia, Kenya, Costa Rica, Mexico, Panama and the Philippines. According to the agreement, the American side initiated such activities with the aim of establishing microcircuit assembly, testing and packaging facilities, that is, the final stage of their production.
Sunrise Big Data helps the global semiconductor industry chain layout in Viet Nam
Shenzhen Sunrise Big Data has long served the world's electronics manufacturing enterprises, and has promoted the industrial transfer of China's electronics manufacturing industry five times: including from Shenzhen, Dongguan and Huizhou to the hinterland of Heyuan and Qingyuan in Guangdong; from the Pearl River Delta to Jiangxi, Hunan, and central Hubei; from the Pearl River Delta and Yangtze River Delta to Chongqing, Sichuan and other western regions; Transfer from Chinese mainland to India, etc.
After the Sino-US trade friction and the closure of China-India trade after 2018, Glorious Sun Big Data was entrusted by domestic brand terminal manufacturers to investigate the market opportunities and risks of the ASEAN market accepting the transfer of China's electronics manufacturing industry, among which Viet Nam has become a priority destination for China's electronics manufacturing industry due to the success of Samsung and Apple's supply chain.
However, there is a huge difference from the previous industrial transfers, and Sunrise Big Data found that the independence and particularity of the Viet Nam market are destined to invest in Viet Nam's manufacturing industry, with greater opportunities and higher returns, but also to pay more capital and greater efforts.
Recently, Prime Minister Pham Minh Chinh of Viet Nam issued Decision No. 1018 (1018/Q Đ-TTg) on the promulgation of Viet Nam's semiconductor industry development strategy (short-term to 2030 and long-term outlook to 2050).
The first stage (2024-2030): to selectively attract foreign direct investment (FDI) by taking advantage of geographical advantages and human resources advantages in the semiconductor industry, develop into one of the global semiconductor human resource centers, and form the basic capabilities of the semiconductor industry from research, design, production, packaging and testing.
The goal is to selectively attract FDI investment, and set up at least 100 design enterprises, 1 small semiconductor chip manufacturing plant and 10 semiconductor product packaging and testing factories; to develop special semiconductor products for multiple industries; The average annual income of Viet Nam's semiconductor industry is more than 25 billion US dollars, with an added value of 10-15%, and the average annual income of the electronics industry is more than 225 billion US dollars, with an added value of 10-15%; The scale of human resources in Viet Nam's semiconductor industry has reached more than 50,000 engineers and university graduates, with an appropriate structure and number to meet development needs.
In order to promote the development of Viet Nam's semiconductor industry and provide a stage for Chinese-funded and Taiwan-funded enterprises to enter the Viet Nam market, Sunrise Big Data and Viet Nam Intelligent Manufacturing will be held at the SECC International Convention and Exhibition Center in Ho Chi Minh City, Viet Nam, from October 31 to November 02, 2024, together with the political and business circles of Viet NamSEMICON VIETNAM 2024 (202 Viet Nam 4 International Integrated Circuit and Semiconductor Industry Exhibition) Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor IndustryThis is the first large-scale semiconductor professional exhibition held by the global semiconductor industry in Viet Nam, aiming at the wave of industrial transfer to benchmark Viet Nam's global supply chain, Viet Nam's semiconductor and circuit board development business opportunities connection exhibition, semiconductor supply chain overseas promotion and marketing exhibition and trade platform, Sino-Vietnamese semiconductor and circuit board foreign trade matchmaking, and Viet Nam's national key trade promotion activities in the electronics industry in the next ten years as the goal, providing the latest investment Viet Nam information for global semiconductor enterprises to enter the Viet Nam market, and creating a professional exhibition, business and forum service platform.
(1) Preset scale
150+ exhibitors, 250+ booths, 10,000+ professional visitors, 6+ countries exhibitors, 10+ Viet Nam trading delegations;
(2) Concurrent activity plan
◆ Viet Nam International Cooperation Forum on the Development of Semiconductor and Integrated Circuit Industry
◆ Viet Nam Semiconductor and Integrated Circuit Supply Chain International Collaboration Seminar
◆ Viet Nam Application Business Opportunities Promotion Conference for Semiconductor and Integrated Circuit New Technologies
◆ Viet Nam International Optoelectronics, Laser and Display Touch Technology Exhibition
.......
(3) Supporting activity plan
◆ Viet Nam Summit Forum on International Cooperation and Development of Semiconductors and Integrated Circuits
→ the current situation of industrial development and market space
→ the upstream and downstream supply chain structure of the industry
→ technology application level market hobby
→ technology market access investment and trade barriers
→ potential for the international integration and development of the supply chain
◆ Regularly and quantitatively invite Viet Nam buyers to 1:1 trade matchmaking activities
→ audition accurately Viet Nam potential buyers, and match the invitation to negotiate the transaction
→ 1:1 trade speed dating at the exhibition site, and the supply and demand sides are matched and negotiated
→ customized procurement matchmaking meeting and special buyer face-to-face private meeting
→ a single exhibitor tailor-made Viet Nam channel provider full program service
◆ Field visits, visits, and market experience can be customized
→ inspect the technology application and production and sales category structure of local manufacturers
→ the production and marketing system of the local semiconductor manufacturing industry
→ inspect the supply chain supporting business conditions of the local electronics industrial park
→ customized and carried out a series of personalized door-to-door contact appointment arrangements
◆ Based on the foreign trade center base of Viet Nam's electronics manufacturing industry, this exhibition closely follows the national strategic driving force for the development of Viet Nam's Industry 4.0, and focuses on building a comprehensive service platform for high-tech electronic supply chain customization and procurement in Viet Nam's semiconductor and integrated circuit industry, as well as a comprehensive supply and demand business opportunities for products, technical materials, components, production equipment and other industrial supply chains.
Organizational structure
Support and guidance: Ministry of Industry and Trade of Viet Nam, Ministry of Science and Technology of Viet Nam, People's Committee of Ho Chi Minh City, Viet Nam
Co-organizers: Technology Application Center of Viet Nam Academy of Sciences, Viet Nam Encyclopedia University, Viet Nam Guangzhong Software Park, Korea Optical Industry Development Association, Shenzhen High-tech Enterprise Collaborative Innovation Promotion Association, Glorious Sun Big Data
Organizers: Department of Industry and Trade of Ho Chi Minh City, Viet Nam, Management Committee of Ho Chi Minh City High-tech Development Zone, Viet Nam
Undertaking and execution: Viet Nam Ho Chi Minh City Industrial Supporting Promotion Center, Ho Chi Minh City Semiconductor Industry Association, Viet Nam Electronics and Circuit Board Semiconductor Training Center, Viet Nam Global Exhibition Joint Stock Company, Viet Nam Light World Co., Ltd., Viet Nam Camel Convention and Trade Promotion Co., Ltd
Support media
Viet Nam TV, Ho Chi Minh City TV, Viet Nam Business Tribune, Viet Nam Investment News, Viet Nam Economic Times, Viet Nam Electronic Automation Magazine, Viet Nam Electronic Technology Magazine, Viet Nam Circuit Board and Electronic System Magazine, Viet Nam Electronic Technology Magazine, Viet Nam Encyclopedia University Electronic Computer Magazine, Viet Nam Electronic Communication Technology Magazine, Viet Nam Intelligent Manufacturing, Viet Nam Mainstream Online Media (VnExpress, 24h, Thanh Nien, Vietnamnet, Dan Tri, Bao Moi... and social media.
Exhibition content:
◆ Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, silicon germanium materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresists and their supporting reagents, wafer tapes, photomasks, electronic gases, special chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, packaging and testing materials, etc.
◆ Wafer manufacturing and packaging: wafer manufacturing, SiP packaging, silicon wafer and IC packaging substrates, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging and testing, EDA, MCU, printed circuit boards, packaging substrates, semiconductor materials and equipment, etc.
◆ Integrated circuit manufacturing technology: wafer fabrication/foundry, analog integrated circuits, digital/analog mixed integrated circuits; related microprocessors, memories, FPGAs, discrete devices, optoelectronic devices, power devices, sensor devices and other technical devices; Integrated circuit end products.
◆ Semiconductor equipment manufacturing: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, placement machine, single crystal furnace, oxidation furnace, grinding machine, lithography machine, etching machine, polishing machine, ion implantation equipment, CVD/PVD equipment, gluing/developing machine, reflow soldering, wave soldering, probe station, clean room equipment, etc.
◆ Packaging and testing facilities: test probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, wire bonding, welding test, laser cutting, slurry, covering film (glue) high temperature tape, laminated substrate, patch glue, feeding plate, wire flow control, quartz graphite, silicon carbide, etc.
◆ Third-generation semiconductors: third-generation semiconductors silicon carbide SiC, gallium nitride GaN, wafers, substrates, packaging, testing, optoelectronic devices (light-emitting diode LEDs, lasers LD, detector ultraviolet), power electronic devices (diodes, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC), etc.
◆ Smart power technology: microwave radio frequency, semiconductor LED, ion power supply, shared smart charging, communication power supply, photovoltaic/wind power/energy storage power supply design, power converter magnetic technology, etc.
◆ IC design: IC and related electronic product design, IC products and application technology, IC test methods and test instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, etc.
◆ Electronic components: resistors, capacitors, potentiometers, tubes, radiators, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, substrate substrates for printed circuits, passive devices, 5G core components, power management, memory, PCB boards, motor fans, electroacoustic devices, display devices, diodes, transistors, etc.
◆ Cutting-edge innovative applications: AI chips, display chips, driver chips, power management chips, electrical chips, sensor chips, Internet of Things chips, communication chips, transportation electronic chips, computer and control chips, memory chips, 5G chips, automotive-grade chips, audio and video processing chips, etc.
◆ Two-way cooperation projects: cooperation in the field of new technology/new product scientific research achievements, R&D and design, project investment, technology transfer, OEM/ODM foundry, joint production and marketing, agent distribution, brand chain franchise, testing technology services, etc.
「 Target Audience 」
◆ Senior executives and technical leaders of midstream and downstream enterprises in the semiconductor industry such as integrated circuit design, manufacturing, packaging and testing, semiconductor materials, equipment, etc.;
◆ Industry technology integrators, technology research and development providers, technology application providers, importers and exporters, traders, channel providers, distributors, brand agents, professional markets, experience centers, etc.;
◆ Invite local digital economy technology application businesses and institutions to participate in the procurement, including 5G, artificial intelligence, big data, Internet of Things, industrial Internet, intelligent manufacturing, smart cars, intelligent transportation, smart cities, smart lighting, smart homes, digital health, smart medical care, smart terminals, drones, digital new infrastructure, digital government, digital business, digital parks and other application institutions and units;
◆ Invite nearly 10,000 local professional buyers and visitors in Viet Nam to focus on the upstream, midstream and downstream target audiences of the entire industry chain, covering aerospace, security and fire protection, rail transit, computer hardware and services, IT industry, communication/information processing/storage, data management center, sensing and test and measurement, industry and electrical, machinery manufacturing, advanced manufacturing, energy/power/metallurgy, solar photovoltaic/battery, petrochemical, shipbuilding, automobile, medical, education, consumer electronics/entertainment, lighting and display, advertising media, Leaders of cutting-edge science and technology materials, finance and insurance and related supporting enterprises, design&R&D, manufacturing, procurement & distribution, bidding, project management, quality inspection, etc.; Representatives of relevant government, trade promotion, R&D, investment, testing and certification, technical training, business associations, industry alliances, professional media and other institutions.
Ask about the exhibition fee
Notes:
◆ Agency services: Viet Nam visa, cross-border business travel reception, cross-border logistics of exhibits, special equipment construction, exhibit rental, advertising services, etc.;
◆ Business travel plan with the group (itinerary on request): 6 days round trip from domestic airport direct flight to Viet Nam, exhibitor fee is additional;
◆ Enterprises that meet the application conditions of "International Market Development Funds for Small and Medium-sized Enterprises" should apply for exhibition subsidies at the local commerce department;
◆ Deadline for registration for exhibitions: more than 60 days before the exhibition, booths will be arranged on a first-served basis;
◆ Exhibition information is available upon request: "Exhibition Invitation Letter" / "Booth Map" / "Exhibition Application Form" / "Sponsorship Plan" / "Exhibition Itinerary", etc.
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2024 Viet Nam International Integrated Circuit and Semiconductor Industry Exhibition
