美国、加拿大限制中国半导体芯片进口,芯片制造出海在即

科技   2024-10-02 20:31   越南  
——做专业的科技财经媒体!



2024年10月31日-11月02日,在越南胡志明SECC国际会展中心举办SEMICON VIETNAM 2024(2024越南国际集成电路及半导体产业展览会)Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor Industry。

 

撰文:李星

根据半导体研究机构KnometaResearch发布的数据,2023年底全球半导体产能份额中,中国大陆占比为19.1%,位居全球第三位,仅次于韩国(22.2%)和中国台湾(22.0%)。不过中国也已经成为全球半导体的最大需求市场,占比达到29.5%。

2024年中国大陆在半导体制造设备上的支出持续增长,成为建设新芯片工厂的最大投资者之一,这进一步推动了中国半导体产能的提升。EMI预计中国大陆芯片制造商将在2024年开始运营18个项目,产能将从2023年的每月760万片晶圆增加13%,达到每月860万片晶圆。

而在一些细分领域,如太阳能电池、MCU、中低端功率半导体、中低端传感器等芯片领域,中国的产能已经出现过剩,在中国大陆市场上出现了价格战竞争的局面,一些半导体生产厂商和芯片厂商,已经开始往全球市场上铺货。

欧美在半导体领域进行进出口双向限制

近日美国对华的301关税进行了相关调整。2024年9月13日,美国贸易代表办公室发布通告,以“改变”中国与技术转让相关的政策做法,增强美国供应链安全为由,对华分段加征“301关税”。美国从9月27日起对原产于中国的电动汽车加征100%的关税,最终税率为102.5%(2.5%的最惠国关税+100%的“301关税”);对光伏电池加征50%的关税;对电动汽车用锂电池、岸边起重机、钢铁和铝产品等加征25%的关税。美国还将从2025年1月1日起,将原产于中国的部分半导体产品、医用或外科手套的“301关税”税率提高至50%。从2026年1月1日起再次提升原产于中国的口罩、医用手套等产品的关税税率。

同时白宫宣布将调整小额进口免税政策以限制中国电商产品进口。2024年9月13日,拜登政府宣布调整小额进口免税政策,重点针对来自中国电商平台的小额包裹,以更好地保护消费者、工人和企业。措施包括:(1)将某些产品排除在小额进口免税之外,以减少进口量;(2)提高对小额包裹入境的信息收集要求,加强监管力度;(3)要求进口商在货物入境时提交合规证书,以防规避安全标准;(4)推动立法改革,以全方位保护消费者和工人;(5)支持纺织品和服装制造商,通过扩大产品采购和加强执法力度,保障行业就业,确保公平竞争。   

而在2024年9月10日,加拿大也宣布拟对原产于中国的电池和电池部件、半导体、太阳能产品和关键矿物等产品加征关税,并启动为期30天的公众咨询。

美国打造友岸半导体联盟

在半导体领域,近年来美国政府推出了《芯片和科学法案》,美国商务部工业和安全局(BIS)并于2023年10月17日发布了针对芯片的出口管制新规,从芯片到生产芯片的设备,限制在友岸国家中发展,对于非友岸国家进行管制。

而最近的美国对从中国进口的半导体产品征收50%的关税,这一措施对半导体行业的影响尤为深远,半导体是现代电子设备的核心组件,美国此举旨在削弱中国在半导体领域的竞争力。

双方冲突的起因,除了中美贸易摩控不断之外,新冠疫情期间,美国和欧盟的经济都因半导体短缺而受到影响。芯片短缺因芯片需求的意外激增而产生,芯片短缺导致了美国和欧盟的汽车生产量缩减。据报道,2020年及以后,由于芯片短缺,美国汽车行业损失了约400万辆汽车的生产,而在欧洲,一位德国高级官员在2023年指出,“由于缺少芯片,我们在2021年损失了1-1.5%的国内生产总值,约400亿欧元”。

后疫情时代,美国和欧盟在芯片领域的脆弱性仍然真实存在。美国和欧盟都非常依赖在中国台湾地区制造的芯片。美国和欧盟面临的共同问题是双方都没有能力大规模生产最先进的芯片,即2纳米和3纳米节点的芯片。目前,生产最先进芯片的能力部分在韩国,但主要在中国台湾地区。   

为此美国、欧盟都出台了相关的芯片法案,并且在限制其对特定国家半导体、量子计算和人工智能行业的出口管制、对外投资审查的一致性上,美国和包括欧盟委员会和德国在内的一些美国盟友,正在采取具体步骤,以协调他们对特定国家的芯片技术出口管制。

并同意日本必须参与与芯片法案相关的倡议。日本最近启动了一项重大倡议,即日本高端芯片公司Rapidus旨在实现本地化先进半导体工艺的设计和制造。该公司与在北美最大的非营利性半导体研发机构NYCREATES以及比利时的Imec紧密合作,以期恢复日本在全球先进芯片生产的地位。

另外,美国还通过美国国际技术安全与创新基金(ITSI基金),招募了8个成员国加入,包括印度、越南、印度尼西亚、肯尼亚、哥斯达黎加、墨西哥、巴拿马和菲律宾。根据协议,美方发起此类活动旨在建立微电路组装、测试和封装设施,即其生产的最后阶段。

这其中,印度和越南较为积极。印度只要有半导体企业前去投资建厂,可以享受50%的中央政府补贴外,还能享受20%到25%不等的地方邦的政府补贴,差不多企业只要出30%左右的钱,就能收获一家半导体生产工厂,还能顺便收获印度这个巨大的人口市场,相当有吸引力。

旭日大数据助力全球半导体产业链布局越南
深圳旭日大数据长期服务全球的电子制造业企业,曾推动过中国电子制造业五次产业转移。包括前期从深、莞、惠转移到广东河源、清远腹地;从珠三角转移到江西、湖南、湖北中部地区;从珠三角、长三角转移到重庆、四川等西方地区;从中国大陆转移到印度等。
2018年以后中美贸易摩擦、中印商贸关掉以后,旭日大数据受国产品牌终端厂商的委托,开始调研东盟市场接受中国电子制造业转移的市场机会与风险,其中越南由于有三星、苹果供应链的成功在先,成为中国电子制造业优先考虑的目的地。
不过这第五次产业转移与前几次的产业转移有着巨大的不同,旭日大数据发现越南市场甚至整个东盟市场的独立性与特殊性,注定了投资越南和东盟制造业,机会更大、回报更高的同时,也要付出更多的资本与更大的努力。
近期越南政府总理范明政刚签发了关于颁布越南半导体产业发展战略(近期至2030年和远期展望至2050年)的第1018号决定(1018/QĐ-TTg)。
其中第一阶段(2024年-2030年):利用地缘优势、半导体产业人力资源优势,有选择地吸引外商直接投资(FDI),发展成为全球半导体人力资源中心之一,形成半导体产业从研究、设计、生产、封装和测试等各阶段的基础能力。
目标为选择性吸引FDI投资,组建至少100家设计企业、1家小型半导体芯片制造工厂和10家半导体产品封装测试工厂;,开发多个行业的专用半导体产品;越南半导体产业年均收入达250亿美元以上,增加值达到10-15%,电子产业年均收入达2250亿美元以上,增加值达到10-15%;越南半导体产业人力资源规模达到5万名工程师和大学毕业生以上,结构和数量适当,满足发展需求。
为了推动越南半导体产业发展,同时为中资、台资企业进入越南市场提供舞台,旭日大数据、越南智造在众多半导体封测产业链厂商的建议下,与越南政商界一起,于2024年10月31日-11月02日,在越南胡志明SECC国际会展中心举办SEMICON VIETNAM 2024(2024越南国际集成电路及半导体产业展览会)Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor Industry。
这是全球半导体产业界首次在越南举办大型半导体专业展,以产业转移浪潮对标越南全球性供应链、越南半导体及电路板发展商机衔接展、半导体供应链出海推广营销展贸平台、中越两国半导体及电路板外贸撮合、后十年越南电子业国家重点贸促活动为目标,给全球半导体企业进入越南市场提供最新的投资越南资讯,打造的专业展会、商贸、论坛服务平台。
(一)预设规模
150+参展商、250+展位、10000+专业观众、6+国家参展、10+越南交易团;
(二)同期活动计划
◆ 越南半导体与集成电路产业发展国际合作论坛
◆ 越南半导体与集成电路供应链国际协作研讨会
◆ 半导体与集成电路新技术越南应用商机推介会
◆ 越南国际光电、激光及显示触控技术展览会 
.......
(三)配套活动计划
◆ 越南半导体与集成电路国际合作发展高峰论坛
→产业发展现状市场空间
→产业上下游供应链结构       
→技术应用水平市场嗜好
→技术市场准入投贸壁垒
→供应链国际融合发展潜力
◆ 定时定量邀约越南买家1:1贸易对接活动
→海选精准越南潜在买家,匹配邀约面洽交易
→展会现场1:1贸易速配,供需双方匹配洽谈
→定制式采购对接会、特约买家面洽私享会
→单一展商量身定制越南渠道商全方案服务
◆ 可定制实地考察、拜会接洽、市场体验
→考察当地厂商技术应用及产销品类结构
→当地半导体制造业生产与营销体系摸底
→考察当地电子产业园区供应链配套商情
→定制开展系列个性化上门接洽预约安排
◆ 本展会立足于越南电子制造业外贸中心基地,紧扣越南工业4.0发展国家战略推动力,专注于打造成为越南半导体与集成电路产业高新技术电子供应链定制与采购综合服务平台及产品、技术材料、元器件、生产设备等产业供应链全方位配套的供需商机高效衔接展会项目。
组织机构
支持指导:越南工贸部、越南科技部、越南胡志明市人民委员会
协办单位:越南科学院技术应用中心、越南百科大学、越南光中软件园、韩国光学工业发展协会、深圳市高科技企业协同创新促进会、旭日大数据
主办单位:越南胡志明市工贸厅、越南胡志明市高新技术开发区管委会
承办执行:越南胡志明市工业配套促进中心、胡志明市半导体产业协会、越南电子与电路板半导体培训中心、越南全球展业股份公司、 越南光线世界有限公司、越南骆驼会展贸促有限公司
支持媒体
越南电视台、胡志明市电视台、越南工商论坛报、越南投资报、越南经济时报、越南电子自动化杂志、越南电子工艺杂志、越南电路板与电子系统杂志、越南电子技术杂志、越南百科大学电子计算机杂志、越南电子通讯技术杂志、越南智造、越南主流网媒(VnExpress、24h、Thanh Nien、Vietnamnet、Dan Tri,Bao Moi...)及各社交媒介。
展会内容:
◆ 半导体材料:硅片及硅基材料、硅晶圆、硅晶片、单晶硅、硅片、锗硅材料、S01材料、太阳能电池用硅材料及化合物半导体材料、石英制品、石墨制品、防静电材料、光刻胶及其配套试剂、晶圆胶带、光掩膜版、电子气体、特种化学气体、CMP抛光材料、封装基板、引线框架、键合丝、包封材料、陶瓷基板、封测材料等。
◆ 晶圆制造及封装:晶圆制造、SiP 封装、硅晶圆及IC封装载板、印制电路板、封装基板和设备及组装和测试等、封装设计、测试、设备与应用制造与封测、EDA、MCU、印制电路板、封装基板半导体材料与设备等。
◆ 集成电路制造技术:晶圆制造/代工、模拟集成电路、数/模混合集成电路;相关微处理器、存储器、FPGA、分立器件、光电器件、功率器件、传感器件等技术器件;集成电路终端产品。
◆ 半导体设备制造:封装设备、扩散设备、焊接设备、清洗设备、测试设备、制冷设备、氧化设备、贴片机、单晶炉、氧化炉、研磨机、光刻机、刻蚀机、抛光机、离子注入设备、CVD/PVD设备、涂胶/显影机、回流焊、波峰焊、探针台、洁净室设备等。
◆ 封装与测试配套:测试探针台、探针卡、测试机、分选机、封装设备、封装基板、引线框架键合丝、引线键合、烧焊测试、激光切割、研磨液、封片膜(胶)高温胶带、层压基板、贴片胶、上料板、焊线流量控制、石英石墨、碳化硅等。
◆ 第三代半导体:第三代半导体碳化硅SiC、氮化镓GaN、晶圆、衬底、封装、测试、光电子器件(发光二极管LED、激光器LD、探测器紫外)、电力电子器件(二极管、MOSFET、JFET、BJT、IGBT、GTO、ETO、SBD、HEMT等)、微波射频器件(HEMT、MMIC)等。
◆ 智慧电源技术:微波射频、半导体LED、离子电源、共享智慧充电、通信电源、光伏/风电/储能电源设计、功率变换器磁技术等。
◆ IC设计:IC及相关电子产品设计、IC产品与应用技术、IC测试方法与测试仪器、IC设计与设计工具、IC制造与封装、EDA、IP设计、嵌入式软件、数字电路设计、模拟与混合信号电路设计、集成电路布局设计等。
◆ 电子元器件:电阻、电容器、电位器、电子管、散热器、机电元件、连接器、半导体分立器件/IGBT、电声器件、 激光器件、电子显示器件、光电器件、传感器、电源、开关、微特电机、电子变压器、继电器、印制电路板、印刷电路用基材基板、无源器件、5G核心元器件、元电源管理、储存器、PCB板、电机风扇、电声器件、显示器件、二极管、三极管等。
◆ 前沿创新应用:AI芯片、显示芯片、驱动芯片、电源管理芯片、电器芯片、传感器芯片、物联网芯片、通信芯片、交通电子芯片、计算机及控制芯片、存储器芯片、5G芯片、车规级芯片、音视频处理芯片等。
◆ 双向合作项目:该领域新技术/新产品科研成果、研发与设计、项目投资、技术转让、OEM/ODM代工、联营产销、代理经销、品牌连锁加盟、检测技术服务等合作。
「 目标观众 」
◆ 半导体产业集成电路设计、制造、封装测试、半导体材料、设备等中上下游企业高层及技术负责人;
◆ 业界技术集成商、技术研发商、技术应用商、进出口商、贸易商、渠道商、经销商、品牌代理商、专业市场、体验中心等;
◆ 邀请当地数字经济技术应用商家和机构到会采购,包括5G、人工智能、大数据、物联网、工业互联网、智能制造、智能汽车、智能交通、智慧城市、智慧照明、智能家居、数字健康、智慧医疗、智能终端、无人机、数字新基建、数字政府、数字商业、数字园区等应用机构和单位;
◆ 力邀越南当地近万名专业采购商和观众,聚焦行业全产业链上中下游目标受众群体,覆盖航空航天、安防消防、轨道交通、计算机硬件与服务、IT产业、通信/信息处理/存储、数据管理中心、传感及测试测量、工业及电气、机械制造、先进制造、能源/电力/冶金、太阳能光伏/电池、石油化工、造船、汽车、医疗、教育、消费电子/娱乐、照明与显示、广告传媒、前沿科技材料、金融保险等领域及相关配套企业的管理层、设计&研发、生产制造、采购&经销、招投标、项目管理、质检等方面的负责人;相关政府、贸促、研发、投资、检测及认证、技术培训、商协会、同业联盟、专业媒体等机构代表。
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2024越南国际集成电路及半导体产业展览会

United States. Canada restricts the import of semiconductor chips from China, and chip manufacturing is about to go overseas

Editor: Lucien

According to data released by KnometaResearch, a semiconductor research institution, Chinese mainland accounted for 19.1% of the global semiconductor production capacity share at the end of 2023, ranking third in the world, second only to Korea (22.2%) and Taiwan (22.0%). However, China has also become the world's largest demand market for semiconductors, accounting for 29.5%.    

Chinese mainland's spending on semiconductor manufacturing equipment continues to grow in 2024, becoming one of the largest investors in the construction of new chip factories, which further boosts China's semiconductor production capacity. EMI expects Chinese mainland chipmakers to start operating 18 projects in 2024, increasing capacity by 13% from 7.6 million wafers per month in 2023 to 8.6 million wafers per month.

In some subdivisions, such as solar cells, MCUs, low-end power semiconductors, low-end sensors and other chip fields, China's production capacity has been excessive, and there has been a price war competition in the Chinese mainland market, and some semiconductor manufacturers and chip manufacturers have begun to distribute goods to the global market.

Europe and the United States have imposed two-way restrictions on imports and exports in the semiconductor field

Recently, the United States has made relevant adjustments to its Section 301 tariffs on China. On September 13, 2024, the Office of the United States Trade Representative issued a notice imposing additional Section 301 tariffs on China on the grounds of "changing" China's policy practices related to technology transfer and enhancing the security of United States supply chains. United States imposed 100% tariffs on electric vehicles originating in China from September 27, with a final rate of 102.5% (2.5% MFN tariff + 100% "Section 301 tariff"); an additional 50% tariff on photovoltaic cells; An additional 25% tariff will be imposed on lithium batteries for electric vehicles, quay cranes, steel and aluminum products, etc. The United States will also increase the Section 301 tariff rate to 50% on certain semiconductor products and medical or surgical gloves originating in China from January 1, 2025. From January 1, 2026, the tariff rate of masks, medical gloves and other products originating in China will be increased again.    

At the same time, the White House announced that it would adjust the small import duty-free policy to restrict the import of Chinese e-commerce products. On September 13, 2024, the Biden administration announced adjustments to the small import duty-free policy, focusing on small packages from Chinese e-commerce platforms to better protect consumers, workers, and businesses. Measures include: (1) reducing import volumes by excluding certain products from the petty import duty-free; (2) Raise the information collection requirements for the entry of small-value parcels and strengthen supervision; (3) require importers to submit a certificate of compliance when the goods enter the country to prevent circumvention of safety standards; (4) promote legislative reform to protect consumers and workers in all aspects; (5) Support textile and apparel manufacturers to protect industry employment and ensure fair competition by expanding product procurement and strengthening law enforcement.    

And on September 10, 2024, Canada also announced that it intends to impose tariffs on products such as batteries and battery components, semiconductors, solar products and critical minerals originating in China, and launched a 30-day public consultation.

The United States builds a friendly shore semiconductor alliance

In the field of semiconductors, in recent years, the United States government has introduced the "Chips and Science Act", and the Bureau of Industry and Security (BIS) of the United States Department of Commerce issued new export control rules for chips on October 17, 2023, from chips to equipment for producing chips, restricting the development of friendly countries and controlling non-friendly countries.

The recent United States imposed a 50% tariff on semiconductor imports from China, a measure that has a particularly far-reaching impact on the semiconductor industry, which is a core component of modern electronic equipment, and the United States move aims to weaken China's competitiveness in the semiconductor field.

The cause of the conflict between the two sides is not only the continuous trade control between China and the United States, but also the impact of the United States and the European Union's economy due to the shortage of semiconductors during the new crown epidemic. The chip shortage was created by an unexpected surge in demand for chips, which led to a reduction in car production in the United States and the European Union. In 2020 and beyond, the United States auto industry reportedly lost production of about 4 million vehicles due to chip shortages, while in Europe, a senior Germany official noted in 2023 that "we lost 1-1.5% of GDP in 2021, about 40 billion euros, due to the lack of chips."    

In the post-pandemic era, the vulnerability of the United States and the EU in the field of chips is still real. Both the United States and the European Union rely heavily on chips made in China's Taiwan region. The common problem facing the United States and the European Union is that neither side has the capacity to mass-produce the most advanced chips, namely those at the 2nm and 3nm nodes. Currently, the capacity to produce state-of-the-art chips is partly in Korea, but mainly in the Taiwan region of China.

To this end, United States and the European Union have both introduced relevant chip laws, and in terms of restricting their consistency of export controls and foreign investment reviews on the semiconductor, quantum computing and artificial intelligence industries in specific countries, United States and some United States allies, including the European Commission and Germany, are taking concrete steps to coordinate their export controls on chip technology in specific countries.    

and agreed that Japan must participate in initiatives related to the CHIPS Act. Japan recently launched a major initiative, Japan's high-end chip company Rapidus, which aims to enable the design and manufacture of localized advanced semiconductor processes. The company works closely with NYCREATES, the largest not-for-profit semiconductor research and development organization in North America, and Imec in Belgium to restore Japan's position in global advanced chip production.

In addition, through the United States International Technology Security and Innovation Fund (ITSI Fund), the United States has recruited eight member countries, including India, Viet Nam, Indonesia, Kenya, Costa Rica, Mexico, Panama and the Philippines. According to the agreement, the American side initiated such activities with the aim of establishing microcircuit assembly, testing and packaging facilities, that is, the final stage of their production.

Among them, India and Viet Nam are more active. As long as there are semiconductor companies in India to invest in building factories, they can enjoy 50% of the central government subsidies, but also enjoy 20% to 25% of the government subsidies of local states, almost as long as the company pays about 30% of the money, you can harvest a semiconductor production plant, but also by the way to harvest India's huge population market, quite attractive.    

         

 

    

Sunrise Big Data helps the global semiconductor industry chain layout in Viet Nam
Shenzhen Sunrise Big Data has long served the world's electronics manufacturing enterprises, and has promoted the industrial transfer of China's electronics manufacturing industry five times: including from Shenzhen, Dongguan and Huizhou to the hinterland of Heyuan and Qingyuan in Guangdong; from the Pearl River Delta to Jiangxi, Hunan, and central Hubei; from the Pearl River Delta and Yangtze River Delta to Chongqing, Sichuan and other western regions; Transfer from Chinese mainland to India, etc.
After the Sino-US trade friction and the closure of China-India trade after 2018, Glorious Sun Big Data was entrusted by domestic brand terminal manufacturers to investigate the market opportunities and risks of the ASEAN market accepting the transfer of China's electronics manufacturing industry, among which Viet Nam has become a priority destination for China's electronics manufacturing industry due to the success of Samsung and Apple's supply chain.
However, there is a huge difference from the previous industrial transfers, and Sunrise Big Data found that the independence and particularity of the Viet Nam market are destined to invest in Viet Nam's manufacturing industry, with greater opportunities and higher returns, but also to pay more capital and greater efforts.
Recently, Prime Minister Pham Minh Chinh of Viet Nam issued Decision No. 1018 (1018/Q Đ-TTg) on the promulgation of Viet Nam's semiconductor industry development strategy (short-term to 2030 and long-term outlook to 2050).
The first stage (2024-2030): to selectively attract foreign direct investment (FDI) by taking advantage of geographical advantages and human resources advantages in the semiconductor industry, develop into one of the global semiconductor human resource centers, and form the basic capabilities of the semiconductor industry from research, design, production, packaging and testing.
The goal is to selectively attract FDI investment, and set up at least 100 design enterprises, 1 small semiconductor chip manufacturing plant and 10 semiconductor product packaging and testing factories; to develop special semiconductor products for multiple industries; The average annual income of Viet Nam's semiconductor industry is more than 25 billion US dollars, with an added value of 10-15%, and the average annual income of the electronics industry is more than 225 billion US dollars, with an added value of 10-15%; The scale of human resources in Viet Nam's semiconductor industry has reached more than 50,000 engineers and university graduates, with an appropriate structure and number to meet development needs.
In order to promote the development of Viet Nam's semiconductor industry and provide a stage for Chinese-funded and Taiwan-funded enterprises to enter the Viet Nam market, Sunrise Big Data and Viet Nam Intelligent Manufacturing will be held at the SECC International Convention and Exhibition Center in Ho Chi Minh City, Viet Nam, from October 31 to November 02, 2024, together with the political and business circles of Viet NamSEMICON VIETNAM 2024 (202 Viet Nam 4 International Integrated Circuit and Semiconductor Industry Exhibition) Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor IndustryThis is the first large-scale semiconductor professional exhibition held by the global semiconductor industry in Viet Nam, aiming at the wave of industrial transfer to benchmark Viet Nam's global supply chain, Viet Nam's semiconductor and circuit board development business opportunities connection exhibition, semiconductor supply chain overseas promotion and marketing exhibition and trade platform, Sino-Vietnamese semiconductor and circuit board foreign trade matchmaking, and Viet Nam's national key trade promotion activities in the electronics industry in the next ten years as the goal, providing the latest investment Viet Nam information for global semiconductor enterprises to enter the Viet Nam market, and creating a professional exhibition, business and forum service platform.
(1) Preset scale
150+ exhibitors, 250+ booths, 10,000+ professional visitors, 6+ countries exhibitors, 10+ Viet Nam trading delegations;
(2) Concurrent activity plan
◆ Viet Nam International Cooperation Forum on the Development of Semiconductor and Integrated Circuit Industry
◆ Viet Nam Semiconductor and Integrated Circuit Supply Chain International Collaboration Seminar
◆ Viet Nam Application Business Opportunities Promotion Conference for Semiconductor and Integrated Circuit New Technologies
◆ Viet Nam International Optoelectronics, Laser and Display Touch Technology Exhibition
.......
(3) Supporting activity plan
◆ Viet Nam Summit Forum on International Cooperation and Development of Semiconductors and Integrated Circuits
→ the current situation of industrial development and market space
→ the upstream and downstream supply chain structure of the industry
→ technology application level market hobby
→ technology market access investment and trade barriers
→ potential for the international integration and development of the supply chain
◆ Regularly and quantitatively invite Viet Nam buyers to 1:1 trade matchmaking activities
→ audition accurately Viet Nam potential buyers, and match the invitation to negotiate the transaction
→ 1:1 trade speed dating at the exhibition site, and the supply and demand sides are matched and negotiated
→ customized procurement matchmaking meeting and special buyer face-to-face private meeting
→ a single exhibitor tailor-made Viet Nam channel provider full program service
◆ Field visits, visits, and market experience can be customized
→ inspect the technology application and production and sales category structure of local manufacturers
→ the production and marketing system of the local semiconductor manufacturing industry
→ inspect the supply chain supporting business conditions of the local electronics industrial park
→ customized and carried out a series of personalized door-to-door contact appointment arrangements
◆ Based on the foreign trade center base of Viet Nam's electronics manufacturing industry, this exhibition closely follows the national strategic driving force for the development of Viet Nam's Industry 4.0, and focuses on building a comprehensive service platform for high-tech electronic supply chain customization and procurement in Viet Nam's semiconductor and integrated circuit industry, as well as a comprehensive supply and demand business opportunities for products, technical materials, components, production equipment and other industrial supply chains.
Organizational structure
Support and guidance: Ministry of Industry and Trade of Viet Nam, Ministry of Science and Technology of Viet Nam, People's Committee of Ho Chi Minh City, Viet Nam
Co-organizers: Technology Application Center of Viet Nam Academy of Sciences, Viet Nam Encyclopedia University, Viet Nam Guangzhong Software Park, Korea Optical Industry Development Association, Shenzhen High-tech Enterprise Collaborative Innovation Promotion Association, Glorious Sun Big Data
Organizers: Department of Industry and Trade of Ho Chi Minh City, Viet Nam, Management Committee of Ho Chi Minh City High-tech Development Zone, Viet Nam
Undertaking and execution: Viet Nam Ho Chi Minh City Industrial Supporting Promotion Center, Ho Chi Minh City Semiconductor Industry Association, Viet Nam Electronics and Circuit Board Semiconductor Training Center, Viet Nam Global Exhibition Joint Stock Company, Viet Nam Light World Co., Ltd., Viet Nam Camel Convention and Trade Promotion Co., Ltd
Support media
Viet Nam TV, Ho Chi Minh City TV, Viet Nam Business Tribune, Viet Nam Investment News, Viet Nam Economic Times, Viet Nam Electronic Automation Magazine, Viet Nam Electronic Technology Magazine, Viet Nam Circuit Board and Electronic System Magazine, Viet Nam Electronic Technology Magazine, Viet Nam Encyclopedia University Electronic Computer Magazine, Viet Nam Electronic Communication Technology Magazine, Viet Nam Intelligent Manufacturing, Viet Nam Mainstream Online Media (VnExpress, 24h, Thanh Nien, Vietnamnet, Dan Tri, Bao Moi... and social media.
Exhibition content:
◆ Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, silicon germanium materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresists and their supporting reagents, wafer tapes, photomasks, electronic gases, special chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, packaging and testing materials, etc.
◆ Wafer manufacturing and packaging: wafer manufacturing, SiP packaging, silicon wafer and IC packaging substrates, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging and testing, EDA, MCU, printed circuit boards, packaging substrates, semiconductor materials and equipment, etc.
◆ Integrated circuit manufacturing technology: wafer fabrication/foundry, analog integrated circuits, digital/analog mixed integrated circuits; related microprocessors, memories, FPGAs, discrete devices, optoelectronic devices, power devices, sensor devices and other technical devices; Integrated circuit end products.
◆ Semiconductor equipment manufacturing: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, placement machine, single crystal furnace, oxidation furnace, grinding machine, lithography machine, etching machine, polishing machine, ion implantation equipment, CVD/PVD equipment, gluing/developing machine, reflow soldering, wave soldering, probe station, clean room equipment, etc.
◆ Packaging and testing facilities: test probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, wire bonding, welding test, laser cutting, slurry, covering film (glue) high temperature tape, laminated substrate, patch glue, feeding plate, wire flow control, quartz graphite, silicon carbide, etc.
◆ Third-generation semiconductors: third-generation semiconductors silicon carbide SiC, gallium nitride GaN, wafers, substrates, packaging, testing, optoelectronic devices (light-emitting diode LEDs, lasers LD, detector ultraviolet), power electronic devices (diodes, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC), etc.
◆ Smart power technology: microwave radio frequency, semiconductor LED, ion power supply, shared smart charging, communication power supply, photovoltaic/wind power/energy storage power supply design, power converter magnetic technology, etc.
◆ IC design: IC and related electronic product design, IC products and application technology, IC test methods and test instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, etc.
◆ Electronic components: resistors, capacitors, potentiometers, tubes, radiators, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, substrate substrates for printed circuits, passive devices, 5G core components, power management, memory, PCB boards, motor fans, electroacoustic devices, display devices, diodes, transistors, etc.
◆ Cutting-edge innovative applications: AI chips, display chips, driver chips, power management chips, electrical chips, sensor chips, Internet of Things chips, communication chips, transportation electronic chips, computer and control chips, memory chips, 5G chips, automotive-grade chips, audio and video processing chips, etc.
◆ Two-way cooperation projects: cooperation in the field of new technology/new product scientific research achievements, R&D and design, project investment, technology transfer, OEM/ODM foundry, joint production and marketing, agent distribution, brand chain franchise, testing technology services, etc.
「 Target Audience 」
◆ Senior executives and technical leaders of midstream and downstream enterprises in the semiconductor industry such as integrated circuit design, manufacturing, packaging and testing, semiconductor materials, equipment, etc.;
◆ Industry technology integrators, technology research and development providers, technology application providers, importers and exporters, traders, channel providers, distributors, brand agents, professional markets, experience centers, etc.;
◆ Invite local digital economy technology application businesses and institutions to participate in the procurement, including 5G, artificial intelligence, big data, Internet of Things, industrial Internet, intelligent manufacturing, smart cars, intelligent transportation, smart cities, smart lighting, smart homes, digital health, smart medical care, smart terminals, drones, digital new infrastructure, digital government, digital business, digital parks and other application institutions and units;
◆ Invite nearly 10,000 local professional buyers and visitors in Viet Nam to focus on the upstream, midstream and downstream target audiences of the entire industry chain, covering aerospace, security and fire protection, rail transit, computer hardware and services, IT industry, communication/information processing/storage, data management center, sensing and test and measurement, industry and electrical, machinery manufacturing, advanced manufacturing, energy/power/metallurgy, solar photovoltaic/battery, petrochemical, shipbuilding, automobile, medical, education, consumer electronics/entertainment, lighting and display, advertising media, Leaders of cutting-edge science and technology materials, finance and insurance and related supporting enterprises, design&R&D, manufacturing, procurement & distribution, bidding, project management, quality inspection, etc.; Representatives of relevant government, trade promotion, R&D, investment, testing and certification, technical training, business associations, industry alliances, professional media and other institutions.
Ask about the exhibition fee
Notes:
◆ Agency services: Viet Nam visa, cross-border business travel reception, cross-border logistics of exhibits, special equipment construction, exhibit rental, advertising services, etc.;
◆ Business travel plan with the group (itinerary on request): 6 days round trip from domestic airport direct flight to Viet Nam, exhibitor fee is additional;
◆ Enterprises that meet the application conditions of "International Market Development Funds for Small and Medium-sized Enterprises" should apply for exhibition subsidies at the local commerce department;
◆ Deadline for registration for exhibitions: more than 60 days before the exhibition, booths will be arranged on a first-served basis;
◆ Exhibition information is available upon request: "Exhibition Invitation Letter" / "Booth Map" / "Exhibition Application Form" / "Sponsorship Plan" / "Exhibition Itinerary", etc.
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2024 Viet Nam International Integrated Circuit and Semiconductor Industry Exhibition

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