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光刻技术是先进制造的核心组成部分，也是衡量高端制造业水平的标志，其在新一代信息技术、新能源、新材料、生物医疗及微纳科技等战略性新兴产业中发挥着关键作用。然而目前光刻领域仍存在挑战：如材料与工艺兼容性差、湿法工艺稳定性差；图形转移保真度差/良率低等。本论文针对目前光刻工艺尚未解决的挑战开展研究，结合界面粘附调控剥离/转印工艺，开发了系列力学辅助光刻工艺、辅材和器件应用。论文取得了以下主要研究成果：
（1）针对光刻工艺与难加工衬底的兼容性问题，提出了“光刻胶全干法转印”光刻工艺。核心在于开发精度达50 nm的水基显影可转印光刻胶。通过调控界面粘附及转印参数，实现高精度跨尺度结构的无损转印和多层堆叠。验证了柔性超薄、不规则表面原位共形制造能力和柔性表皮电极应用。该工艺还可赋能完美共形接触式光刻应用，可大面积制造亚微米级结构。
（2）针对湿法剥离的环境问题及低良率挑战，提出了“近零界面粘附”干式剥离工艺。核心在于开发两亲性分子改性的“近零界面粘附”光刻胶。该工艺实现50 nm到4英寸多尺度结构100%良率图形转移，避免使用溶剂和有毒剥离剂，拓展剥离工艺在泛半导体行业作为标准工艺的应用潜力。
（3）提出了“近零界面粘附”光刻的拓展工艺，包括分布式制造和全干法共形制造。分布式制造解决多层膜微纳结构构筑难题，已通过法布里-珀罗谐振腔验证；全干法共形制造解决瞬态可降解衬底光刻兼容性限制，验证了超薄可降解电极的制造和瞬态电子器件应用，为瞬态和可降解器件的批量化制造提供新方案。
（4）针对光刻过程界面粘附失调造成的制造良率低、应力引发结构或器件损伤、皱褶、失效等稳定性问题，提出了界面热控无损转印工艺辅助光刻。核心在于受结冰启发的热控粘附材料，其具有低切换温度、高初始粘附强度和粘附调控能力。系统分析了界面按需粘附机理和无损转印的关键因素。通过该工艺，实现了难加工衬底上的高保真微纳结构制造，应用于表皮电极器件和短沟道晶体管。
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[1]Lei Chen, Peng Liu, Bo Feng, Zhiwen Shu, Huikang Liang, Yiqin Chen, Xiaoqian Dong, Jianfei Xie, Huigao Duan. Dry-Transferable Photoresist Enabled Reliable Conformal Patterning for Ultrathin Flexible Electronics. Advanced Materials. 2023, 35, 2303513 (影响因子27.4，第一作者)
[2]Lei Chen, Huikang Liang, Peng Liu, Zhiwen Shu, Quan Wang, Xiaoqian Dong, Jianfei Xie, Bo Feng, Huigao Duan. Phase-change Stamp with Highly Switchable Adhesion and Stiffness for Damage-free Multiscale Transfer Printing. ACS Nano. 2024, 18, 35, 23968–23978 (影响因子15.8，第一作者)
[3]Lei Chen, Huikang Liang, Peng Liu, Cuihong Liu, Bo Feng, Zhiwen Shu, Yiqin Chen, Xiaoqian Dong, Jianfei Xie, Ming Ji, Huigao Duan. Sustainable Lithography with Mechanically Peelable Resists. Advanced Materials. 2024, Under review. (第一作者)
[4]Lei Chen, Yuan Niu, Cuihong Liu, Runhong Fan, Peng Liu, Dongxu Ma, Xiaoqing Zhang, Chengzhi Liu, Huigao Duan. Reliable Transfer enabled by UV-curable Stamp with Tunable Rigidity. Surfaces and Interfaces. 2024, 55, 105348 (第一作者)
[5]Lei Chen, Chidanand Hegde, Wang Zhang, Das Subhasis, Fu Fan, Huigao Duan, Lydia Helena Wong, Shlomo Magdassi, Joel K. W. Yang. Mechano-Optical Tactile Sensor Enabled by Cholesteric Liquid Crystal Elastomer for Soft Robotics. 2024 (撰写投稿中)
[6]Lei Chen, Guihui Duan, Ce Zhang, Ping Cheng, Zhaolong Wang. 3D printed hydrogel for soft thermo-responsive smart window, International Journal of Extreme Manufacturing. 2022, 4, 025302 (影响因子16.1，第一作者)
[7]Ziheng Zhan#, Lei Chen#, Huigao Duan, Yiqin Chen, Min He, Zhaolong Wang. 3D printed ultra-fast photothermal responsive shape memory hydrogel for microrobot, International Journal of Extreme Manufacturing. 2022, 4, 015302. (Best paper) (影响因子16.1，共同第一作者)
[8]Dongxu Ma#, Lei Chen#, Fu Fan, Qingyu Wang, Guihui Duan, Lei Bi, Linyu Mei, Kaixi Bi, Yiqin Chen, Huigao Duan. Solar Light Management Enabled by Dual-Responsive Smart Window. ACS Applied Materials & Interfaces. 2022, 14, 56065−56073. (共同第一作者)
[9]Lei Chen, Zhongjie Zhou, Yiru Zhang, Huigao Duan, Zhaolong Wang. Poly (HBA-co-AMPS) based Hydrogel by PμSL 3D Printing for Robotic Sensor. The IEEE 27th International Conference on Mechatronics and Machine Vision in Practice (M2VIP 2021). Shanghai. (第一作者)
[10] Lei Chen, Fu Fan, Pengshuai Wang, Peng Liu, Bo Feng, Huigao Duan. Vat Photopolymerization 3D Printing of High-Performance Ionic Organogel for Multifunctional Sensors. Materials Today Communications. 2024, 41, 110580 (第一作者)
[11] Fu Fan, Lei Chen, Yu Zhou, Huigao Duan. Multiscale Transfer Printing via Shape Memory Polymer with High Adhesion and Modulus Switchability. ACS Applied Materials & Interfaces. 2024, 16, 26824−26832. (第二作者)
[12] Yu Zhou, Bo Feng, Lei Chen, Fu Fan, Zhiqiang Ji, Huigao Duan. Wafer-Recyclable, Eco-Friendly, and Multiscale Dry Transfer Printing by Transferable Photoresist for Flexible Epidermal Electronics. ACS Applied Materials & Interfaces. 2024, 16, 13525−13533. (第三作者)
[13] Zhiwen Shu, Bo Feng, Peng Liu, Lei Chen, Huikang Liang, Yiqin Chen, Jianwu Yu, Huigao Duan. Near-zero-adhesion-enabled intact wafer-scale resist-transfer printing for high-fidelity nanofabrication on arbitrary substrates. International Journal of Extreme Manufacturing. 2024, 6, 015102. (第四作者)
来源 | 湖南大学研究生院
