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——做专业的科技财经媒体！中国大陆半导体材料市场规模在2023年达到了1024亿元。
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撰文：李星
全球半导体设计、制造、封测环节大致呈现6:3:1的价值格局。在深度国际化分工协作的发展格局中，欧美日韩等发达国家牢牢掌控着半导体设计等高价值环节，同时将对劳动力、土地、能源等生产要素消耗大，附加值低的制造和封装测试环节转移至中国、东南亚等地区。根据世界集成电路协会(WICA)统计预测，2024年全球半导体市场规模预计将达到6202亿美元（约合人民币44万亿），同比增长17%。根据TECHCET，2023年全球半导体材料市场规模受整个半导体行业环境影响预计下滑6%，2024年将反弹7%；预计2028年全球半导体材料市场规模将超过880亿美元（约合人民币6200亿）。据SEMI国际半导体协会的最新统计报告指出，2023年全球半导体材料市场销售金额为667亿美元（约合人民币4800亿），同比下滑了8.2%。在全球半导体材料市场销售金额均下滑的情况下，中国大陆是唯一成长的市场。另外，分地区来看，中国台湾连续第14年成为半导体材料的最大消费市场，金额达192亿美元（约合人民币1380亿）。这是因为中国台湾的台积电为全世界科技公司生产最先进的芯片，包括科技大厂苹果、AMD、英特尔和辉达。而继台湾之后，中国大陆则是因为需求成长，达到销售金额131亿美元（约合人民币940亿）的数量，已经超越韩国成为全球第二大买家。中国大陆半导体材料市场规模在2023年也达到了1024亿元。2017—2023年中国半导体材料市场规模（单位：亿元人民币）在芯片制造过程中，半导体材料的消耗主要分为三部分。其中晶圆制造直接消耗材料包括硅片、光掩模、光刻胶、光刻胶辅助材料、工艺化学品、电子特气、抛光液和抛光垫、靶材及其他材料。封装材料包括引线框架、封装基板、陶瓷基板、键合丝、包封材料、芯片粘结材料及其他封装材料，每一种大类材料又包括几十种甚至上百种具体产品，细分子行业多达上百个。芯片生产过程中的辅助材料，主要是与晶圆表面状态及洁净度相关的处理材料，如化学机械抛光（CMP）、湿法清洗、刻蚀、电化学沉积（电镀）等表面技术关键材料。半导体材料市场在整个芯片产业链里虽然整体的份额不高，但是由于涉及的细分领域太多，市场相对比较分散。而且很多材料的技术门槛并不高，只要能买到足够的设备就可以就近服务生产，竞争机会较为均等，因此也成为了发展半导体产业国家里，众多希望涉足半导体行业企业的首选目标，也是后进企业利用本土资源进入市场，并以产能规模取得成功的半导体产业发展先行领域。据SEMI数据显示，硅片为半导体材料领域规模最大的品类，市场份额占比达32.9%；其次为气体，占比约14.1%；光掩模排名第三，占比为12.6%。此外，抛光液和抛光垫、光刻胶配套试剂、光刻胶、湿化学品、溅射靶材的占比分别为7.2%、6.9%、6.1、4%和3%。其中七大主要半导体材料的工艺分类、市场规模和竞争格局大概分布如下：硅片是半导体器件的主要载体，位于半导体制造产业链上游。硅片分为光伏级和芯片级，光伏级硅片一般要求纯度达到 99.9999%（6N）及以上。虽然对纯度要求也很高，但相对于芯片级硅片来说稍低一些。芯片级硅片需要极高的纯度，通常要求纯度达到 99.999999999%（11N）甚至更高。芯片制造过程中，极微小的杂质都可能导致芯片性能下降、失效或良品率降低。在半导体制造中，硅片是基础材料，集成电路结构是以硅片为基础搭建而成的，是芯片制造的核心原材料。按尺寸分类：包括6英寸、8英寸、12英寸等。12英寸主要用于90nm及以下的工艺制程，随着芯片制程的缩进，市场对于12英寸硅片的需求将持续提升。按制造工艺分类：分为抛光片、外延片与、SOI硅片。抛光片：用抛光工艺去除硅片表面的加工损伤层，降低硅片表面粗度，提高平整度和颗粒度。轻掺抛光片主要用于微处理器、存储芯片、数字芯片、电源管理芯片、指纹识别芯片等的制造；8英寸硅抛光片还应用于线宽0.13um/0.11um及更大线宽集成电路产品和器件的制造。重掺抛光片主要用作硅外延片的衬底，以及用于制造稳压（隧道击穿）二极管等器件。外延片：具有比抛光片更低的含氧量、含碳量、更低的缺陷密度，提高了栅极氧化层的完整性，改善了沟道中的漏电现象，降低了器件能耗，提升了电路可靠性及器件可靠性。在CMOS电路中，如通用处理器芯片、图形处理器芯片等，以及二极管、IGBT等功率器件中广泛应用。SOI片：可通过绝缘理层实现全介质隔离，大幅减少硅片的寄生电容，改善漏电现象，消除了闩锁效应。特点包括寄生电容小、短沟道效应小、低压低功耗、集成密度高、速度快、工艺简单等。适用于要求耐高压、耐恶劣环境、低功耗、集成度高的芯片上，如射频前端芯片、功率器件、汽车电子、传感器以及星载芯片等。市场规模及竞争格局：预计2024年达到148亿美元。全球半导体硅片市场最主流的产品规格为12英寸硅片和8英寸硅片。市场竞争方面，沪硅产业是中国大陆规模最大的半导体硅片制造企业之一，立昂微也是该领域的重要企业。光刻胶又称光致抗蚀剂，是一种由感光树脂、增感剂和溶剂等主要成分组成的对光敏感的混合液体。在集成电路、平板显示、半导体分立器件等微电子制造过程中，光刻胶主要用于将掩模版上的图形转移到衬底上，起到图形复制和传递的关键作用。按化学反应原理和显影原理分为正性光刻胶和负性光刻胶，正性光刻胶：曝光部分在显影液中可溶解，未曝光部分则保持不变。正性光刻胶具有分辨率高、对比度好等优点，广泛应用于集成电路制造中的精细图形加工。负性光刻胶：曝光部分在显影液中不可溶解，而未曝光部分可溶解。负性光刻胶的特点是粘附性好、抗刻蚀能力强，但分辨率相对较低，常用于一些对分辨率要求不高的工艺环节。根据曝光光源的不同，可分为g Line（436nm）、I Line（365nm）、KrF（248nm）、ArF（193nm）、EUV（13.5nm）等。不同类型的光刻胶适用于不同的制程节点，例如KrF、ArF（i）光刻胶在较先进的制程中应用较多。光刻胶的发展趋势围绕一下几点：高分辨率：随着集成电路技术的不断发展，对光刻胶的分辨率要求将越来越高。低缺陷率：为了提高芯片的良品率，需要降低光刻胶中的缺陷率。通过优化光刻胶的配方和制造工艺，可以减少缺陷的产生。环保型：随着环保意识的不断提高，开发环保型光刻胶成为趋势。环保型光刻胶应具有低毒性、低挥发性等特点，以减少对环境的污染。多功能化：为了满足不同应用领域的需求，光刻胶将向多功能化方向发展。例如，具有抗反射、自平坦化等功能的光刻胶将受到更多关注。市场规模及竞争格局：全球光刻胶市场与国内光刻胶市场稳定扩增，光刻胶细分市场中，KrF、ArF（i）市场占比最高。国内KrF、ArF光刻胶目前处于起步阶段，具有广阔的市场替代空间，光刻胶核心市场主要被国外厂商占据。国内厂商包括容大感光、彤程新材、南大光电等具备一定的生产能力，但高端领域的国产替代尚需假以时日。电子特种气体（简称“电子特气”）是指用于半导体、平板显示及其它电子产品生产的特种气体。晶圆制造主要包括清洗、沉积/CVD、光刻、刻蚀、离子注入、成膜等工艺，从单个芯片生成到最后器件的封装，几乎每一个环节都离不开电子气体。化学气相沉积（CVD）：氨气、氯气、氧化亚氮、TEOS（正硅酸乙酯）、TEB（硼酸三乙酯）、TEPO（磷酸三乙酯）、磷化氢、三氟化氯、二氯硅烷、氯化氢、硅烷、六氟化钨、六氟乙烷、四氯化钛、甲烷等，用于半导体制造中的薄膜沉积过程。离子注入：氟化砷、三氟化磷、磷化氢、三氟化硼、三氯化硼、四氟化硅、六氟化硫、氩气等，用于改变半导体材料的电学性质。光刻胶印刷：氟气、氟气、氢气、氧气等，在光刻过程中发挥作用。扩散：氢气、三氯氧磷等，用于半导体材料的扩散工艺。刻蚀：氯气、四氟化碳、八氟环丁烷、八氟环戊烯、三氟甲烷、二氟甲烷、氯气、溴化氢、三氯化硼、六氟化硫、一氧化碳等，用于刻蚀半导体材料，形成所需的图形。电子大宗气体：环境气、保护气、载体，包括氮气、氧气、氢气、二氧化碳等，在半导体制造中起到保护、运载等作用。市场规模及竞争格局：2023年中国电子特种气体行业市场规模约为264亿元。全球电子特种气体市场主要由欧美、日本等国家或地区的企业占据。国内主要有金宏气体、南大光电、华特气体等。掩膜版是微电子制造过程中的图形转移母版，是半导体行业生产制造过程中重要的关键材料。掩膜版的作用是将设计者的电路图形通过曝光的方式转移到晶圆上，从而实现批量化生产。作为光刻复制图形的基准和蓝本，掩膜版是连接工业设计和工艺制造的关键，其精度和质量水平会直接影响最终芯片产品的优品率。以晶圆制造为例，其制造过程需要经过多次曝光工艺，利用掩膜版的曝光掩蔽作用，在半导体晶圆表面形成栅极、源漏极、掺杂窗口、电极接触孔等。半导体掩膜版以成熟制程为主，未来先进制程占比不断上升。市场规模及竞争格局：2023年全球半导体掩膜版市场规模达到53亿美元。掩膜版行业的主要厂商有美国的福尼克斯及其韩国子公司PKL，韩国的LG IT，日本的SKE、HOYA、Toppan、DNP，中国的台湾光罩、清溢光电、路维光电等。抛光液是CMP（化学机械抛光）过程中使用的一种液体材料，由磨料、氧化剂、表面活性剂等组成。在CMP过程中，抛光液通过化学作用和机械研磨作用，去除晶圆表面的缺陷和多余材料，实现晶圆表面的平坦化和光滑化，提高晶圆的表面质量和电学性能。工作原理及分类：CMP抛光液、抛光垫工作原理是在抛光过程中，抛光液中的磨料与晶圆表面发生化学反应，形成一层软化层，然后通过抛光垫的机械研磨作用将软化层去除，从而实现晶圆表面的平坦化。CMP材料分类包括抛光液、抛光垫、钻石碟、清洗液等，其中抛光液用量最大，在材料成本中占比最高。市场规模及竞争格局：全球CMP抛光液2023年市场规模近20亿美元。TOP5厂商为Cabot Microelectronics、Versum、日立、富士美、陶氏，合计占市场80%以上市场份额。抛光液市场格局有分散化趋势，国内有安集科技、鼎龙股份等公司。靶材是PVD（物理气相沉积）的核心材料，是利用物理方法在基板表面沉积薄膜的方式中被沉积的材料。根据沉积方式的不同，PVD分为溅射法和蒸镀法，靶材在溅射过程中，通过高能粒子的轰击，使靶材表面的原子或分子溅射出来，沉积在基板表面形成薄膜，从而实现对基板的表面改性或薄膜制备。按照应用不同可分为半导体靶材、平面显示靶材、太阳能靶材和其他类；按形状不同可分为长靶、方靶和圆靶；按照化学成分不同，可分为金属靶材、化合物靶材和合金靶材。半导体靶材用于半导体芯片的制造，平面显示靶材用于平板显示器的制造，太阳能靶材用于太阳能电池的制造。市场规模及竞争格局：根据SEMI数据，2023全球半导体靶材市场规模17亿美元左右。靶材市场主要被世界巨头垄断，美日头部靶材企业占据了全球市场的80%。国内企业虽然处于国产替代初期，但头部厂商成长迅速，江丰电子、有研新材等。湿电子化学品又称工艺化学品，是微电子、光电子湿法工艺（主要包括湿法刻蚀、湿法清洗）制程中使用的各种液体化工材料。湿电子化学品主要用于半导体、光伏太阳能电池、LED和平板显示等电子信息产品的清洗、蚀刻等工艺环节，保证工艺精度，去除杂质和污染物，实现微电子器件的微细加工和高性能制造。 分类及用途：按照大类一般可划分为通用化学品（通常为超净高纯试剂）和功能性化学品。通用化学品包括酸类（如氢氟酸、硫酸、磷酸、硝酸、乙酸、乙二酸等）、碱类（如氢氧化铵、氢氧化钾、氢氧化钠等）、有机溶剂类（如甲醇、乙醇、丙酮、丁酮、乙酸乙酯、甲苯等）、其他类（如过氧化氢等），主要用于清洗和蚀刻工艺。功能性湿电子化学品包括复配类（如显影液、剥离液、清洗液、蚀刻液、稀释液等），用于满足制造中特殊工艺需求。市场规模及竞争格局：湿电子化学品在全球半导体市场规模约20亿美元，在湿电子化学品的主要应用中，8英寸及以上晶圆制造用电子湿化学品国产化率较低，约为20%，具有广阔的国产替代空间。 上市公司包括 晶瑞电材、 新宙邦、 江化微。目前，国内国产化率最高的材料为封装材料，其次是光掩模，靶材和抛光材料国产化了达到了20%。在光刻胶、电子化学品和粘结材料领域，国产率不足5%。越南首次举办大型半导体专业展，百亿价值链盛会等你参与中国大陆从2015年的缺芯少屏，以十年不到的时间就成为全球最主要的LCD显示屏和半导体芯片产能基地，这期间也与整个行业的半导体设备与材料快速发展密不可分。这也给了其它想要发展半导体产业的国家与地区以借鉴，同时中国大陆中资企业的技术、产品、服务以及市场开拓经验，也成为这些希望发展半导体国家的重要助力。近期越南政府总理范明政刚签发了关于颁布越南半导体产业发展战略（近期至2030年和远期展望至2050年）的第1018号决定（1018/QĐ-TTg）。其中第一阶段（2024年-2030年）：利用地缘优势、半导体产业人力资源优势，有选择地吸引外商直接投资（FDI），发展成为全球半导体人力资源中心之一，形成半导体产业从研究、设计、生产、封装和测试等各阶段的基础能力。目标为选择性吸引FDI投资，组建至少100家设计企业、1家小型半导体芯片制造工厂和10家半导体产品封装测试工厂；，开发多个行业的专用半导体产品；越南半导体产业年均收入达250亿美元以上，增加值达到10-15%，电子产业年均收入达2250亿美元以上，增加值达到10-15%；越南半导体产业人力资源规模达到5万名工程师和大学毕业生以上，结构和数量适当，满足发展需求。为了推动越南半导体产业发展，同时为中资、台资企业进入越南市场提供舞台，旭日大数据、越南智造在众多半导体封测产业链厂商的建议下，与越南政商界一起，于2024年10月31日-11月02日，在越南胡志明SECC国际会展中心举办SEMICON VIETNAM 2024（2024越南国际集成电路及半导体产业展览会）Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor Industry，这是全球半导体产业界首次在越南举办大型半导体专业展，以产业转移浪潮对标越南全球性供应链、越南半导体及电路板发展商机衔接展、半导体供应链出海推广营销展贸平台、中越两国半导体及电路板外贸撮合汇、后十年越南电子业国家重点贸促活动为目标，给全球半导体企业进入越南市场提供最新的投资越南资讯，打造的专业展会、商贸、论坛服务平台。150+参展商、250+展位、10000+专业观众、6+国家参展、10+越南交易团；◆ 本展会立足于越南电子制造业外贸中心基地，紧扣越南工业4.0发展国家战略推动力，专注于打造成为越南半导体与集成电路产业高新技术电子供应链定制与采购综合服务平台及产品、技术材料、元器件、生产设备等产业供应链全方位配套的供需商机高效衔接展会项目。支持指导：越南工贸部、越南科技部、越南胡志明市人民委员会协办单位：越南科学院技术应用中心、越南百科大学、越南光中软件园、韩国光学工业发展协会、深圳市高科技企业协同创新促进会、旭日大数据主办单位：越南胡志明市工贸厅、越南胡志明市高新技术开发区管委会承办执行：越南胡志明市工业配套促进中心、胡志明市半导体产业协会、越南电子与电路板半导体培训中心、越南全球展业股份公司、 越南光线世界有限公司、越南骆驼会展贸促有限公司越南电视台、胡志明市电视台、越南工商论坛报、越南投资报、越南经济时报、越南电子自动化杂志、越南电子工艺杂志、越南电路板与电子系统杂志、越南电子技术杂志、越南百科大学电子计算机杂志、越南电子通讯技术杂志、越南智造、越南主流网媒（VnExpress、24h、Thanh Nien、Vietnamnet、Dan Tri，Bao Moi...）及各社交媒介。◆ 半导体材料：硅片及硅基材料、硅晶圆、硅晶片、单晶硅、硅片、锗硅材料、S01材料、太阳能电池用硅材料及化合物半导体材料、石英制品、石墨制品、防静电材料、光刻胶及其配套试剂、晶圆胶带、光掩膜版、电子气体、特种化学气体、CMP抛光材料、封装基板、引线框架、键合丝、包封材料、陶瓷基板、封测材料等。◆ 晶圆制造及封装：晶圆制造、SiP 封装、硅晶圆及IC封装载板、印制电路板、封装基板和设备及组装和测试等、封装设计、测试、设备与应用制造与封测、EDA、MCU、印制电路板、封装基板半导体材料与设备等。◆ 集成电路制造技术：晶圆制造/代工、模拟集成电路、数/模混合集成电路；相关微处理器、存储器、FPGA、分立器件、光电器件、功率器件、传感器件等技术器件；集成电路终端产品。◆ 半导体设备制造：封装设备、扩散设备、焊接设备、清洗设备、测试设备、制冷设备、氧化设备、贴片机、单晶炉、氧化炉、研磨机、光刻机、刻蚀机、抛光机、离子注入设备、CVD/PVD设备、涂胶/显影机、回流焊、波峰焊、探针台、洁净室设备等。◆ 封装与测试配套：测试探针台、探针卡、测试机、分选机、封装设备、封装基板、引线框架键合丝、引线键合、烧焊测试、激光切割、研磨液、封片膜（胶)高温胶带、层压基板、贴片胶、上料板、焊线流量控制、石英石墨、碳化硅等。◆ 第三代半导体：第三代半导体碳化硅SiC、氮化镓GaN、晶圆、衬底、封装、测试、光电子器件(发光二极管LED、激光器LD、探测器紫外)、电力电子器件(二极管、MOSFET、JFET、BJT、IGBT、GTO、ETO、SBD、HEMT等)、微波射频器件(HEMT、MMIC)等。◆ 智慧电源技术：微波射频、半导体LED、离子电源、共享智慧充电、通信电源、光伏/风电/储能电源设计、功率变换器磁技术等。◆ IC设计：IC及相关电子产品设计、IC产品与应用技术、IC测试方法与测试仪器、IC设计与设计工具、IC制造与封装、EDA、IP设计、嵌入式软件、数字电路设计、模拟与混合信号电路设计、集成电路布局设计等。◆ 电子元器件：电阻、电容器、电位器、电子管、散热器、机电元件、连接器、半导体分立器件/IGBT、电声器件、 激光器件、电子显示器件、光电器件、传感器、电源、开关、微特电机、电子变压器、继电器、印制电路板、印刷电路用基材基板、无源器件、5G核心元器件、元电源管理、储存器、PCB板、电机风扇、电声器件、显示器件、二极管、三极管等。◆ 前沿创新应用：AI芯片、显示芯片、驱动芯片、电源管理芯片、电器芯片、传感器芯片、物联网芯片、通信芯片、交通电子芯片、计算机及控制芯片、存储器芯片、5G芯片、车规级芯片、音视频处理芯片等。◆ 双向合作项目：该领域新技术/新产品科研成果、研发与设计、项目投资、技术转让、OEM/ODM代工、联营产销、代理经销、品牌连锁加盟、检测技术服务等合作。◆ 半导体产业集成电路设计、制造、封装测试、半导体材料、设备等中上下游企业高层及技术负责人；◆ 业界技术集成商、技术研发商、技术应用商、进出口商、贸易商、渠道商、经销商、品牌代理商、专业市场、体验中心等；◆ 邀请当地数字经济技术应用商家和机构到会采购,包括5G、人工智能、大数据、物联网、工业互联网、智能制造、智能汽车、智能交通、智慧城市、智慧照明、智能家居、数字健康、智慧医疗、智能终端、无人机、数字新基建、数字政府、数字商业、数字园区等应用机构和单位；◆ 力邀越南当地近万名专业采购商和观众，聚焦行业全产业链上中下游目标受众群体，覆盖航空航天、安防消防、轨道交通、计算机硬件与服务、IT产业、通信/信息处理/存储、数据管理中心、传感及测试测量、工业及电气、机械制造、先进制造、能源/电力/冶金、太阳能光伏/电池、石油化工、造船、汽车、医疗、教育、消费电子/娱乐、照明与显示、广告传媒、前沿科技材料、金融保险等领域及相关配套企业的管理层、设计&研发、生产制造、采购&经销、招投标、项目管理、质检等方面的负责人；相关政府、贸促、研发、投资、检测及认证、技术培训、商协会、同业联盟、专业媒体等机构代表。◆ 代理服务：越南签证、人员跨境商旅接待、展品跨境物流、特装搭建、展具租赁、广告服务等；◆ 随团商旅计划(行程单备索)：国内机场直飞越南往返6天，参展人员费另计；◆ 符合《中小企业国际市场开拓资金》申请条件的企业请于当地商务部门申报出展补贴；◆ 参展报名截止：展前60天以上，展位先定先安排；◆ 展务资料备索:《招展函》/《展位图》/《参展申请表》/《赞助方案》/《出展行程单》等。China has surpassed Korea to become the world's second largest buyer of semiconductor materialsThe global semiconductor design, manufacturing, packaging and testing links roughly present a value pattern of 6:3:1. In the development pattern of deep international division of labor and cooperation, developed countries such as Europe, the United States, Japan and South Korea firmly control high-value links such as semiconductor design, and at the same time transfer the manufacturing, packaging and testing links with high consumption of production factors such as labor, land, and energy and low added value to China, Southeast Asia and other regions.![]()
Three processes of chip production
According to the statistical forecast of the World Integrated Circuit Association (WICA), the global semiconductor market size is expected to reach 620.2 billion US dollars (about 44 trillion yuan) in 2024, a year-on-year increase of 17%. ACCORDING TO TECHCET, THE GLOBAL SEMICONDUCTOR MATERIALS MARKET SIZE IS EXPECTED TO DECLINE BY 6% IN 2023 DUE TO THE ENVIRONMENTAL IMPACT OF THE ENTIRE SEMICONDUCTOR INDUSTRY, AND WILL REBOUND BY 7% IN 2024; It is estimated that the global semiconductor materials market will exceed 88 billion US dollars (about 620 billion yuan) in 2028.According to the latest statistical report of the SEMI International Semiconductor Association, the sales volume of the global semiconductor materials market in 2023 will be 66.7 billion US dollars (about 480 billion yuan), a year-on-year decrease of 8.2%. In the case of declining sales in the global semiconductor materials market, Chinese mainland is the only growing market.In addition, in terms of regions, Taiwan, China has become the largest consumer market for semiconductor materials for the 14th consecutive year, with an amount of 19.2 billion US dollars (about 138 billion yuan). That's because Taiwan's TSMC produces the most advanced chips for tech companies around the world, including tech giants Apple, AMD, Intel and Nvidia. After Taiwan, Chinese mainland has surpassed Korea to become the world's second largest buyer due to the growth of demand, reaching a sales volume of 13.1 billion US dollars (about 94 billion yuan).The size of the semiconductor materials market in Chinese mainland will also reach 102.4 billion yuan in 2023.China's semiconductor material market size from 2017 to 2023 (unit: 100 million yuan).In the chip manufacturing process, the consumption of semiconductor materials is mainly divided into three parts. Among them, the direct consumables for wafer manufacturing include silicon wafers, photomasks, photoresists, photoresist auxiliary materials, process chemicals, electronic special gases, polishing slurries and polishing pads, targets and other materials.Packaging materials include lead frames, packaging substrates, ceramic substrates, bonding wires, encapsulation materials, die bonding materials and other packaging materials, each of which includes dozens or even hundreds of specific products, and hundreds of sub-industries.The auxiliary materials in the chip production process are mainly treatment materials related to the surface condition and cleanliness of the wafer, such as chemical mechanical polishing (CMP), wet cleaning, etching, electrochemical deposition (electroplating) and other key materials for surface technology.Although the overall share of the semiconductor material market in the entire chip industry chain is not high, it is not high because it involves too many subdivisions, and the technical threshold of many materials is not high, as long as you can buy enough equipment, you can serve production nearby, and the competition opportunities are relatively equal, so it has also become the first choice for many enterprises that want to get involved in the semiconductor industry in the development of the semiconductor industry.2023 Top 100 Cities in Comprehensive Competitiveness of Global Integrated Circuit IndustryAccording to SEMI data, silicon wafers are the largest category in the field of semiconductor materials, accounting for 32.9% of the market share; followed by gas, accounting for about 14.1%; Photomasks ranked third, accounting for 12.6%. In addition, the proportions of polishing slurry and polishing pad, photoresist supporting reagents, photoresist, wet chemicals, and sputtering targets were 7.2%, 6.9%, 6.1, 4%, and 3%, respectively.Proportion of semiconductor material typesAmong them, the process classification, market size and competitive landscape of the seven major semiconductor materials are roughly distributed as follows:Silicon wafers are the main carriers of semiconductor devices and are located in the upstream of the semiconductor manufacturing industry chain. Silicon wafers are divided into photovoltaic grade and chip grade, and photovoltaic grade silicon wafers generally require a purity of 99.9999% (6N) and above. Although the purity requirements are also high, they are slightly lower than chip-scale silicon wafers. Chip-scale wafers require extremely high purity, typically 99.9999999999% (11N) or higher. In the chip manufacturing process, even the smallest impurities can lead to degraded chip performance, failure, or reduced yield.In semiconductor manufacturing, silicon wafers are the basic materials, and integrated circuit structures are built on the basis of silicon wafers, which are the core raw materials for chip manufacturing. Classification by size: including 6 inches, 8 inches, 12 inches, etc. 12-inch is mainly used in 90nm and below processes, and with the indentation of the chip manufacturing process, the market demand for 12-inch silicon wafers will continue to increase.Classified according to manufacturing process: it is divided into polished wafers, epitaxial wafers and SOI silicon wafers.Polishing wafer: The polishing process is used to remove the processing damage layer on the surface of the silicon wafer, reduce the surface roughness of the silicon wafer, and improve the flatness and granularity. Lightly doped polished chips are mainly used in the manufacture of microprocessors, memory chips, digital chips, power management chips, fingerprint recognition chips, etc.; 8-inch silicon polished wafers are also used in the manufacture of integrated circuit products and devices with line widths of 0.13um/0.11um and larger. Redoped polished wafers are mainly used as substrates for silicon epitaxial wafers, as well as for the manufacture of devices such as voltage regulator (tunnel breakdown) diodes.Epitaxial wafers: It has lower oxygen content, carbon content, and lower defect density than polished wafers, which improves the integrity of the gate oxide layer, improves the leakage phenomenon in the channel, reduces the energy consumption of the device, and improves the reliability of the circuit and the reliability of the device. It is widely used in CMOS circuits, such as general-purpose processor chips, graphics processor chips, etc., as well as power devices such as diodes and IGBTs.SOI wafer: The all-dielectric isolation can be achieved through the insulating layer, which greatly reduces the parasitic capacitance of the silicon wafer, improves the leakage phenomenon, and eliminates the latch-up effect. The characteristics include small parasitic capacitance, small short-channel effect, low voltage and low power consumption, high integration density, fast speed, and simple process. It is suitable for chips that require high voltage resistance, harsh environment resistance, low power consumption, and high integration, such as RF front-end chips, power devices, automotive electronics, sensors, and spaceborne chips.Market size and competitive landscape: It is expected to reach $14.8 billion by 2024. The most mainstream product specifications in the global semiconductor wafer market are 12-inch silicon wafers and 8-inch silicon wafers. In terms of market competition, Shanghai Silicon Industry is one of the largest semiconductor wafer manufacturing enterprises in Chinese mainland, and Leon Micro is also an important enterprise in this field.Photoresist, also known as photoresist, is a light-sensitive mixture composed of major components such as photosensitive resin, sensitizer and solvent. In the manufacturing process of microelectronics such as integrated circuits, flat panel displays, and semiconductor discrete devices, photoresists are mainly used to transfer the graphics on the reticle to the substrate, and play a key role in the reproduction and transmission of patterns.According to the principle of chemical reaction and the principle of development, it is divided into positive photoresist and negative photoresist, positive photoresist: the exposed part is dissolvable in the developer, and the unexposed part remains unchanged. Positive photoresist has the advantages of high resolution and good contrast, and is widely used in fine pattern processing in integrated circuit manufacturing. Negative photoresist: the exposed part is insoluble in the developer, while the unexposed part is soluble. Negative photoresist is characterized by good adhesion and strong corrosion resistance, but the resolution is relatively low, and it is often used in some process links that do not require high resolution.Depending on the exposure light source, it can be divided into g line (436 nm), I line (365 nm), KrF (248 nm), and ArF(193nm), EUV (13.5nm), etc. Different types of photoresists are suitable for different process nodes, such as KrF and ArF(i) photoresists are more widely used in more advanced processes.The development trend of photoresist revolves around the following points: High resolution: With the continuous development of integrated circuit technology, the resolution requirements for photoresist will become higher and higher. Low defect rate: In order to improve the yield of the chip, the defect rate in the photoresist needs to be reduced. By optimizing the formulation and manufacturing process of the photoresist, the generation of defects can be reduced. Environmentally-friendly: With the continuous improvement of environmental awareness, the development of environmentally friendly photoresists has become a trend. Environmentally-friendly photoresists should have the characteristics of low toxicity and low volatility to reduce pollution to the environment. Multi-functionality: In order to meet the needs of different application fields, photoresists will develop in the direction of multi-functionality. For example, photoresists with features such as anti-reflection, self-planarization, etc., will receive more attention.Market size and competitive landscape: The global photoresist market and the domestic photoresist market are expanding steadily, and the KrF and ArF(i) markets account for the highest proportion in the photoresist market segment. Domestic KrF and ArF photoresists are currently in their infancy, with a broad market substitution space, and the core market of photoresist is mainly occupied by foreign manufacturers. Domestic manufacturers include Rongta Photosensitive, Tongcheng New Materials, Nanda Optoelectronics, etc., which have a certain production capacity, but domestic substitution in high-end fields will take time.Electronic specialty gases (hereinafter referred to as "electronic specialty gases") refer to special gases used in the production of semiconductors, flat panel displays and other electronic products.Wafer manufacturing mainly includes cleaning, deposition/CVD, lithography, etching, ion implantation, film formation and other processes, from the generation of a single chip to the packaging of the final device, almost every link is inseparable from electronic gases.Chemical Vapor Deposition (CVD): Ammonia, Chlorine, Nitrous Oxide, TEOS (Ethyl Orthosilicate), TEB (Triethyl Borate), TEPO (Triethyl Phosphate), Phosphine, Chlorine Trifluoride, Dichlorosilane, Hydrogen Chloride, Silane, Tungsten Hexafluoride, Hexafluoroethane, Titanium tetrachloride, methane, etc., which are used in thin film deposition processes in semiconductor manufacturing.Ion implantation: arsenic fluoride, phosphorus trifluoride, phosphine, boron trifluoride, boron trichloride, silicon tetrafluoride, sulfur hexafluoride, argon, etc., which are used to change the electrical properties of semiconductor materials.Photoresist printing: fluorine gas, fluorine gas, hydrogen, oxygen, etc., play a role in the lithography process.Diffusion: hydrogen, phosphorus oxychloride, etc., used in the diffusion process of semiconductor materials.Etching: chlorine, carbon tetrafluoride, octafluorocyclobutane, octafluorocyclopentene, trifluoromethane, difluoromethane, chlorine, hydrogen bromide, boron trichloride, sulfur hexafluoride, carbon monoxide, etc., are used to etch semiconductor materials to form the desired pattern.Electronic bulk gases: environmental gases, shielding gases, carriers, including nitrogen, oxygen, hydrogen, carbon dioxide, etc., play a role in the protection and transportation of semiconductor manufacturing.Market size and competitive landscape: The market size of China's electronic specialty gas industry will be about 26.4 billion yuan in 2023. The global electronic specialty gas market is mainly occupied by enterprises in Europe, America, Japan and other countries or regions. There are mainly Jinhong Gas, Nanda Optoelectronics, Huate Gas, etc.The mask is a pattern transfer master in the manufacturing process of microelectronics, and it is an important key material in the manufacturing process of the semiconductor industry. The function of the mask is to transfer the designer's circuit pattern to the wafer by way of exposure, so as to achieve mass production. As the benchmark and blueprint for lithography reproduction patterns, masks are the key to bridging industrial design and process manufacturing, and their accuracy and quality levels have a direct impact on the yield of the final chip product.Taking wafer manufacturing as an example, the manufacturing process needs to go through multiple exposure processes, and the exposure masking effect of the mask is used to form gates, source-drains, doping windows, electrode contact holes, etc. on the surface of the semiconductor wafer. Semiconductor masks are mainly mature processes, and the proportion of advanced processes will continue to rise in the future.Market size and competitive landscape: The global semiconductor mask market size will reach $5.3 billion in 2023. The main manufacturers of the mask industry are Fortix and its Korea subsidiary PKL in United States, LG IT in Korea, SKE, HOYA, Toppan and DNP in Japan, and Taiwan Photomask, Qingyi Optoelectronics, Luwei Optoelectronics in China.Polishing slurry is a liquid material used in the CMP (Chemical Mechanical Polishing) process, which is composed of abrasives, oxidizers, surfactants, etc.In the CMP process, the polishing slurry removes defects and excess materials on the wafer surface through chemical action and mechanical grinding, realizes the flattening and smoothing of the wafer surface, and improves the surface quality and electrical properties of the wafer.Working principle and classification: The working principle of CMP polishing slurry and polishing pad is that during the polishing process, the abrasive in the polishing slurry reacts chemically with the wafer surface to form a softening layer, and then the softening layer is removed through the mechanical grinding action of the polishing pad, so as to achieve the flattening of the wafer surface. The classification of CMP materials includes polishing slurry, polishing pad, diamond dish, cleaning liquid, etc., among which the amount of polishing slurry is the largest, accounting for the highest proportion of material cost.Market size and competitive landscape: The global market size of CMP polishing slurry in 2023 is nearly $2 billion. The top 5 manufacturers are Cabot Microelectronics, Versum, Hitachi, Fujimei, and Dow, accounting for more than 80% of the market share. The market pattern of polishing slurry has a trend of decentralization, and there are companies such as Anji Technology and Dinglong Co., Ltd. in China.The target is the core material of PVD (Physical Vapor Deposition), which is deposited in the form of a thin film deposited on the surface of the substrate by physical methods.According to the different deposition methods, PVD is divided into sputtering method and evaporation method, in the sputtering process, the target material is sputtered out by the bombardment of high-energy particles, and the atoms or molecules on the surface of the target are sputtered out and deposited on the surface of the substrate to form a thin film, so as to realize the surface modification of the substrate or the preparation of thin films.According to different applications, it can be divided into semiconductor targets, flat display targets, solar targets and other categories; According to different shapes, it can be divided into long targets, square targets and round targets; According to the different chemical compositions, it can be divided into metal targets, compound targets and alloy targets. Semiconductor targets are used in the manufacture of semiconductor chips, flat display targets are used in the manufacture of flat panel displays, and solar targets are used in the manufacture of solar cells.Market size and competitive landscape: According to SEMI data, the global semiconductor target market size in 2023 is about $1.7 billion. The target market is mainly monopolized by the world's giants, and the leading target companies in the United States and Japan occupy 80% of the global market. Although domestic enterprises are in the early stage of domestic substitution, the head manufacturers are growing rapidly, such as Jiangfeng Electronics and Youyan New Materials.Wet electronic chemicals, also known as process chemicals, are various liquid chemical materials used in the wet process of microelectronics and optoelectronics (mainly including wet etching and wet cleaning).Wet electronic chemicals are mainly used in the cleaning and etching of electronic information products such as semiconductors, photovoltaic solar cells, LEDs and flat panel displays, etching to ensure process accuracy, remove impurities and pollutants, and realize microfabrication and high-performance manufacturing of microelectronic devices. Classification and use: According to the general category, it can be divided into general chemicals (usually ultra-clean and high-purity reagents) and functional chemicals. General chemicals include acids (such as hydrofluoric acid, sulfuric acid, phosphoric acid, nitric acid, acetic acid, adipic acid, etc.), alkalis (such as ammonium hydroxide, potassium hydroxide, sodium hydroxide, etc.), organic solvents (such as methanol, ethanol, acetone, butanone, ethyl acetate, toluene, etc.), and others (such as hydrogen peroxide, etc.), which are mainly used for cleaning and etching processes. Functional wet electronic chemicals include compounds (such as developers, stripping solutions, cleaning solutions, etching solutions, diluents, etching solutions, etching solutions, etc., etc.) to meet the special process needs in manufacturing.Market size and competitive landscape: Wet electronic chemicals are in the global semiconductor market of about 2 billion US dollars, and in the main applications of wet electronic chemicals, the localization rate of electronic wet chemicals for wafer manufacturing of 8 inches and above is low, about 20%, and there is a broad space for domestic substitution. Listed companies include Jingrui Electric Materials, Capchem, and Jianghua Micro.China's semiconductor materials mainly represent enterprises and localization ratesAt present, the material with the highest localization rate in China is the packaging material, followed by the photomask, and the localization of target materials and polishing materials has reached 20%. In the fields of photoresists, electronic chemicals and adhesive materials, the domestic production rate is less than 5%.Viet Nam held a large-scale semiconductor professional exhibition for the first time, and the 10 billion value chain event is waiting for you to participateChinese mainland has become the world's most important LCD display and semiconductor chip production capacity base in less than ten years from the lack of cores and screens in 2015, which is also inseparable from the rapid development of semiconductor equipment and materials in the entire industry. This also gives reference to other countries and regions that want to develop the semiconductor industry, and the technology, products, services and market development experience of Chinese-funded enterprises in Chinese mainland have also become an important help for these countries that want to develop semiconductors.Recently, Prime Minister Pham Minh Chinh of Viet Nam issued Decision No. 1018 (1018/Q Đ-TTg) on the promulgation of Viet Nam's semiconductor industry development strategy (short-term to 2030 and long-term outlook to 2050).The first stage (2024-2030): to selectively attract foreign direct investment (FDI) by taking advantage of geographical advantages and human resources advantages in the semiconductor industry, develop into one of the global semiconductor human resource centers, and form the basic capabilities of the semiconductor industry from research, design, production, packaging and testing.The goal is to selectively attract FDI investment, and set up at least 100 design enterprises, 1 small semiconductor chip manufacturing plant and 10 semiconductor product packaging and testing factories; to develop special semiconductor products for multiple industries; The average annual income of Viet Nam's semiconductor industry is more than 25 billion US dollars, with an added value of 10-15%, and the average annual income of the electronics industry is more than 225 billion US dollars, with an added value of 10-15%; The scale of human resources in Viet Nam's semiconductor industry has reached more than 50,000 engineers and university graduates, with an appropriate structure and number to meet development needs.In order to promote the development of Viet Nam's semiconductor industry and provide a stage for Chinese-funded and Taiwan-funded enterprises to enter the Viet Nam market, Glorious Sun Big Data and Viet Nam Intelligent Manufacturing will be held at the SECC International Convention and Exhibition Center in Ho Chi Minh City, Viet Nam, from October 31 to November 02, 2024, together with the political and business circles of Viet NamSEMICON VIETNAM 2024 (202 Viet Nam 4 International Integrated Circuit and Semiconductor Industry Exhibition) Vietnam Int'l Exhibition For Integrated Circuit And Semiconductor IndustryThis is the first large-scale semiconductor professional exhibition held by the global semiconductor industry in Viet Nam, aiming at the wave of industrial transfer to benchmark Viet Nam's global supply chain, Viet Nam's semiconductor and circuit board development business opportunities connection exhibition, semiconductor supply chain overseas promotion and marketing exhibition and trade platform, Sino-Vietnamese semiconductor and circuit board foreign trade matchmaking, and Viet Nam's national key trade promotion activities in the electronics industry in the next ten years as the goal, providing the latest investment Viet Nam information for global semiconductor enterprises to enter the Viet Nam market, and creating a professional exhibition, business and forum service platform.150+ exhibitors, 250+ booths, 10,000+ professional visitors, 6+ countries exhibitors, 10+ Viet Nam trading delegations;(2) Concurrent activity plan◆ Viet Nam International Cooperation Forum on the Development of Semiconductor and Integrated Circuit Industry◆ Viet Nam Semiconductor and Integrated Circuit Supply Chain International Collaboration Seminar◆ Viet Nam Application Business Opportunities Promotion Conference for Semiconductor and Integrated Circuit New Technologies◆ Viet Nam International Optoelectronics, Laser and Display Touch Technology Exhibition(3) Supporting activity plan◆ Viet Nam Summit Forum on International Cooperation and Development of Semiconductors and Integrated Circuits→ the current situation of industrial development and market space→ the upstream and downstream supply chain structure of the industry→ technology application level market hobby→ technology market access investment and trade barriers→ potential for the international integration and development of the supply chain◆ Regularly and quantitatively invite Viet Nam buyers to 1:1 trade matchmaking activities→ audition accurately Viet Nam potential buyers, and match the invitation to negotiate the transaction→ 1:1 trade speed dating at the exhibition site, and the supply and demand sides are matched and negotiated→ customized procurement matchmaking meeting and special buyer face-to-face private meeting→ a single exhibitor tailor-made Viet Nam channel provider full program service◆ Field visits, visits, and market experience can be customized→ inspect the technology application and production and sales category structure of local manufacturers→ the production and marketing system of the local semiconductor manufacturing industry→ inspect the supply chain supporting business conditions of the local electronics industrial park→ customized and carried out a series of personalized door-to-door contact appointment arrangements◆ Based on the foreign trade center base of Viet Nam's electronics manufacturing industry, this exhibition closely follows the national strategic driving force for the development of Viet Nam's Industry 4.0, and focuses on building a comprehensive service platform for high-tech electronic supply chain customization and procurement in Viet Nam's semiconductor and integrated circuit industry, as well as a comprehensive supply and demand business opportunities for products, technical materials, components, production equipment and other industrial supply chains.Support and guidance: Ministry of Industry and Trade of Viet Nam, Ministry of Science and Technology of Viet Nam, People's Committee of Ho Chi Minh City, Viet NamCo-organizers: Technology Application Center of Viet Nam Academy of Sciences, Viet Nam Encyclopedia University, Viet Nam Guangzhong Software Park, Korea Optical Industry Development Association, Shenzhen High-tech Enterprise Collaborative Innovation Promotion Association, Glorious Sun Big DataOrganizers: Department of Industry and Trade of Ho Chi Minh City, Viet Nam, Management Committee of Ho Chi Minh City High-tech Development Zone, Viet NamUndertaking and execution: Viet Nam Ho Chi Minh City Industrial Supporting Promotion Center, Ho Chi Minh City Semiconductor Industry Association, Viet Nam Electronics and Circuit Board Semiconductor Training Center, Viet Nam Global Exhibition Joint Stock Company, Viet Nam Light World Co., Ltd., Viet Nam Camel Convention and Trade Promotion Co., LtdViet Nam TV, Ho Chi Minh City TV, Viet Nam Business Tribune, Viet Nam Investment News, Viet Nam Economic Times, Viet Nam Electronic Automation Magazine, Viet Nam Electronic Technology Magazine, Viet Nam Circuit Board and Electronic System Magazine, Viet Nam Electronic Technology Magazine, Viet Nam Encyclopedia University Electronic Computer Magazine, Viet Nam Electronic Communication Technology Magazine, Viet Nam Intelligent Manufacturing, Viet Nam Mainstream Online Media (VnExpress, 24h, Thanh Nien, Vietnamnet, Dan Tri, Bao Moi... and social media.◆ Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, silicon germanium materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresists and their supporting reagents, wafer tapes, photomasks, electronic gases, special chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, packaging and testing materials, etc.◆ Wafer manufacturing and packaging: wafer manufacturing, SiP packaging, silicon wafer and IC packaging substrates, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging and testing, EDA, MCU, printed circuit boards, packaging substrates, semiconductor materials and equipment, etc.◆ Integrated circuit manufacturing technology: wafer fabrication/foundry, analog integrated circuits, digital/analog mixed integrated circuits; related microprocessors, memories, FPGAs, discrete devices, optoelectronic devices, power devices, sensor devices and other technical devices; Integrated circuit end products.◆ Semiconductor equipment manufacturing: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, placement machine, single crystal furnace, oxidation furnace, grinding machine, lithography machine, etching machine, polishing machine, ion implantation equipment, CVD/PVD equipment, gluing/developing machine, reflow soldering, wave soldering, probe station, clean room equipment, etc.◆ Packaging and testing facilities: test probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, wire bonding, welding test, laser cutting, slurry, covering film (glue) high temperature tape, laminated substrate, patch glue, feeding plate, wire flow control, quartz graphite, silicon carbide, etc.◆ Third-generation semiconductors: third-generation semiconductors silicon carbide SiC, gallium nitride GaN, wafers, substrates, packaging, testing, optoelectronic devices (light-emitting diode LEDs, lasers LD, detector ultraviolet), power electronic devices (diodes, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC), etc.◆ Smart power technology: microwave radio frequency, semiconductor LED, ion power supply, shared smart charging, communication power supply, photovoltaic/wind power/energy storage power supply design, power converter magnetic technology, etc.◆ IC design: IC and related electronic product design, IC products and application technology, IC test methods and test instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, etc.◆ Electronic components: resistors, capacitors, potentiometers, tubes, radiators, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, substrate substrates for printed circuits, passive devices, 5G core components, power management, memory, PCB boards, motor fans, electroacoustic devices, display devices, diodes, transistors, etc.◆ Cutting-edge innovative applications: AI chips, display chips, driver chips, power management chips, electrical chips, sensor chips, Internet of Things chips, communication chips, transportation electronic chips, computer and control chips, memory chips, 5G chips, automotive-grade chips, audio and video processing chips, etc.◆ Two-way cooperation projects: cooperation in the field of new technology/new product scientific research achievements, R&D and design, project investment, technology transfer, OEM/ODM foundry, joint production and marketing, agent distribution, brand chain franchise, testing technology services, etc.◆ Senior executives and technical leaders of midstream and downstream enterprises in the semiconductor industry such as integrated circuit design, manufacturing, packaging and testing, semiconductor materials, equipment, etc.;◆ Industry technology integrators, technology research and development providers, technology application providers, importers and exporters, traders, channel providers, distributors, brand agents, professional markets, experience centers, etc.;◆ Invite local digital economy technology application businesses and institutions to participate in the procurement, including 5G, artificial intelligence, big data, Internet of Things, industrial Internet, intelligent manufacturing, smart cars, intelligent transportation, smart cities, smart lighting, smart homes, digital health, smart medical care, smart terminals, drones, digital new infrastructure, digital government, digital business, digital parks and other application institutions and units;◆ Invite nearly 10,000 local professional buyers and visitors in Viet Nam to focus on the upstream, midstream and downstream target audiences of the entire industry chain, covering aerospace, security and fire protection, rail transit, computer hardware and services, IT industry, communication/information processing/storage, data management center, sensing and test and measurement, industry and electrical, machinery manufacturing, advanced manufacturing, energy/power/metallurgy, solar photovoltaic/battery, petrochemical, shipbuilding, automobile, medical, education, consumer electronics/entertainment, lighting and display, advertising media, Leaders of cutting-edge science and technology materials, finance and insurance and related supporting enterprises, design&R&D, manufacturing, procurement & distribution, bidding, project management, quality inspection, etc.; Representatives of relevant government, trade promotion, R&D, investment, testing and certification, technical training, business associations, industry alliances, professional media and other institutions.![]()
Ask about the exhibition fee◆ Agency services: Viet Nam visa, cross-border business travel reception, cross-border logistics of exhibits, special equipment construction, exhibit rental, advertising services, etc.;◆ Business travel plan with the group (itinerary on request): 6 days round trip from domestic airport direct flight to Viet Nam, exhibitor fee is additional;◆ Enterprises that meet the application conditions of "International Market Development Funds for Small and Medium-sized Enterprises" should apply for exhibition subsidies at the local commerce department;◆ Deadline for registration for exhibitions: more than 60 days before the exhibition, booths will be arranged on a first-served basis;◆ Exhibition information is available upon request: "Exhibition Invitation Letter" / "Booth Map" / "Exhibition Application Form" / "Sponsorship Plan" / "Exhibition Itinerary", etc.Don't miss the opportunity
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2024 Viet Nam International Integrated Circuit and Semiconductor Industry Exhibition
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