——做专业的科技财经媒体！
2024年第二季度，华为全球智能手机出货量同比增长49%，达到1160万台。
撰文：李星
据市场调研机构TechInsights今天发布报告称，在5G领域复苏和供应链限制缓解的推动下，2024年第二季度，华为全球智能手机出货量同比增长49%，达到1160万台。同时，由于高端机型（Mate和Pura系列组合）占比较大，其批发平均售价（ASP）和批发收入均创历史新高。中国市场仍然是华为的核心市场，占其全球智能手机出货量的89%。
华为今年二季度发布的Pura70系列手机，这是华为首款搭载自研7nm芯片（麒麟9010），并打入海外高端市场的旗舰机型，覆盖了5500元至10999元的价格段。另外华为的折叠机也出货增长较快，横向折叠屏手机MateX系列和纵向折叠屏手机Pocket系列手机分别同比增长了400%和50%。
今年上半年，为华为提供芯片的海思半导体，通过采用符合中国大陆本土制程能力的设计策略，并解决了包括麒麟芯片在内的大部分7纳米以上芯片的量产难题，让华为入门级到中端机型如畅享70、70z、NovaY72等也已改用麒麟芯片，解决了华为手机芯片供应受美国节制的部分难题。
据行业人士称，海思半导体借助其它芯片企业利用AI算法来设计芯片和整理量产工艺的模式，自己内部整理了一套与多重曝光工艺相关的，主要围绕光刻机与蚀刻机来进行闭环控制的芯片设计与机台控制系统，并把影响良率的部分产能由海思自己承担生产成本，因而促进了行业为海思提供相对富余的产能配给。
前不久有信息显示，海思半导体表示从今年下半年开始，将不再只是内部供应华为芯片，而是转为向公开市场广泛供应市场所需的芯片，将业务进行大规模扩张，以充分利用自己现在手上的芯片设计资源，在保持盈利的同时，也让市场分摊其快速技术迭代所带来的成本上升。
目前华为手机的增长并不如如期，不过华为在智能驾驶领域正在不遗余力的扩张，通过各种途径增加合作伙伴与车型匹配，目的也是为了尽快在市场自动驾驶算法取得突破之前，把手上现有的智能驾驶软件及配套的硬件往市场输出并获利。
华为极力推广智能驾驶方案的另外一个目的，也是为了解决海思芯片在汽车领域广泛应用难题，并且在排除竞争对手入局中国自动驾驶市场的同时，以产能与量产装车规模方式，接受华为及海思的专用方案，并形成隐性的行业标准。
有消息称，下一步华为与海思很有可能把AI算力服务器芯片进行重新软硬件重新封装，并往PC和智能家居领域拓展，以解决服务器芯片因制程受限，市场接受程度有限的难题，同时可以通过PC和智能家居的产能拉动，来回哺服务器芯片的技术迭代成本。
海思芯片的出货量重新增长，并有富余给华为以外的公开市场铺货，说明此前困扰华为手机芯片限制的所谓“产能瓶颈”已经不在，而且华为手机近90%都是在中国大陆市场销售，未来华为手机的增长空间，应该更多来自于中国大陆以外的海外市场。
华为手机只能采用自己定制的鸿蒙系统，所以要在海外市场获得接受与成功，不管是手机，还是希望海外也接受的智能驾驶电动汽车，推广鸿蒙系统才是关键。
Huawei sold 1,160 mobile phones in the second quarter, and HiSilicon's chip breakthrough helped the growth of high-end models
Editor:Lucien
According to a report released today by market research firm TechInsights, Huawei's global smartphone shipments in the second quarter of 2024 increased by 49% year-on-year to 11.6 million units, driven by the recovery of the 5G field and the easing of supply chain constraints.
At the same time, the wholesale average selling price (ASP) and wholesale revenue reached record highs due to the large proportion of high-end models (Mate and Pura series combinations). The Chinese market remains Huawei's core market, accounting for 89% of its global smartphone shipments.
Huawei released the Pura70 series of mobile phones in the second quarter of this year, which is Huawei's first flagship model equipped with a self-developed 7nm chip (Kirin 9010) and entered the overseas high-end market, covering the price range of 5,500 yuan to 10,999 yuan. In addition, Huawei's folding machine shipments also grew rapidly, with the horizontal folding screen mobile phone MateX series and the vertical folding screen mobile phone Pocket series mobile phones increasing by 400% and 50% year-on-year respectively.
In the first half of this year, HiSilicon, which provides chips for Huawei, has solved the mass production problems of most chips above 7 nanometers, including Kirin chips, by adopting a design strategy that conforms to Chinese mainland's local process capabilities, so that Huawei's entry-level to mid-range models such as Changxiang 70, 70z, and NovaY72 have also switched to Kirin chips, solving some of the problems that Huawei's mobile phone chip supply is controlled by the United States.
According to industry insiders, with the help of other chip companies using AI algorithms to design chips and organize mass production processes, HiSilicon has internally sorted out a set of chip design and machine control systems related to multiple exposure processes, mainly focusing on lithography machines and etching machines for closed-loop control, and has borne the production costs of part of the production capacity that affects the yield, thus promoting the industry to provide HiSilicon with relatively surplus capacity rationing.
Not long ago, HiSilicon said that from the second half of this year, it will no longer only supply Huawei chips internally, but will switch to a wide range of chips required by the market to the open market, and expand its business on a large scale to make full use of its chip design resources in its current hands, while maintaining profitability, but also allowing the market to share the rising costs caused by its rapid technology iteration.
At present, the growth of Huawei's mobile phones is not as expected, but Huawei is sparing no effort to expand in the field of intelligent driving, increasing the matching of partners and models through various ways, and the purpose is also to export the existing intelligent driving software and supporting hardware to the market and make profits as soon as possible before the breakthrough of the autonomous driving algorithm in the market.
Another purpose of Huawei's efforts to promote the intelligent driving solution is to solve the problem of the wide application of HiSilicon chips in the automotive field, and to eliminate competitors from entering the Chinese autonomous driving market.
It is reported that in the next step, Huawei and HiSilicon are likely to repackage the AI computing power server chips with software and hardware, and expand to the PC and smart home fields to solve the problem of limited market acceptance of server chips due to limited manufacturing processes.
HiSilicon's chip shipments have increased again, and there is a surplus for the open market outside Huawei, indicating that the so-called "capacity bottleneck" that previously plagued Huawei's mobile phone chip restrictions is no longer there, and nearly 90% of Huawei's mobile phones are sold in the Chinese mainland market, and the future growth space of Huawei mobile phones should come more from overseas markets outside Chinese mainland.
Huawei mobile phones can only use their own customized HarmonyOS system, so in order to be accepted and successful in overseas markets, whether it is a mobile phone or an intelligent driving electric vehicle that is also expected to be accepted overseas, the promotion of the HarmonyOS system is the key.
旭日大数据团队长期服务超过全球10000家高新科技电子行业企业客户，在长期建设中国制造业供应链服务体系过程中积累了大量的行业资源，不仅对电子制造业企业的采购需求有着深刻理解，还与全球大量企业建立了系统对接，能够帮助供应商快速适应企业的服务要求，切入企业供应链。
