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行业
制造业
招聘人数
1人
工作地点
主要工作地点：常熟；其他工作地点：上海，深圳，成都，苏州
主要职责：
1.Being in charge of all business development activity in semiconductor packaging industry, fulfil the KPI target according to company strategy with focus on fabless and IDMs.
2.Manage business alignment for customer accounts by identifying value chain and gaps in customer expectations and company's offerings and working to reduce those gaps.
3.Develop a strong understanding of the customer's expectation; recognize the business opportunities based on the customer roadmaps and shares these with the internal stakeholders.
4.Set clear goals and success factors to grow the partnership revenues in line with overall ** strategy.
5.Collaborate with Global Product Managers to prepare new business proposals for customers across segment.
6.Collect market & technical information by frequent customer visiting, timely report to supervisor about the market trends,competitors'information, relative industrial regulation updates etc.
7.Support national & global R&D projects within response area.
8.Attend technical conferences to gain technical and market trends knowledge, and build customer networks.
9.Report status to ** management: strategy, technical deliverables.
10.Any other tasks from superior.
岗位要求：
1.Bachelor degree in microelectronics, materials or Semiconductor Engineering or technical field; Master’s or MBA a plus.
2.>5 years Sales/BD experience in semiconductor packaging material; >3 years field service or engineering experience semiconductor packaging industry. Familiar with advanced packaging (SiP/MEMS/WLCSP/2.5D) is preferred. >5 years team project management experience.
3.Strong English language skills, good in oral and written.
4.Good skill of Office software such as MS PowerPoint and Excel.
5.Open communication and good communication skills with external and internal stakeholders.
6.Time management. Completes tasks in a timely manner.
7.Quick learning, independent, taking initiatives.
8.Able to work under pressure.
9.Willingness to travel; up to 50% within Greater China. Occasion travel outside of China.
10.Familiarize traditional and advanced packaging process and applications, bill of materials eg solder paste, fluxes, bonding wires, die attach materials, TIMs.
本岗位不向求职者收取任何费用，并为求职者积极提供面试帮助，欢迎投递简历或电话咨询。
有意这个岗位，请扫码应聘；或者找不到合适自己的岗位，请扫码登记，公司会为你提供合适岗位。
联系方式
Ali Fan 18915607229
tonghe015@cs-job.com
Lisa 13306236222
51job@cs-job.com
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★ 拥有稳定的团队，顾问至少拥有3年以上猎头经验。
★ 强大数据库：20年的积累，存储了大量行业优秀候选人。
★ 以行业细分为特色，深耕细作。
