主要职责：
1.Provide technical support to customer in production line and solve customer technical issues related to bonding wires including semiconductor bonding wires, thick bonding wires, and Die Top System. Help customer to conduct product qualification and process optimization.
2.Support QA team for customer complaints verification on site and issues solving.
3.Conduct technical training to sales team on understanding products and customer applications.
4.Communicate with product managers, RnD, factories to get necessary support to solve customers'issues.
5.Translate voice of customers into product technical requirement and bring back to product manager and R&D team for new product development.
6.Generate application reports to increase knowledge database.
岗位要求：
1.Bachelor's degree in material science, metallurgy, electronics engineering, chemistry engineering, physics, etc.
2.3+ years'experience in Electronics industry, highly preferred as process engineer on Semiconductor packaging.
3.Rich experience on bonding wires products and processes, at least on thin bonding wires like Au wire, Cu wires, etc.
4.Knowledge and experience on power electronics packaging is preferred.
5.Good communication skills, especially with customers and with internal foreign colleagues.
6.Good learning ability, able and willing to learn new products and knowledge.
7.Open minded, willing to take new challenges our of current working scope.
8.Fluent in both written and Oral English, CET-4 or above.
9.Travel: 50%.
