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The Hong Kong Advanced Transmission Electron Microscopy 2024 is set to be a pivotal event in the field, featuring a diverse range of topics, including the superresolution electron microscopy, in situ electron microscopy, low dose electron microscopy and cryo-electron microscopy. The conference programme will include plenary and invited presentations, poster session, providing ample opportunities for attendees to engage with leading experts and peers.
In addition to the scientific program, the conference will also feature an industry exhibition, showcasing the latest technologies, products, and services in the field of TEM. This will provide a platform for industry professionals to connect with researchers and explore potential collaborations and partnerships.
Furthermore, the conference will offer social events and networking opportunities, allowing participants to build lasting connections and exchange ideas in a relaxed and informal setting. The vibrant and dynamic city of Hong Kong will serve as an inspiring backdrop for these interactions, offering a blend of tradition and modernity that is sure to enhance the overall conference experience.
We invite you to join us at the Hong Kong Advanced Transmission Electron Microscopy 2024 for an enriching and productive gathering that will shape the future of TEM research. Together, we can propel the field forward and pave the way for new discoveries and advancements. We look forward to welcoming you to Hong Kong for this exciting event.
Organizing Committee
Programme Rundown
DAY 1 2024.11.16(Saturday)
DAY 2 2024.11.17(Sunday)
DAY 3 2024.11.18(Monday)
点击阅读Microstructures期刊各话题领域文章
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Microstructures由OAE出版公司主导创办，由澳大利亚卧龙岗大学张树君教授担任创刊主编，澳大利亚悉尼大学廖晓舟教授、北京科技大学陈骏教授担任执行主编，旨在打造微结构领域权威期刊。诚挚欢迎学术界相关创新型研究工作来稿。
Microstructures [ISSN 2770-2995(Online)]是一本金色开放获取，严格同行评议的国际学术期刊，目前已被ESCI, Scopus, CAS, Dimensions, Lens, CNKI等重要数据库收录。刊文范围包括从微观尺度到原子尺度，面向终端用户的应用程序的设计、制造、建模、表征、测试和评估，涵盖但不限于金属和合金、陶瓷、聚合物、复合材料、晶体、玻璃、生物材料、界面和纳米材料等。自2021年正式创刊以来，共计发表4卷12期，132篇文章，Google总引用832次，篇均引6.2次，i 10指数31（google数据）。其中Web of Science数据库总引用600余次。
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期刊官网：https://www.oaepublish.com/microstructures
投稿链接：https://oaemesas.com/login?JournalId=microstructures
联系方式：editorialoffice@microstructj.com
【往期鉴赏】
Volume 4, Issue 1
Volume 4, Issue 2
Volume 4, Issue 3
Volume 3, Issue 1
Volume 3, Issue 2
Volume 3, Issue 3
