Highlights
Creep mechanisms: Explores how nanoparticles affect various creep mechanisms, including grain boundary sliding, diffusion, and dislocation motion.
Strengthening mechanisms: Examines how threshold stress and load transfer contribute to enhanced creep resistance in MMNCs.
Alloy-specific effects: Analyzes the influence of nanoparticles on the creep behavior of Al, Mg, Ti, Zn, and solder alloys, with examples like TiC nanoparticles improving the performance of Al-Cu alloys.
Future outlook: Highlights key research areas for advancing high-temperature materials, such as optimizing nanoparticle properties for maximum creep resistance.
This review is a valuable resource for researchers and engineers seeking to understand and develop high-performance materials for demanding applications.
Fig. 1. Creep rupture life of the nanosized and microsized Sn37Pb-1 vol% Cu.
Fig. 2. TEM-morphology and distribution of TiB and silicides in the composites crept at: (a) 700 °C/80 MPa, (b) 700 °C/120 Mpa. As well, TEM morphology of Y2O3 and silicides in the nanocomposites crept at: (c) 700 °C/80 Mpa, and (d) 700 °C/120 Mpa.
Authors
The first and corresponding author of this work is Dr. Walaa Abd-Elaziem from Zagazig Universtiy, Egypt.
W. Abd-Elaziem, J. Liu, N. Ghoniem, X. Li, Effect of nanoparticles on creep behaviour of metals: A review, Journal of Materials Research and Technology 26 (2023) 3025-3053. DOI: https://doi.org/10.1016/j.jmrt.2023.08.068
Editor: Dr. Jun-Jing He
