首届亚太半导体峰会暨博览会（APSSE 2024）将于2024年10月16日-18日在马来西亚槟城举行。
APSSE 2024以“汇聚槟城，芯动亚太”为主题，邀请集成电路行业领军人物、专家学者、企业家、半导体协会及高校等产业精英汇聚槟城，共同展望半导体产业的未来发展趋势，共话产业的创新与合作。
大会将进行主题报告、圆桌讨论、技术交流、商贸配对等活动，围绕集成电路及半导体器件产业、TFT面板产业、光伏及储能产业、LED技术等议题展开。
商贸配对企业对接活动
Business Matching of APSSE
时间：2024年10月17日
地点：槟城国际会议中心 VIP ROOM
作为APSSE 2024的亮点活动之一，对接活动旨在为与会企业、供应商、采购商以及投资者等提供一个高效、专业的交流平台，这将是一次不可多得的商业合作促膝交谈。
根据参会者的行业背景、业务需求以及合作意向，现场匹配“一对一、一对多”交流，让参与者能在有限的时间内与最有可能达成合作的伙伴进行面对面交流。参加者可以迅速找到与自己业务需求相匹配的合作伙伴，从而加速商业合作的进程。
对接活动意向企业名单
List of Interested Companies for Business Matching
大会议程（目前最新）
APSSE 2024 Agenda
Day 1: 16 Oct. 2024 2024年10月16日
08:00 – 08:55 Registration | |||
Opening Ceremony | |||
09:00~09:10 | Welcoming Ceremony | ||
09:15~09:25 | DSW, President of MSIA | ||
09:30~09:40 | YAB, Chief Minister of Penang | ||
09:45~09:50 | Opening Launch | ||
09:55~10:30 | Tea Break | ||
Plenary Session: Global Semiconductor Growth | |||
10:30~11:30 | Topic 1: Global Semiconductor Outlook The Semiconductor Surge: A Global Perspective on the Industry’s Evolution and Pathways Keynote Speech by David Wang Moderator: Desmond Hor, Deputy GM, Jiangsu Leadlap Semiconductor Technology Co Ltd | ||
Dato Seri Wong, President, MSIA | |||
Nancy Greco, Global Distribution Sales Leader, IBM | |||
Shivaji Das, Managing Director, APAC & Partner, Frost & Sullivan | |||
Dr. Yeong Che Fai, CEO, DF Automation & Robotics Sdn Bhd | |||
Yaojian LIN, VP Advanced Package, TF AMD Microelectronics (Penang) Sdn. Bhd. | |||
11:30~12:30 | Topic 2: Transitioning from Local to International Outbound Investments From Local Roots to Global Giants: Navigating the Complexities of International Investment Expansion Moderator: CJ Li, Executive Vice General Manager, Hanglingwei(Taizhou)Technology Co., Ltd | ||
Dato’ Loo Lee Lian, CEO, Invest Penang | |||
Kevin Khoo, Group COO, UNISEM Berhad | |||
KN Boo, Managing Director, NSW Automation Sdn Bhd | |||
Yap Chi Hui, Chairman of MAYCHAM Shanghai Branch | |||
Tan Wei Xian, Partner, Skrine & Co. | |||
12:30~14:00 | Lunch Break | ||
Plenary Session: Sustainability & ESG | |||
14:30~16:00 | Topic 3: Artificial Intelligence AI's Transformative Power: How Artificial Intelligence is Set to Revolutionize Our Lives Keynote Speech by Gavin Ni Moderator: Danny Chan Director of TMT Sector, CIMB | ||
Dr. Eric Chiang, GM, Baidu Paddle Strategic Investment Center & Adjunct Professor, Hong Kong City University | |||
Dr. James Ong, Founder, Artificial Intelligence International Institute | |||
Matthias Meienhofer, CPE Partner Sales Manager, DS Singapore | |||
See Chin Liang, Director of Software Engineering, StarFive Technology Int. Sdn Bhd. | |||
JINSONG Xu, Founder & CEO for Innowave Tech | |||
Plenary Session: Sustainability & ESG | ||
16:00~17:00 | Topic 4: Asia Pacific Semiconductor Strategies Unleashing Potential: How Asia Pacific is Shaping the Future of Semiconductor Innovation Moderator: Desmond Hor, Deputy GM, Jiangsu Leadlap Semiconductor Technology Co Ltd | |
Dato' KL Bock, Vice President, Western Digital | ||
Ang Wee Seng, Chairman, Singapore Semiconductor Industry Association (SSIA) | ||
Danny Chan, Director of TMT Sector, CIMB | ||
Jeffrey Hwang, Group CEO, QDOS Holding Berhad | ||
Kenny See, To Senior Vice President, Technology, Media & Telecommunications, Sector Solutions Group, UOB | ||
17:00~18:00 | Cocktail Networking | |
18:00~21:00 | Gala Dinner | |
Day 2: 17 Oct. 2024 2024年10月17日
08:00 – 08:55 Registration | |||
Technical Track: Smart Initiatives | |||
09:00~10:15 | Topic 5: Advancing ESG through Innovations Could Businesses Collaboration Drive Innovations in ESG Sustainability? Moderator: Chua HueySian,Director of Sustainable Finance, CIMB | ||
Sachin Gupta, APAC Sustainability Leader, IBM | |||
Dexiang Chen, Senior Vice President Sustainability Institutional Banking Group of DBS Bank | |||
Davis Chong, CEO, Solarvest Holdings Berhad | |||
10:10~10.45 | Tea Break | ||
10:45~12:00 | Topic 6: Intellectual Property How to Remain Tomorrow’s Sustainability with Yesterday’s IP Technology? Moderator: Teh Hong Koon Partner, Skrine | ||
Andy Goh, Vice President, JF Technology Berhad | |||
Pauline Khor, Partner, Rahmat Lim & Partners | |||
Patricia Chung, Founder, Chung Chambers | |||
Cecilia Lou, Partner, King&Wood China & Hong Kong | |||
12:00~13:30 | Lunch Break | ||
Technical Track: Semiconductor Development | |||
14:00~15:00 | Topic 7: Advanced Packaging The Next Frontier in Semiconductor Packaging: Exploring the Innovations Shaping Technologies Moderator: Dr Eu of NXP Group | ||
E. Jan Vardaman, President, TechSearch. Inc. | |||
Dr. YY Tan, Senior Technology & Market Analyst, YOLE Group | |||
Dr. Linus Lau, Director, RF Station Sdn Bhd | |||
Zhaowei Jia, Vice President, ACM Research (Shanghai) | |||
Lincoln Lee, PAC RIM VICE PRESIDENT Technical AE, SIEMENS EDA | |||
15:00~15:15 | Tea Break | ||
15:15 – 16:30 | Topic 8 Strategies for STEM Talent Development Empowering Tomorrow's Innovators: Strategic Approaches to Cultivate the Next Generation of STEM Talent Moderator: Chew Chin Director, CIMB | ||
Dr. Koay, Academic Head, Vitrox College | |||
SK Fong, CEO, SkyeChip | |||
Low Choy Huat, Partner, EY Malaysia | |||
Sara Lau Partner, Skrine & Co | |||
Louis Looi, Managing Partner, Fairwork Malaysia | |||
Upstream & Downstream Business Matchmaking | |||
10:00~17:00 | Business Matchmaking Session | ||
*议程持续更新中，请以现场实际为准
APSSE 2024部分参会企业名单
▲上下滑动
2024 亚太半导体峰会暨博览会(APSSE)
The 2024 Asia-Pacific Semiconductor Summit and Expo
遵循“合作、共赢”的宗旨，APSSE努力构建一座聚“芯”汇力、链接全球、共谋发展的桥梁。值中马建交50周年之际，APSSE以更积极主动、高效协同的角色助力企业融入全球半导体产业生态。首届亚太半导体峰会暨博览会（APSSE 2024）透过槟城举足轻重的全球产业地位，帮助更多半导体产业企业更好地链接全球产业资源。
大会将安排“展览展示+论坛演讲+商务考察”，参会/参展企业通过APSSE平台能够充分展示和获取行业新技术、新产品、新景象，与亚太地区乃至全球的同行们建立更紧密的联系与良好的互动。
诚邀全球半导体产业界的朋友们参加2024亚太半导体峰会暨博览会！10月16-18日，相约槟城、相约APSSE。
展览展示/论坛演讲联系方式：
甘女士（国内）
Tel: 86 21 61009329
Mobile:18512101608(WeChat)
Email: faith@cseac.org.cn
Anny Zhou （海外）
Tel: 86 21 61009295/96
Mobile: 18512101025(WeChat)
Email: annyzhou@cseac.org.cn
参会报名咨询：
卢女士 Mobile: 18616766579(WeChat)
Email: Service@Apsse.org.cn
媒体合作联络：
何女士 Mobile:18621703780(WeChat)
Email: yanying@cepem.com.cn
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