转自 中国微米纳米技术学会
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Pawel Keblinski received MS degree form Warsaw University in 1990 and PhD degree from Pennsylvania State University in 1995. After a postdoctoral appointments at Argonne National Laboratory and Forschungszentrum Karlsruhe he joined the faculty of Rensselaer Polytechnic Institute, Troy NY. He currently serves as the Materials Science and Engineering Department Head. His research relies mainly on the use of classical molecular dynamics simulations to study structure-property relationships in interfacial materials, with a focus on thermal transport modeling. His work to date resulted in over 200 publications in peer-reviewed journals and associated H-index of 77 (Google Scholar). He is a recipient of a National Science Foundation Career Award (USA), Humboldt Fellowship (Germany) and Marie Curie Fellowship (EU Commission/Poland). He is also a Fellow of the American Physical Society, and an Associated Editor of the Journal of Applied Physics. An interface between two materials poses a resistance to the heat flow, which is addition to the resistance of the bulk of the material. Consequently, materials with high density of interfaces, such as supperlattices, nanocrytalline materials, and nanocomposites, thermal conduction is controlled by interfaces and is far lower than that characterizing bulk materials.The simplest way of estimating thermal conductivity of such interfacial materials is to employ the resistors in series model. The key assumption of the resistors in series model is that each interface acts as an independent phonon scattering center. However, when the separation between interfaces is comparable or smaller than the phonon mean free path, such assumption is unjustified, as phonons can scatter coherently at multiple interfaces. This can manifests itself with strong interference effects exhibited by the phonon transmission coefficient.We will present results of molecular dynamics simulations on several interfacial structures, including organic-inorganic nanolaminates and multilayered graphene sandwiched between silicon crystal leads, that show that despite strong, multi-interface interference effects exhibited by individual phonons, the overall thermal transport can be well estimated by the resistor is series model. We will argue that the reason for unexpected applicability of the resistor in series model lies in the fact that the overall thermal transport characteristics represent a quantity integrated over all phonons, which effectively averages out over distinct interference effects exhibited by individual phonons.![]()
Prof. Rho is a Mu-Eun-Jae (无垠斋) Endowed Chair Professor and Young Distinguished Professor at Pohang University of Science and Technology (POSTECH), Korea, with a joint appointment in the Department of Chemical Engineering, the Department of Mechanical Engineering, and the Department of Electrical Engineering. He received his Ph.D. at the University of California, Berkeley (2013), M.S. at the University of Illinois, Urbana-Champaign (2008) and B.S. at Seoul National University, Korea (2007) all in Mechanical Engineering. Prof. Rho has authored and co-authored more than 300 high-impact journal papers including Science and Nature. He is also the recipients of several notable honors and awards such as US Department of Energy Argonne Named fellowship (2014), Korean Presidential Early Career Award for Scientists and Engineers (2019), Elsevier MEE/MNE Young Investigator Award and Lectureship (2020), Member of the Young Korean Academy of Science and Technology (Y-KAST) (2020), Associate Member of the National Academy of Engineering of Korea (NAEK) (2022), Fulbright Visiting Scholar Fellowship (2022), Northwestern Simpson Fellowship (2022), Northwestern Eshbach Fellowship (2023), Clarivate Highly Cited Researcher (2023). He serves 13 editorial positions including Light: Science and Applications (Springer-Nature), Microsystems and Nanoengineering (Springer-Nature), npj Nanophotonics (Springe-Nature) and Nanophotonics (De Gruyter).With the ever-increasing consciousness of the energy crisis and global warming issues, passive cooling methods that use free and renewable energy sources have been pursued recently [1-2]. Radiative cooling is an efficient passive cooling strategy that dissipates excessive heat to the universe through thermal radiation. In particular, all-day passive radiative cooling has offered an even larger spectrum of energy-saving applications by suppressing solar absorptivity under solar irradiation. In this talk, we present our recent research progress on all-day passive radiative cooling for practical applications as well as for improved cooling performance. Firstly, we discuss the inverse design of daytime radiative cooling for high performance [3]. The design of a selective multilayer emitter was optimized by a genetic algorithm, and we achieved highly suppressed solar absorption, thereby, high-performance radiative cooling under direct sunlight. We also discuss inverse design of colored daytime radiative coolers using deep neural networks. Methods for achieving on-demand color generation with high NIR reflectance are developed [4]. We then discuss the efforts to promote the implementation of radiative cooling for real-world applications. We first discuss the realization of all-day radiative cooling devices on a large scale to address practical issues [5-7]. By using silica-coated porous anodic aluminum oxide, we developed a centimeter-scale radiative cooling device demonstrating a maximum cooling of 6.1 °C below ambient during the daytime [5]. We also developed large-scale radiative cooling devices in particle mixture coating format [6]. By further analyzing the effect of each particle on radiative cooling performance, we report a large-scale paint-format radiative cooling device with high performance [7]. Such particle-based devices allow the use of facile one-step and cost-effective fabrication methods, providing the potential for large-scale production and applications. Finally, we present radiative cooling devices with practical functionalities, including transparency [8] switchability [9] and multifunctionalities. We discuss a transparent radiative cooling device that transmits visible light reflects near-infrared light and radiates thermal energy to lower the temperature during the daytime while maintaining transparency [8]. Such a transparent can be used for eco-friendly cooling windows in vehicles or buildings. We further discuss our recent development on visibly transparent radiative cooling windows specialized for enclosed space cooling using Janus emitters. We also developed a neutral-colored transparent radiative cooler that optimizes both visible transparency and solar reflection using a punctured Ag layer. Additionally, by exploiting the changeable material properties of vanadium dioxide in response to temperature, we achieved a temperature-adaptive radiative cooling device that radiates thermal energy only when the temperature is above the phase transition temperature [9]. Lastly, all-weather sustainable windows integrating triboelectric nanogenerator and transparent radiative cooler for both energy saving and harvesting as well as the transparency-enhanced radiative cooling devices are discussed [10,11].- [1]So, S. et al., Advanced Science, 2024, 11, 2305067.
- [2]Ko, B. et al. Energies, 2019, 12, 89.
- [3]So, S. et al., Nanophotonics, 2022, 11, 2107-2115.
- [4]Keawmuang, H. et al., Solar Energy Materials and Solar Cells, 2024, 271, 112848.
- [5]Lee, D. et al., Nano Energy, 2021, 79, 105426.
- [6]Chae, D. et al., ACS Applied Materials and Interfaces, 2021, 13, 21119-21126.
- [7]Yun, J. et al., ACS photonics, 2023, 11, 2608–2617.
- [8]Kim, M. et al., Advanced Optical Materials, 2021, 9, 2170047.
- [9]Kim, M. et al., Opto-Electronic Advances, 2021, 4, 200006.
- [10]Lee, G. et al., Nature Communications, 2024, 15, 6537.
- [11]Ko, B. et al., Advanced Functional Materials, 2024, 34, 2410613
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曹炳阳，清华大学航天航空学院教授，院长，国家杰青，国际先进材料学会、亚洲热科学联合会和美国工程科学学会Fellow。担任国际传热大会常务理事会理事、亚洲热科学与工程联合会副主席、中国航空教育学会常务理事、中国复合材料学会导热复合材料专业委员会副主任等学术职务。主要研究领域为微纳尺度传热和先进热管理技术，发表SCI学术论文200余篇，出版专著《纳米结构的非傅里叶导热》，担任ES Energy & Environment主编、International Journal of Thermal Sciences副主编和10多个国际期刊编委。
由于芯片制程尺寸的不断减少、集成密度的不断提高以及对算力和功率的更高要求，热管理正成为现代芯片系统进一步发展的瓶颈问题。本次报告涉及以下三方面内容：(1) 芯片近结热管理，包括芯片近结区自热效应及产热抑制、纳米导热的非傅里叶效应、热物性及扩展热阻优化设计；(2)界面热管理，包括半导体抑制结构界面热调控、液态金属相变热控和热界面材料等；(3)液体冷却技术，嵌入式微通道液冷和浸没式液冷技术要综合考虑降低流动阻力、提高传热系数、提高温度均匀性和半导体工艺兼容性等因素。
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Xin Qian is currently a professor of engineering thermophysics at Huazhong University of Science and Technology. He graduated from University of Colorado Boulder in 2019, and was a postdoctoral associate at MIT in NanoEngineering Group led by Gang Chen from 2019 to 2021. His research focuses on energy transport and conversion physics at nanoscale, including machine-learning-aided modeling of phonon and ion transport, thermoreflectance microscopy for thermal property of materials, and low-grade heat harvesting technologies. Xin Qian is currently the PI of NSFC project and NSFC awards for excellent young scholars (overseas), and a co-PI of National Key R&D Project. Modeling phonon dynamics is crucial for development of functional materials for thermal barrier coating, thermoelectric energy conversion, and thermal management. While the past decade has witnessed significant advancements in ab initio calculations and atomistic simulations for thermal conductivity prediction, complicated modeling tasks remains challenging, such as modeling transient thermal responses, studying high-order anharmonicity, and wavelike transport of phonons and so on. Here, we present API Phonons, a Python software package for predicting the transport dynamics of heat-carrying phonons. Using the powerful syntax of Python, this package provides modules and functions interfacing between different packages for atomistic simulations, lattice dynamics, and phonon-phonon interaction calculations including LAMMPS, Quippy, Phonopy, and ShengBTE. API Phonons have streamlined complex phonon calculations, including (1) extracting harmonic and anharmonic force constants from arbitrary interatomic potentials, which can be used as inputs for solving Boltzmann transport equations; (2) predicting thermal conductivity using Kubo’s linear response theory, which captures both quasiparticle transport and inter-band coherent transport; and (3) modeling of ultrafast pump-probe thermal responses using a Green’s function approach based on mode-resolved phonon properties for studying ballistic, hydrodynamic, and diffusive transport dynamics. The package provides a flexible, easy-to-use, and extensive platform for modeling phonon transport physics through Python programming.![]()
Rujun Ma is a professor in the School of Materials Science and Engineering of Nankai University, selected by the National Youth Thousand Talent Program. He has led many key projects of the National Key R&D Program of the Ministry of Science and Technology, the National Natural Science Foundation of China, and the key projects of the Tianjin Natural Science Foundation, etc. He graduated from the College of Nanotechnology, Sungkyunkwan University, South Korea, with a Ph.D. degree in February 2013, and then worked as a postdoctoral researcher in the School of Energy Science and the Institute of Basic Science of the same university. In April 2015, he joined Prof. Qibing Pei's group at UCLA as a postdoctoral researcher, and in September 2018, he joined the School of Materials Science and Engineering at Nankai University.His main research interests are flexible active/passive solid-state cooling materials and devices and multifunctional flexible thermoelectric materials and devices. In recent years, he has published in Science (2), PNAS, Nature Communications, Joule (2), Chemical Society Reviews, Energy & Environmental Science, Advanced Materials (4), Advanced Energy Materials (2), Nano Letters (7), ACS nano (2), etc. He has been authorized more than 10 patents in the United States, China, and South Korea, and has applied for 2 international patents.Traditional refrigeration equipment commonly uses environmentally polluting Freon and has low cooling efficiency. The current increasingly integrated electronic chips need more efficient cooling technology to extend their service life. A compact and portable solid-state refrigeration system with high cooling efficiency and performance parameters can provide effective heat dissipation for current wearable electronics and can be widely used. Whereas electrocaloric cooling with ferroelectric materials is an efficient and novel alternative to Freon. Here, we utilize a flexible ferroelectric electrocaloric polymer film and an electrostatic driving mechanism to enable effective heat transfer between the heat source and the heat sink. The use of reversible electrostatic force reduces the parasitic power consumption and enables effective heat transfer through instantaneous formation of good thermal contact between the polymer film and the heat source or heat sink. Electrocaloric effect refrigeration system performance factor exceeds existing vapor compression refrigeration technology. The high efficiency, non-polluting electro-thermal effect cooling device not only spans the performance of existing solid-state cooling technologies, but in the future it can be made into a very small cooler to be carried around in a pocket. Moreover, it can also effectively cool down cell phones, computers and wearable electronics to extend their service life.![]()
魏进家，西安交通大学化学工程与技术学院教授，国家杰出青年科学基金获得者。主要从事两相流与传热研究，担任国际传热传质中心理事、载人航天工程空间应用系统微重力流体物理与热物理领域科学工作委员会副首席。主持国家重点研发计划项目、国家自然科学基金重点项目等。已发表国际期刊论文300余篇，授权专利50余件，获省部级科技一等奖5项。
随着人工智能、电子信息与MEMS技术快速发展，国防、民用领域芯片及电子设备集成度不断提高，引发100~1000W/cm2量级的高热流密度散热难题。沸腾/蒸发相变传热利用液体巨大的汽化潜热实现热量转移，在高热流密度芯片散热领域极具应用前景。多年来，团队在沸腾/蒸发相变传热强化方面开展了大量基础研究，提出了一系列微米、纳米和微纳复合表面强化结构，在池沸腾、流动沸腾与毛细蒸发传热强化方面取得了显著效果，大幅提高了沸腾/蒸发传热极限和散热效率；基于沸腾/蒸发传热强化方法，研制了新型环路热管、大功率均温板、高性能三维热虹吸管、新型歧管式微通道散热器等被动与主动式散热器件，相关研究成果为高性能数据中心、5G基站、雷达等场合高热流密度芯片热管理难题提供了关键技术支撑。
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焦斌斌博士，中国科学院微电子研究所研究员，博士生导师，国家级科技人才，国家重点研发计划首席科学家，中国工程前沿杰出青年学者。国家重点研发计划领域专家，中国材料学会智能传感功能材料与器件分会常务委员，中国机械工程学会微纳制造技术分会委员，中国仪器仪表学会微纳器件与系统技术分会委员。常年从事微系统技术研究，累计发表SCI论文70余篇，获授权中国发明专利40余项，美国专利2项，获省部级科技进步一等奖、二等奖各1项。
集成电路随着工艺节点的不断缩小，其热问题日趋严重，而国内在工艺节点落后的情况下，芯片的热问题更加突出。本报告将介绍为何有限的芯片封装散热能力已大幅抑制芯片的计算性能，以及如何在先进封装技术中测试芯片的热分布及应力分布，并在最后分享中科院微电子所在新型芯片内嵌微流技术对于单芯片与多芯片阵列散热中的最新成果。
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Dr. Shenghong Ju received his B.S. degree from Nanjing University of Aeronautics and Astronautics in 2008, and he obtained his Ph.D. degree in Engineering Thermophysics from Tsinghua University in 2014. He conducted postdoctoral research in Ecole Centrale Paris and the University of Tokyo from 2014 to 2019. He is currently an associate professor in Shanghai Jiao Tong University. His research mainly focuses on the nanoscale thermal transport and AI-assisted thermal functional materials design.Exploring materials with ultra-high intrinsic thermal conductivity has wide applications in the fields of thermal design of electronic devices. The traditional trial-and-error style is inefficient and with high cost. In this work, we introduce three successful cases by combining the machine learning and thermal transport calculations: (1) The exploring diamond-like lattice thermal conductivity crystals via feature-based transfer learning, (2) The active design of ternary B-C-N crystals with ultra-high thermal conductivity via particle swarm optimization, (3) The designing of high thermal conductivity polymer monomers based on the high-throughput molecular dynamics simulations and interpretable machine learning. Those successful cases have shown great advantage of designing materials with ultimate thermal property via materials informatics.![]()
梁剑波，现任大阪公立大学副教授及博士生导师，主要专注于金刚石，氮化镓，碳化硅异质半导体材料的直接键合、高导热异质界面、异质界面的晶体结构以及大功率高效新型半导体器件的研发。近年来，在国际著名刊物如 "Adv. Mater."，"Nat. Com"，"Small"，"Appl. Phys. Lett"等发表了150余篇论文，同时拥有15项专利。在国际会议上，多次荣获了最佳发表奖，并获得南部阳一郎（诺贝尔物理学奖获得者）颁发的优秀研究奖和著名刊物优秀审稿奖等多个奖项。随着人工智能和5G通信技术的迅速普及，半导体器件的集成度和单位面积功率密度显著提升，导致器件发热量急剧增加。这种热量积聚会引发器件过热问题，从而影响性能稳定性并缩短器件使用寿命。因此，开发高效的散热方法已成为电子器件领域的重要研究方向。金刚石因其无与伦比的导热性（约2200 W/m·K）和机械强度，被认为是理想的散热材料，尤其适用于高功率和高频电子器件。在本研究中，我们创新性地开发了一种金刚石直接键合技术，旨在提高半导体器件的散热性能。通过将硅基板上生长的AlGaN/GaN/3C-SiC薄膜直接键合到金刚石基板上，形成AlGaN/GaN HEMTs/3C-SiC on diamond结构，我们成功实现了显著的散热改进。该配置相比于传统的GaN-on-4H-SiC和GaN-on-Si结构，展示出更优异的散热性能，其中3C-SiC/金刚石界面具有卓越的热稳定性和导热性。这种界面结合了金刚石的高导热特性和3C-SiC的优良热匹配性能，有助于减少界面热阻，增强器件的整体热传导效率。我们的研究不仅着眼于小尺寸实验，还正在推进将硅基板上生长的AlGaN/GaN/3C-SiC薄膜转移到大尺寸多晶金刚石基板上的技术开发，以实现低成本、高散热性能的GaN器件制造。此过程涉及对大面积金刚石的制备、应力控制及界面热管理的深入研究，以确保批量生产的可行性和性能一致性。此外，我们还致力于对界面结构和热边界阻力进行深入分析，借助实验和热传导模型模拟，揭示其对整体散热性能的影响机理。通过优化界面结晶度、粗糙度和缺陷密度，我们进一步提升了器件的热管理性能，确保其在高功率和高频运行下的稳定性和可靠性。此研究为下一代高功率电子器件提供了可靠的技术基础，有望推动高效散热技术的产业化应用，满足未来更高散热需求的电子技术发展。![]()
Te-Huan Liu is currently a Professor atHuazhong University of Science and Technology. He obtained his PhD at the Institute of Applied Mechanics of National Taiwan University in 2012. From 2015 to 2019, he worked as a postdoc in the MIT NanoEngineering Group supervised by Professor Gang Chen. He received the Overseas High-Level Talent Recruitment Programs (Young TTP) in 2019. His research focused on fundamental studies of energy transport and conversion at the nanoscale, with specific directions including (1) phonon-phonon and electron-phonon coupling and energy conversion in semiconductor chips/energy materials; (2) the application of neural network potential in thermal transport in solids; (3) ionic and heat transfer phenomena in solid-state electrolyte systems. He is one of the main developers of the EPW-nano computational software. He has published more than 50 papers in SCI journals, including PNAS, Adv. Mater., InfoMat, and Angew. Chem., with 4 papers recognized as highly cited by ESI.The virtual crystal approximation (VCA) is an effective method for simplifying binary alloy systems by treating the randomly distributed alloy atoms as uniformly distributed virtual atoms, where the properties of the virtual atoms are determined by the linear average of the given alloy composition. This approach can account for the scattering of energy carriers (phonons, electrons, and holes) caused by local disturbances in the lattice arising from alloy atoms, enabling predictions of phonon and electron transport properties. Based on the VCA and first-principles calculations, this study systematically investigates the electron-alloy and phonon-alloy interactions in ZrNiSn1-xPbx alloys and their impact on thermoelectric transport properties. We generate the pseudopotentials for the virtual atoms based on the alloy composition ratios of Sn and Pb, and calculate the electronic band structure, alloy perturbation potential, and scattering rates for the ZrNiSn1-xPbx virtual crystals. By solving the Boltzmann transport equation with the electron-phonon scattering rates, we obtain key thermoelectric parameters, including electrical conductivity, Seebeck coefficient, and thermal conductivity, for different ZrNiSn1-xPbx alloys at varying temperatures and carrier concentrations. These results demonstrate the non-monotonic decrease in electrical and thermal conductivities due to alloy scattering with changes in alloy composition. They also explain why alloy scattering tends to limit electron transport more than phonon transport. By comparing with the results for Ti1-xZrxNiSn alloys, we find that using Pb and Sn as alloying elements helps maintain the electron transport channels of conduction electrons, thereby reducing the degradation of electrical conductivity and improving the thermoelectric figure of merit. These findings provide theoretical insights for optimizing the thermoelectric performance and offer a first-principles-based computational approach for the quantitative analysis of phonon and electron transport properties in alloy semiconductors.
（一）欢迎登录mTT2024官方网站：http://mtt2024.csmnt.org.cn 注册参会。
1.会议官网注册登录—参会个人中心—报名参会—选择参会类别/支付方式—办理交费—在线开票—注册成功；
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备注：会议注册费包含会议费、会议用餐及茶歇、会议资料袋等项目。
mTT2024会务组联系方式：
【学会会员】张倩倩：18811456626
