宁德魁，谢明*，陈永泰，马洪伟，段云昭，虞 坤，李爱坤，易文彬
(云南贵金属实验室有限公司，昆明 650106)
关键词：银铜复合带材；显微组织；力学性能；电性能
中图分类号：TG146.3
文献标识码：A
文章编号：1004-0676(2024)03-0067-07
摘 要：本文通过复合坯料结构设计优化以及在复合界面涂覆有机助剂，有效促进复合界面牢固结合，采用保护气氛烧结和冷轧联合工艺制备了Ag/Cu侧向复合带材，并对相关性能进行了测试分析。结果表明：Ag/Cu侧向复合带材银铜交替平行分布，不同银条宽度均匀，且在长度方向尺寸均匀性好，无腰鼓、腊肠等现象。复合界面呈犬牙交错的界面形貌，同时形成了30~50 μm银铜两相共晶界面层，产生了冶金结合，界面结合牢固。复合界面剪切强度大于218 MPa，复合银条保持了高电导率，电导为58~60 MS/m。
Abstract: In this paper, by optimizing the structure of composite billet and coating organic additives on the composite interface, the bonding of composite interface was effectively promoted. The Ag/Cu lateral composite strip was successfully prepared by the combined process of sintering in protective atmosphere and cold rolling, and the related properties were tested and analyzed. The results show that Ag/Cu lateral composite strip is distributed alternately and parallel, and the width of different Ag strips is uniform, and the dimension uniformity is good in the length direction, without waist drum and sausage phenomenon. At the same time, the 30~50 μm Ag-Cu two-phase eutectic interface layer was formed, which resulted in metallurgical bonding. The shear strength of the composite interface is greater than 230 MPa, and the composite silver bar maintains a high conductivity of 58~60 MS/m.
