首届亚太半导体峰会暨博览会（APSSE 2024）将于2024年10月16日-18日在马来西亚槟城举行。
2024年APSSE以“汇聚槟城，芯动亚太”为主题，邀请集成电路行业领军人物、专家学者、企业家、半导体协会及高校等产业精英汇聚槟城，共同展望半导体产业的未来发展趋势，共话产业的创新与合作。
大会将进行主题报告、圆桌讨论、技术交流、商贸配对等活动，围绕集成电路及半导体器件产业、TFT面板产业、光伏及储能产业、LED技术等议题展开。
大会议程
APSSE 2024 Agenda
Day 1: 16 Oct. 2024
2024年10月16日
08:00 – 08:55 Registration | |||
Opening Ceremony | |||
09:00~09:10 | Welcoming Ceremony | ||
09:15~09:25 | DSW, President of MSIA | ||
09:30~09:40 | YAB, Chief Minister of Penang | ||
09:45~09:50 | Opening Launching | ||
09:55~10:30 | Tea Break | ||
Plenary Session: Global Semiconductor Growth | |||
10:30~11:30 | Topic 1: Global Semiconductor Outlook The Semiconductor Surge: A Global Perspective on the Industry’s Evolution and Pathways Keynote Speech by David Wang Moderator: Andrew Chan Secretary General, MSIA | ||
Dato Seri Wong, President, MSIA | |||
Dr. David Wang, Chairman, ACM Research Inc | |||
Nancy Greco, Global Distribution Sales Leader, IBM | |||
Shivaji Das, Managing Director, APAC & Partner, Frost & Sullivan | |||
Dr. Yeong Che Fai, CEO, DF Automation & Robotics Sdn Bhd | |||
Representative, TONGFU | |||
11:30~12:30 | Topic 2: Transitioning from Local to International Outbound Investments From Local Roots to Global Giants: Navigating the Complexities of International Investment Expansion Moderator:CJ Li,Executive Vice General Manager, Hanglingwei(Taizhou)Technology Co., Ltd | ||
Dato’ Loo Lee Lian, CEO, Invest Penang | |||
Kevin Khoo, Group COO, UNISEM Berhad | |||
John Lai Vice President, Carsem Semiconductor (Suzhou) Co., Ltd (Tentative) | |||
Yap Chi Hui, Chairman of MAYCHAM Shanghai Branch | |||
Tan Wei Xian, Partner, Skrine & Co. | |||
12:30~14:00 | Lunch Break | ||
Plenary Session: Sustainability & ESG | |||
14:30~16:00 | Topic 3: Advancing ESG through Innovations Could Businesses Collaboration Drive Innovations in ESG Sustainability? Keynote Speech by Mr Ma Weihua Moderator: Kok Chew Chin Director, CIMB | ||
Sachin Gupta, APAC Sustainability Leader, IBM | |||
Dato Png Soo Hong，Cradle Fund | |||
Ma Weihua Chairman, National Fund for Technology Transfer & Commercialization & Member of UNDP SDG lmpact Steering | |||
Arina Kok, CCASS Leader, EY Malaysia | |||
Plenary Session: Sustainability & ESG | ||
16:00~17:00 | Topic 4: Asia Pacific Semiconductor Strategies Unleashing Potential: How Asia Pacific is Shaping the Future of Semiconductor Innovation Moderator: Andrew Chan Secretary General, MSIA | |
Dato' KL Bock, Vice President, Western Digital | ||
Dato WK Foong, Managing Director, JF Technology Berhad | ||
Ang Wee Seng, Chairman, Singapore Semiconductor Industry Association (SSIA) | ||
Danny Chan, Director of TMT Sector, CIMB | ||
Desmond Hor, Deputy General Manager, Jiangsu Leadlap Semiconductor Technology Co., Ltd | ||
17:00~19:00 | Cocktail Networking | |
19:00~22:00 | Gala Dinner | |
Day 2: 17 Oct. 2024
2024年10月17日
08:00 – 08:55 Registration | |||
Technical Track: Smart Initiatives | |||
09:00~10:15 | Topic 5: Artificial Intelligence AI's Transformative Power: How Artificial Intelligence is Set to Revolutionize Our Lives Moderator: Jack Xu CEO, Soterea Technology Ltd | ||
Gavin Ni, Vice President,Cloud Business Development, Huawei | |||
Dr. Eric Chiang, GM, Baidu Paddle Strategic Investment Center & Adjunct Professor, Hong Kong City University | |||
Dr. James Ong Founder, Artificial Intelligence International Institute | |||
Matthias Meienhofer, CPE Partner Sales Manager, DS Singapore | |||
See Chin Liang, Director of software Engineering | |||
StarFive Technology Int. Sdn Bhd. | |||
Representative IBM | |||
10:20~10.45 | Tea Break | ||
10:45~12:00 | Topic 6: Intellectual Property How to Remain Tomorrow’s Sustainability with Yesterday’s IP Technology? Moderator: Kok Chew Chin Director, CIMB | ||
Andy Goh, Vice President, JF Technology Berhad | |||
Pauline Khor, Partner, Rahmat Lim & Partners | |||
Patricia Chung, Founder, Chung Chambers | |||
Cecilia Lou, Partner, King&Wood China & Hong Kong | |||
12:00~13:30 | Lunch Break | ||
Technical Track: Semiconductor Development | |||
14:00~15:00 | Topic 7: Advanced Packaging The Next Frontier in Semiconductor Packaging: Exploring the Innovations Shaping Technologies Moderator: Dr Eu of NXP Group | ||
Dr. E. Jan Vardaman, President, TechSearch. Inc. | |||
Dr. YY Tan, Senior Technology & Market Analyst, YOLE Group | |||
Dr. Linus Lau, Director, RF Station Sdn Bhd | |||
Zhaowei Jia, Vice President, ACM Research (Shanghai) | |||
Lincoln Lee, PAC RIM VICE PRESIDENT Technical AE, SIEMENS EDA | |||
15:00~15:15 | Tea Break | ||
15:15 – 16:30 | Topic 8 Strategies for STEM Talent Development Empowering Tomorrow's Innovators: Strategic Approaches to Cultivate the Next Generation of STEM Talent Moderator: Andrew Chan Secretary General, MSIA | ||
Dr. Koay, Academic Head, Vitrox College | |||
SK Fong, CEO, SkyeChip | |||
Low Choy Huat, Partner, EY Malaysia | |||
Sara Lau Partner, Skrine & Co | |||
Louis Looi Managing Director, Fairwork Malaysia (Tentative) | |||
Baddie Abdullah, Principal(Talent), TalentCorp Malaysia Bhd | |||
Upstream & Downstream Business Matchmaking | |||
10:00~17:00 | Business Matchmaking Session | ||
*议程持续更新中，请以现场实际为准
APSSE 2024 部分参会企业名单
2024 亚太半导体峰会暨博览会(APSSE)
The 2024 Asia-Pacific Semiconductor Summit and Expo
遵循“合作、共赢”的宗旨，APSSE努力构建一座聚“芯”汇力、链接全球、共谋发展的桥梁。值中马建交50周年之际，APSSE以更积极主动、高效协同的角色助力企业融入全球半导体产业生态。首届亚太半导体峰会暨博览会（APSSE 2024）透过槟城举足轻重的全球产业地位，帮助更多半导体产业企业更好地链接全球产业资源。
大会将安排“展览展示+论坛演讲+商务考察”，参会/参展企业通过APSSE平台能够充分展示和获取行业新技术、新产品、新景象，与亚太地区乃至全球的同行们建立更紧密的联系与良好的互动。
